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About Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly and applications for injection molded circuit carriers
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Detailed Information
| Author: | Jörg Franke |
|---|---|
| Publication Year: | 2013 |
| ISBN: | 1569905525 |
| Pages: | 362 |
| Language: | English |
| File Size: | 14.546 |
| Format: | |
| Price: | FREE |
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