Transducers ’01 Eurosensors XV: The 11th International Conference on Solid-State Sensors and Actuators June 10 – 14, 2001 Munich, Germany

1763 Pages·2001·2.15 MB·English

by  Prof. Dr.-Ing. Ernst Obermeier (eds.)

TRANSDUCERS '01
EUROSENSORS XV
The 11th International Conference on Solid-State Sensors and Actuators
June 10 - 14,2001
Munieh, Germany
"'-'
DIGEST OF TECHNICAI. PAPERS - VOI.UME 1
Sessions 1A l - 203 TRANSDUCERS '01
xv
EUROSENSORS
Papers 1A 1.01 - 203.09P
pp. 1 - 880
Springer
Editor
Prof. Dr.-Ing. Ernst Obermeier
Berlin University of Technology
Department of Electrica! Engineering & Computer Science
Microsensor & Actuator Technology
Secr. TIB 3.1
Gustav-Meyer-Allee 25
D-13355 Berlin
Germany
e-mail: [email protected] http://mat.ee.TU-Berlin.de
Cip Data applied for
Die Deutsche Bibliothek-CIP-Einheitsaufnahme
Transducers 'O 1 Eurosensors XV: The 11 th International Conference on Solid-State Sensors and Actuators
June 10 - 14,2001, Munich, Germany 1 Ernst Obermeier (ed.).- Berlin; Heidelberg; New York; Barcelona;
Hong Kong ; London ; Milan ; Paris ; Singapore ; Tokyo : Springer 2001
ISBN 978-3-540-42150-4 ISBN 978-3-642-59497-7 (eBook)
DOI 10.1007/978-3-642-59497-7
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Urspriinglich erschienen bei Springer-Verlag Berlin Heidelberg New York 2001
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WEL..COHE
We are pleased to welcome you to Munich for the On Wednesday evening the Conference Dinner will be
11th Internationa I Conference on Solid-State Sensors held at the famous Löwenbräu Keller, featuring Bavarian
and Actuators. We are meeting in Europe for the first music and special entertainment. The Spouse and Guest
time in the new millennium and on the twentieth Program includes a City Sightseeing Tour, an exciting
anniversary year of the first meeting. The conference series of cultural events, and a post-conference tour to
began in Boston in 1981, followed by meetings every the King Ludwig 11 Musical and the enchanting
other year in Delft, Philadelphia, Tokyo, Montreux, San Neuschwanstein castle.
Francisco, Yokohama, Stockholm, Chicago, Sendai, and
now Munich. This series of meetings, the premier confer On behalf of the International Steering Committee on
ence in its field, has since its beginning been the leading Solid-State Sensors and Actuators, and the Eurosensors
forum for reporting the latest research and developments International Steering Committee, we would like to thank
in sensors, microactuators, MEMS and microsystems. the 53 members of the three Regional Technical Program
These past conferences have established a very high Committees headed by Hermann Sandmaier (Europe),
standard of excellence that have guided the planning for Khalil Najafi (North America), and Susumu Sugiyama
this conference. As in previous years when it was held in (Asia) for their excellent work in reviewing more than
Europe, the conference is taking place in conjunction 850 submitted abstracts from 43 countries.
with the Eurosensors Conference, the most important We also wish to express our sincere thanks to the
European conference on solid-state transducers. members of the Executive Program Committee, including
the Regional Program Chairmen and five Topic Specialists
The technical program of the conference consists of four (M. Koudelka-Hep, R. Popovic, A. van den Berg,
days offormal presentations including an opening Plenary G. Wachutka, and R. Wolffenbuttel) for the outstanding
Session, twelve invited papers interspersed throughout job they have done in finalizing the Technical Program.
the technical sessions, nearly 200 contributed oral papers The members of the Local Organizing Committee, headed
in four parallel sessions, and two poster sessions featuring by Karl Kühl, also deserve much recognition for their
over 200 poster papers. In recognition of the 20th anni efforts and services contributing to the conference.
versary of the conference, Richard S. Muller of UC
Berkeley will be giving a special plenary address entitled We would also like to take this opportunity to thank all
"MEMS-The View Back ... and the Vistas Ahead': of the many authors who submitted their latest work to
this conference. Sincere appreciation is also given to the
The Digest of Technical Papers consists of two volumes plenary and other invited speakers.
and contains all oral and poster papers in four-page format.
It is also available on CD-ROM. The Digest will be avail We are particularly grateful to our sponsors and exhibitors
able for purchase after the conference through Springer for their financial contributions.
Verlag Berlin Heidelberg New York, www.springer.de
Finally we would like to personally thank you for attending
As in previous meetings an exciting social program has the conference. The outstanding program of this meeting
been planned. A Welcome Reception on Sunday evening is designed to keep you up-to-date on the most recent
and a Monday Evening Reception at the world-famous advances in sensors, microactuators, MEMS and
Deutsches Museum will provide am pie opportun ity to microsystems. We hope you will find the meeting exciting,
interact informally while enjoying the historical setting. inspiring, and enjoyable.
Ernst Obermeier Helmut Seidel
General Chairman Technical Program Chairman
Conference Site:
Gasteig Cultural, Educational and
Conference Center, Munieh, Germany
At the program committee meeting for
TRANSDUCERS '01 I EUROSENSORS XV
Standing (left to right)
Ernst Obermeier, General Chairman
Khalil Najafi, North American Chairman
Herman Sandmaier, European Chairman
Seated (left to right)
Susumu Sugiyama, Asian Chairman
Helmut Seidel, Technical Program
Chairman
SPONSORS AND EXHIBITORS
Sponsors
a
AESCULAP AG Co. KG, Germany
Robert Bosch GmbH, Germany
DaimlerChrysler AG, Germany
Deutsche Forschungsgemeinschaft, Germany
EADS Deutschland GmbH, Germany
Elsevier Science, The Netherlands
EUROPRACTICE, France
Fraunhofer IMS München, Germany
First Sensor Technology, Germany
GEFRAN S.P.A., Italy
HL-Planartechnik GmbH, Germany
Infineon Technology AG, Germany
Institute of Physics Publishing, United Kingdom
KELLER AG, Switzerland
Kistler Instrumente AG, Switzerland
MEMS Industry Group, USA
Regierung von Oberbayern, Germany
SCHMIDT Feintechnik GmbH, Germany
Springer Verlag Heidelberg, Germany
TEMIC, Germany
TU Berlin, MAT, Germany
Technical Co-Sponsoring
IEEE Electron Devices Society
Exhibitors
ARTECH HOUSE
Coventor GmbH
Elsevier Science
EUROPRACTICE
EV Group E. Thallner GmbH
First Sensor Technology GmbH
I EEE Sensors Journa I
,.,-1
Institute of Physics Publishing
IntelliSense Corporation
Kluwer Academic Publishers
MEMSCAP GmbH
TRAt-tSDUCERS '01
microFAB Bremen GmbH EUROSENSORS xv
Springer Verlag Heidelberg
Süss MicroTec AG
a
John Wiley Sons
CONFERENCE COHHITTEES L. Lin, UC Berkeley, USA
C. Nguyen, University of Michigan, USA
General Conference Chairman
A. Northrup, Cepheid, USA
Ernst Obermeier, Berlin Univ. ofTechnology, Germany A. J. Ricco, ACLARA Biosciences Inc., USA
M. Schmidt, MIT, USA
Technical Program Committee T. Tang, Jet Propulsion Laboratory, USA
Technical Program Chairman N. C. Tien, UC Davis, USA
Helmut Seidel, TEMIC, Germany J. White, MIT, USA
J. J. Yao, RockweIl Science Center, USA
Executive Program Committee
H. Seidel, TEMIC, Technical Program Chairman Asian Program Committee
H. Sandmaier, HSG-IMIT, European Chairman S. Sugiyama, Ritsumeikan University, Japan (Chairman)
K. Najafi, University of Michigan, N. American Chairman S. Ando, The University ofTokyo, Japan
S. Sugiyama, Ritsumeikan University, Asian Chairman Y. Cheng, SRRC, Taiwan
E. Obermeier, Berlin Univ. ofTechnology, General Chairman M. Esashi, Tohoku University, Japan
M. Koudelka-Hep, University of Neuchatel, Topic Specialist H. Fujita, The University of Tokyo, Japan
R. Popovic, EPFL Inst. de Microtechnique, Topic Specialist A. Kohno, Hitachi, Japan
A. van den Berg, University of Twente, Topic Specialist H. Kuwano, ND. Japan
G. Wachutka, Munich Univ. ofTechnology, Topic Specialist S. Lee, SAIT, Korea
R. Wolffenbuttel, Delft Univ. ofTechnology, Topic Specialist N. Miura, Kyushu University, Japan
M. Okuyama, Osaka University, Japan
European Program Committee I. Satoh, Kanagawa Institute of Technology, Japan
H. Sandmaier, HSG-IMT, Germany (Chairman) H.-D. Seo, Yeungnam University, Korea
A. D' Amico, University of Rome, Italy B.-K. Sohn, Kyungpook National University, Korea
Y. Bäcklund, Mälardanen University, Sweden Y. Sugiyama, AIST/MITI, Japan
S. Bouwstra, Coventor Inc., The Netherlands K. Suzuki, NEC, Japan
G. Delapierre, CEA-Grenoble, France H. Tadano, Toyota Inc., Japan
J. Gardner, The University of Warwick, United Kingdom Y. Wang, Chinese Academy of Sciences, P. R. China
R.s. Jachowicz, Warsaw University ofTechnology, Poland W. Wlodarski, RMIT University, Australia
M. Koudelka-Hep, Univ. of Neuchchatel, Switzerland
J. Marek, Robert Bosch GmbH, Germany Advisory Committee
J.R. Morante, University of Barcelona, Spain J. Berger, VDINDE-Technologiezentrum, Teltow
E. Obermeier, Berlin Univ. ofTech., Germany (ex-officio) S. Büttgenbach, TU Braunschweig, GMM
P. Ohlckers, 54.7 as, Norway W. Ehrfeld, Institut für Mikrotechnik, Mainz
R. Popovic, EPFL Inst. de Microtechnique, Switzerland A. Engelhardt. TEMIC, Nürnberg
R. Puers, Katholieke Universiteit Leuven, Belgium C. Hierold, Infineon Technology, München
T. Ryhänen, Nokia Research Center, Fin land J. Marek, Robert Bosch, Reutlingen
H. Seidel, TEMIC, Germany (ex-officio) H. Meixner, Siemens, München
G. Stemme, Royal Institut ofTechnology, Sweden H. Reichl, IZM, Fraunhofer-Gesellschaft, München
A. van den Berg, University of Twente, The Netherlands V. Saile, Forschungszentrum Karlsruhe, Karlsruhe
G. Wachutka, Munich University ofTechnology, Germany H.-R. Tränkler, Universität der Bundeswehr München,
R. Wolffenbuttel, Delft Univ. ofTech., The Netherlands AMA Wissenschaftsrat
R. Voss, DaimlerChrysler, Detroit, USA
North American Program Committee
K. Najafi, University of Michigan, USA (Chairman) Local Organizing Committee
S. Brown, Exponent Inc., USA K. Kühl, IMS, Munich (Chairman)
B. Frazier, Georgia Institute of Technology, USA K. Bauer, EADS Germany, Munich
J. R. Gilbert, Coventor Inc., USA R. Jehring, Berlin University ofTe chnology
J. Harrison, Un iversity of Alberta, Canada E. Obermeier, Berlin University ofTechnology
R. T. Howe, UC Berkeley, USA M. Rose, TEMIC, Munich
T. Kenny, Stanford University, USA H. Seidel, TEMIC, Munich
C.-J. Kim, UCLA, USA H. Steffes, Berlin University of Technology
E. Thielicke, Berlin University of Technology
Publications Conference Secretariat
K. Bauer, EADS Germany, Munich CSM
Industriestr. 35
Short Courses
D-82154 Gröbenzelll Munich
G. Wachutka, Munich University of Technology
Germany
Spouses Program
C. Schröttenhammer, CSM
International Steering Committee on Solid
State Sensors and Actuators
Ernst Obermeier, Chairman (Berlin Univ. ofTech., Germany)
Masayoshi Esashi, Vice-Chairman (Tohoku Univ., Japan)
European Members
Henry Baltes (ETH, Switzerland), John Brignell (Univ. of
Southampton, United Kingdom). Gilles Delapierre (LETI,
France). Per Ohlckers (54.7as, Norway), Juan R. Morante
(Univ. of Barcelona, Spain). Ernst Obermeier (Berlin Univ.
ofTechnology, Germany), Piet Bergveld (Univ. of Twente,
The Netherlands), Jan -A. Schweitz (Uppsala Univ., Sweden)
North American Members
Shih-Chia Chang (General Motors, USA), D. Jed Harrison
(University of Alberta, Canada). Antonio 1. Ricco (ACLARA
Biosciences, USA), G. Benjamin Hocker (Honeywell, USA),
Richard S. Muller (Univ. of California Berkeley, USA).
Khalil Najafi (Univ. of Michigan, USA), Martin A. Schmidt
(MIT. USA)
Asian Members
Toyosaka Moriizumi (Tokyo Institute of Tech., Japan).
Shigeru Ando (Univ. of Tokyo, Japanl. Minhang Bao
(Fudan Univ., China), Masayoshi Esashi (Tohoku Univ.,
Japan), Hiroyuki Fujita (Univ. of Tokyo, Japan). Yukitsugu
Hirota (Nissan Motor, Japan). Byung-Ki Sohn (Kyungpook
National Univ., Korea)
,.,-'
Eurosensors International Steering Committee
A. D'Amico (Chairman, Italyl. H. Baltes (Switzerland).
K. Bethe (Germany), G. Blasquez (France), S. Bouwstra
TRAt-ISDUCERS '01
(Denmark), J. E. Brignell (United Kingdom). 1. Dziuban
xv
EUROSE~SORS
(Poland), J. Gardner (United Kingdom), F. 1. Gutierrez
Monreal (Spainl. P. Hauptmann (Germany). B. Hök
(Sweden). G. Horvai (Hungary). I. lIiev (Bulgaria),
R. S. Jachowicz (Poland). B. E. Jones (United Kingdoml.
S. Leppavuori (Finlandl. I. Lundström (Swedenl. H. Meixner
(Germany). B. M. 1. Michaux (United Kingdoml.
S. Middelhoek (Netherlands). E. Obermeier (Germany).
R. S. Popovic (Switzerland). R. Puers (Belgium), M. Prudenziati
(ltaly), P. Ripka (Czech Republic), N. F.de Rooij (Switzerland),
Ch. S. Roumenin (Bulgaria). V. A. Smyntyna (Ukraine).
y. Vlasov (Russial. R. F. Wolffenbuttel (Netherlands)
TECHNICAL. PROGRAM
forum Hotel
Short Courses 1 a 2
a
Short Courses 3 4
Philharmonlc Hall
9:00 a.m. - 1O:50a.m. lA 1 Plenary 1 p. 1
11:20a.m.-12:30 1A 2 Plenary 2 p. 11
Room A Room B Room C Room D
I I
2:00 p.m. - 3:20 p.m. lA3: MEMS 1 B3: 1C 3: Packaging 1D 3:
a
Power Generation Acoustic Sensors Wafer Bonding Bio-Sensing Systems
p.25 p. 109 p. 177 p. 321
3:40 p.m. - 5:20 p.m. lA4: lB4: 1C 4: Modelling 1 D4: Technology for
a
Integrated Systems Magnetic Sensors Simulation Biomedical Systems
p.51 p.135 p. 239 p.407
Tuesd3Y, June 12 2Al : 2Bl : 2Cl: Basic Physical 2Dl :
8:30 a.m. -10:00 a.m. Inertial Sensors 1 Optical Sensors Effects in MEMS Chemical Sensing 1
p.429 p. 523 p. 657 p. 769
10:20 a.m. -12:00 p.m. 2A2: 2B2: 2C2: 2D2:
Inertial Sensors 2 Image Sensors Actuators 1 Chemical Sensing 2
p.455 p. 573 p.681 p. 793
1 :30 p.m. - 3:10 p.m. 2A3: Pressure 2B3: Micromachining 2C3: 2D3: Materials
a a
Force Sensors Etching Actuators 2 for Gas Sensing
p.481 p. 595 p.731 p.815
3:10 p.m. - 5:20 p.m. Poster Session
Wednesday, June 13 3A 1 : Microthrusters 3Bl : 3Cl: Microprobes 3Dl :
a a
8:30 a.m. -10:00 a.m. Microjets Materials 1 Nanodevices Microfluidics - Bio
p. 881 p.979 p.1053 p. 1145
10:20 a.m. -12:00 p.m. 3A2: Micropumps 3B2: 3C2: 3D2: Polymer-Based
a
Microvalves Materials 2 MEMS Resonators Microsystems
p.915 p.997 p. 1093 p. 1223
1: 30 p.m. - 3:10 p.m. 3A3: 3B3: 3C3: High Aspect 3D3: Electrochemical
Microfluidics - Systems Surface Modification Ratio MEMS Sensors
p.945 p. 1031 p. 1123 p. 1245
3:10 p.m. - 5:20 p.m. Poster Session
Thursday, June 14 4Al : 4Bl: Materials 4Cl : 4Dl: Biomimetic Et
8:30 a.m. -10:00 a.m. Commercialization Characterization RF MEMS Biomedical Systems
p. 1267 p. 1353 p. 1527 p. 1649
10:20 a.m. -12:00 p.m. 4A2: 4B2: Flow a Thermal 4C2: 4D2:
Optical MEMS 1 Sensors 3D MEMS Gas Sensors 1
p. 1289 p. 1435 p. 1569 p. 1671
1 :30 p.m. - 3:10 p.m. 4A3 4B3 Analysis of 4C3 4D3
Optical MEMS 2 Fluid-Solid Interactions Polymer MEMS Gas Sensors 2
p.1319 p. 1505 p. 1615 p. 1717
The papers in the contents pages are listed by sessions.
The papers in both volumes are in numeric order by paper numbers.
CONTENTS 1A 3.06P The Modelling of a Piezoelectric Vibration
Powererd Generator for Microsystems -
P. Glynne-Jones, S. Beeby, E. James, and N. White,
U. Southampton, Southampton, UK
p. 46
1 A 1.01 Technologies for Microturbomachinery -
M. Schmidt <invited speaker>, Massachusetts Inst. Tech.,
Cambridge, MA, USA
p. 2
1B 3.01 Bimorph Piezoelectric Acoustic Transducer -
1A 1.02 MEMS Meets Insects - M. Niu, U. Hawaii, Honoulu, HI, USA, E. Kim, USC,
I. Shimoyama <invited speaker>, K. Hoshino, Y. Ozaki, Los Angeles, CA, USA
S. Tamaki, S. Takeuchi, and T. Yasuda, U. Tokyo, Tokyo, Japan p. 110
p. 6
1 B3.02 High-Directivity Array of Ultrasonic Micro
Sensor Using PlT Thin Film on Si Diaphragm -
K. Yamashita, H. Katata, and M. Okuyama, Osaka U., Osaka,
Japan, H. Miyoshi, G. Kato, and S. Aoyagi, Kansai U., Osaka,
Japan, Y. Suzuki, Tech. Res. Inst. Osaka Pref., Osaka, Japan
lA2.01 Retina Implant - A BioMEMS Challenge -
p. 114
J.-U. Meyer <invited speaker>, Fraunhofer Inst. Biomed.
Engineering, St. Ingbert, Germany
1B 3.03 Self-Calibrating Micromachined Microphones
p. 12
with Integrated Optical Displacement Detection -
N. Hall and F. Oegertekin, Georgia Tech., Atlanta, GA, USA
1A2.02 MEMS - The View Back ... and the Vistas
p. 118
Ahead -
R. S. Muller <invited speaker>, U. Ca liforn ia, Berkeley, 1 B3.04 Single-Chip Low-Voltage Analog-to-Digital
CA, USA Interface for Encapsulation with Electret Microphone -
p.20 O. Bajdechi and J. Huijsing, Oelft U. Tech., Oelft,
The Netherlands
p. 122
1 B3.05P Silicon Microphones with Low Stress
1A3.01 Miniaturized Thermoelectric Generators Based Membranes -
on Poly-Si and Poly-SiGe Surface Micromachining - M. Füldner", A. Oehe, R. Aigner, and T. Bever, Infineon
M. Strasser*, R. Aigner, and M. Franosch, Infineon Tech. AG, Tech. AG, Munich, Germany, R. Lerch, and (*l. U. Erlangen
Munich, Germany, G. Wachutka, (and"). Munich U. Tech., Nuremberg, Erlangen, Germany
Munich, Germany p. 126
p.26
1B 3.06P Fabrication of a Biomimetic Corrugated Poly
1A3.02 A Combustion-Based MEMS Thermoelectric silicon Diaphragm with Attached Single Crystal Silicon
Power Generator - Proof Masses -
S. Schaevitz, A. Franz, K. Jensen, and M. Schmidt, MIT, K. Yoo and J. Yeh, Cornell U., Ithaea, NY, USA, N. Tien, U.
Cambridge, MA, USA California, Oavis, CA, USA, C. Gibbons, Q. Su, W. Cui, and
R. Miles, SUNY, Binghampton, NY, USA
p.30
p.130
1A 3 .03 An I ntegrated Com buster-Thermoelectric
Micro Power Generator -
C. Zhang, K. Najafi, L. Bernal, and P. Washabaugh,
U. Michigan, Ann Arbor, MI, USA,
1C 3.01 Selective Encapsulation Using a Polymerie or
p.34
Bonded Silicon Constraint Dam for Media Compatible
Pressure Sensor Applications -
1 A3.04 A Laser-Micromachined Vibrational to Elec
G. Li, J. Schmiesing, A. McNeil, K. Neumann, B. Gogoi,
trical Power Transducer for Wireless Sensing Systems -
G. Bitko, S. Petrovic, J. Torres, M. Fuhrmann, and D. Monk,
N. Ching, H. Wong, W. Li, and P. Leong, Chin. U. Hong Kong,
Motorola Semicon., Tempe, AZ, USA
Hong Kong, SAR, Z. Wen, Chongqing U., China
p. 178
p.38
1 C3.02 Wafer-Level Packaging Using Localized Mass
1A 3.05P Micro Generator Systems - Deposition -
K. Izumida, N. Toyota, M. Yoshimura, Y. Muroi, T. Takenaka, P. Chang-Chien and K. Wise, U. Michigan, Ann Arbor, MI, USA
and K. Ikeda, Tokyo U., Tokyo, Japan p. 182
p.42