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About Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Detailed Information
| Author: | Jong-Hoon Lee |
|---|---|
| Publication Year: | 2008 |
| ISBN: | 9781598292442 |
| Pages: | 118 |
| Language: | English |
| File Size: | 33.939 |
| Format: | |
| Price: | FREE |
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