Ultra-Fine Particles: Exploratory Science and Technology (Materials Science and Process Technology Series)

468 Pages·1996·21.17 MB·English

by  Tyozi Uyeda

ULTRA-FINE PARTICLES
Exploratory Science and Technology
Edited by
Chikara Hayashi
ULVAC Japan Ltd.
RyoziUyeda
Nagoya University, Japan
Akira Tasaki
University ofTsukuba, Japan
NOYES PUBLICATIONS
Westwood, NewJersey, U.S.A.

Copyright© 1997byNoyesPublications
Nopartofthisbookmaybereproducedorutilized
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withoutpermissioninwritingfromthePublisher.
LibraryofCongressCatalogCardNumber:96-12584
ISBN: 0-8155·1404-2
PrintedintheUnitedStates
PublishedintheUnitedStatesofAmericaby
NoyesPublications
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LibraryofCongressCataloging-in-PublicationData
Ultra-fineparticles:exploratoryscienceandtechnology/editedby
ChikaraHayashi, R. Uyeda,A. Tasaki.
p. em.
Includesbibliographicalreferencesandindex.
ISBN0-8155-1404-2
1.Nanoparticles. 2. Nanostructurematerials. 1. Hayashi,
Chikara. II. Uyeda,Ryozi. III. Tasaki, A.
TA418.78.UI5 1996
620'.43--dc20 96-12584
CIP
MATERIALS SCIENCEAND PROCESS TECHNOLOGYSERIES
Series Editors
Rointan F. Bunshah, University ofCalifornia, LosAngeles
GaryE. McGuire, Microelectronics CenterofNorth Carolina
Stephen M. Rossnagel, IBM ThomasJ. Watson Research Center
Electronic Materials and Process Technology
HANDBOOKOFDEPOSITIONTECHNOLOGIESFORFILMSANDCOATINGS, Second
Edition: edited byRointan F. Bunshah
CHEMICALVAPOR DEPOSITION FOR MICROELECTRONICS: by Arthur Sherman
SEMICONDUCTOR MATERIALS AND PROCESS TECHNOLOGY HANDBOOK: edited
byGaryE. McGuire
HYBRID MICROCIRCUITTECHNOLOGY HANDBOOK: byJames J. Licariand Leonard
R. Enlow
HANDBOOKOFTHIN FILM DEPOSITION PROCESSESAND TECHNIQUES:edited by
Klaus K. Schuegraf
IONIZED-CLUSTER BEAM DEPOSITION AND EPITAXY: by Toshinori Takagi
DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS:
edited byDevendra Gupta and Paul S. Ho
HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS: edited by
Donald L. Tolliver
HANDBOOKOFIONBEAM PROCESSINGTECHNOLOGY:editedbyJeromeJ. Cuomo,
Stephen M. Rossnagel, and Harold R. Kaufman
CHARACTERIZATIONOFSEMICONDUCTORMATERIALS,Volume1:editedbyGaryE.
McGuire
HANDBOOKOFPLASMAPROCESSINGTECHNOLOGY:editedbyStephenM.Rossnagel,
JeromeJ. Cuomo, and William D. Westwood
HANDBOOK OF SEMICONDUCTOR SILICON TECHNOLOGY: edited by William C.
O'Mara, Robert B. Herring, and Lee P. Hunt
HANDBOOK OF POLYMER COATINGS FOR ELECTRONICS, 2nd Edition: by James
Licari and LauraA. Hughes
HANDBOOKOFSPUTTERDEPOSITIONTECHNOLOGY:byKiyotakaWasaandShigeru
Hayakawa
HANDBOOKOFVLSIMICROLITHOGRAPHY:editedbyWilliamB. GlendinningandJohn
N. Helbert
CHEMISTRYOF SUPERCONDUCTOR MATERIALS: edited byTerrell A. Vanderah
CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND TUNGSTEN SII-ICIDES: by
JohnE. J. Schmitz
ELECTROCHEMISTRY OF SEMICONDUCTORS AND ELECTRONICS: edited byJohn
McHardyand Frank Ludwig
HANDBOOKOF CHEMICALVAPOR DEPOSITION: by Hugh O. Pierson
v
Series
DIAMOND FILMSAND COATINGS:editedby Robert F. Davis
ELECTRODEPOSITION: byJackW. Dinl
HANDBOOK OF SEMICONDUCTOR WAFER CLEANING TECHNOLOGY: edited by
Werner Kern
CONTACTS TO SEMICONDUCTORS: edited by Leonard J. Brillson
HANDBOOKOFMULTILEVELMETALLIZATIONFOR INTEGRATEDCIRCUITS:edited
bySyd R.Wilson, ClarenceJ.Tracy, and John L. Freeman, Jr.
HANDBOOKOF CARBON, GRAPHITE, DIAMONDS AND FULLERENES: by Hugh O.
Pierson
MOLECULAR BEAM EPITAXY: editedbyRobin F. C. Farrow
HANDBOOK OF COMPOUND SEMICONDUCTORS: edited by Paul H. Holloway and
GaryE. McGuire
HANDBOOKOFVACUUMARC SCIENCEAND TECHNOLOGY: edited byRaymond L.
Boxman, PhilipJ. Martin, and David M. Sanders
HIGH DENSITY PLASMASOURCES: edited byOleg A. Popov
DIAMOND CHEMICALVAPOR DEPOSITION: byHuimin Liuand David S. Dandy
HANDBOOK OF MAGNETO-OPTICAL DATA RECORDING: edited by Terry McDaniel
and Randall H. Victora
HANDBOOKOF REFRACTORYCARBIDESAND NITRIDES: by Hugh O. Pierson
ULTRA-FINE PARTICLES: edited byChikara Hayashi, R. Ueda and A. Tasaki
Ceramic and Other Materials-Processing and Technology
SOL-GEL TECHNOLOGY FOR THIN FILMS, FIBERS, PREFORMS, ELECTRONICS
AND SPECIALTYSHAPES: edited byLisa C. Klein
FIBER REINFORCED CERAMIC COMPOSITES: edited by K. S. Mazdiyasni
ADVANCED CERAMICPROCESSINGANDTECHNOLOGY,Volume1:editedbyJonG.
P. Binner
FRICTION ANDWEAR TRANSITIONS OFMATERIALS: by PeterJ. Blau
SHOCKWAVES FOR INDUSTRIALAPPLICATIONS: edited by Lawrence E. Murr
SPECIAL MELTINGAND PROCESSING TECHNOLOGIES: edited byG. K. Bhat
CORROSION OF GLASS, CERAMICS AND CERAMIC SUPERCONDUCTORS: edited
byDavid E. Clarkand Bruce K. Zoitos
HANDBOOKOFINDUSTRIALREFRACTORIESTECHNOLOGY:byStephenC.Carniglia
and Gordon L. Barna
CERAMIC FILMSAND COATINGS: edited byJohn B. Wachtman and Richard A. Haber
CERAMIC CUTTINGTOOLS: editedby E. DowWhitney
Related Titles
CODE COMPLIANCE FOR ADVANCED TECHNOLOGY FACILITIES: by William R.
Acorn
SEMICONDUCTOR INDUSTRIAL HYGIENE HANDBOOK: byMichael E. Williams and
David G. Baldwin
Acknowledgment
This book is a translated and revised edition ofthe book
"UltraFine Particles" published in Japanese. Dr. Robert Lewis at
the Tsukuba Research Consortium corrected and did the prelimi
nary editing ofthe entire manuscript and Professor Kanji Ono at
International Christian University and University ofCalifornia at
Los Angeles provided the first translation into English. The Mita
publishinghousegraciouslygavetheauthorsthefreedomtoenable
theEnglisheditiontobeavailablefor publication. Ms. ReikoOhya
supplied most ofthe clerical service. The authors wish to express
their sincere appreciation to them.
Our many thanks also to Professor Rointan Bunshah and
Mr. George Narita for their patience and continued interest in
"Ultra Fine Particles."
vii
Contributors
GenyaChiba Sumio lijima
Research Development Corporation NEC Corporation
ofJapan Tsukuba, Ibaraki, Japan
Kawaguchi, Saitama, Japan
Kazuharu Iwasaki
Eiji Fuchita RMECompany
Vacuum Metallurgical Co., Ltd. Tagajo, Miyagi, Japan
Sanbu-gun, Chiba, Japan
Akira Johgo
ChikaraHayashi Applied Materials Japan, Inc.
ULVAC Japan Ltd. Sinjuku-ku, Tokyo, Japan
Chigasaki, Kanagawa, Japan
Hideo Kakuta
ToyoharuHayashi PlantEcochemicalsResearchCenter
Mitsui Toatsu Chemicals, Inc. Eniwa, Hokkaido, Japan
Yokohama, Kanagawa, Japan
Seiichiro Kashu
TsukasaHirayama Vacuum Metallurgical Co., Ltd.
Japan Fine Ceramics Center Sanbu-gun, Chiba, Japan
Nagoya, Aichi, Japan
Akio Kato
Toshinari Ichihashi Kyushu University
NEC Corporation Fukuoka,Fukuoka,Japan
Tsukuba, Ibaraki, Japan
viii
Contributors
Michiko Kusunoki Akira Tasaki
JapanFineCeramics Center InstituteofApplied Physics
~agoya,AUchi, Japan UniversityofTsukuba
Tsukuba, Ibaraki, Japan
Takeshi Manabe
TeisanK.K. Hideki Toyotama
Tsukuba, Ibaraki, Japan StanleyElectric Co., Lid.
Tsukuba, Ibaraki, Japan
Tadashi Matsunaga
TokyoUniversityofAgricultureand Shunichi Tsuge
Technology Tsukuba, Ibaraki, Japan
Koganei, Tokyo, Japan
Akifumi Ueno
Hiroshi Miyamoto Shizuoka University
CellularBiophysics Laboratory Hamamatsu, Shizuoka, Japan
~ationalInstituteofBioscience&
HumanTechnology Shizuo Umemura
Tsukuba, Ibaraki, Japan MiyanodaiTechnologyDevelopment
Center
Iku Nemoto Fuji PhotoFilm Co., Ltd.
TokyoDenki University Ashigarakami-gun, Kanagawa,
Hatoyama, Saitama, Japan Japan
Masaaki Oda Ryozi Uyeda
VacuumMetallurgical Co., Ltd. Nagoya University
Sanbu-gun, Chiba, Japan Nagoya, Aichi, Japan
Norio Saegusa Nobuhiko Wada
Surnitomo3MLtd. Nagoya University
Setagaya-ku, Tokyo, Japan Nagoya, AUchi, Japan
Yasukazu Saito Toyonobu Yoshida
ScienceUniversity ofTokyo TheUniversity ofTokyo
Shinjuku-ku, Tokyo, Japan Bunkyo-ku' Tokyo, Japan
Shigetoshi Takahashi Akinori Yoshizawa
Nisshin, Aichi, Japan YoshizawaIndustry Inc.
~agaoka, Niigata, Japan
ix