Solar PV Power: Design, Manufacturing and Applications from Sand to Systems

518 Pages·2020·62.743 MB·English

by  Rabindra Kumar Satpathy, Venkateswarlu Pamuru

Solar PV Power
Solar PV Power
Design, Manufacturing and
Applications from Sand to Systems
Rabindra Satpathy
Venkateswarlu Pamuru

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Dedication
Dedicated to my beloved mother, the late Smt. Charubala Satpathy,
who inspired me to be a solar engineer from my college days.
Rabindra Satpathy
Dedicated to my beloved mother, the late Smt. Pamuru Subamma.
Dr. Venkateswarlu Pamuru
Contents
Aboutthe authors.............................................................................................................................xviii
Foreword.............................................................................................................................................xix
Acknowledgments............................................................................................................................xxiii
CHAPTER 1 Manufacturing of polysilicon...................................................................1
1.1 Introduction................................................................................................................1
1.2 Quartz–the inputfor polysilicon production..............................................................1
1.2.1 Specifications/requirements ofquartz............................................................2
1.2.2 Quartz resources, processing, and quantity requiredfor polysilicon
production.......................................................................................................3
1.2.3 Quartz purification, sourcesof availabilityand price...................................4
1.3 Polysilicon–basic manufacturing processes...............................................................9
1.3.1 Specifications/requirements ofpolysilicon....................................................9
1.3.2 The process fromquartz tometallurgical-grade silicon................................9
1.3.3 Siemens processof TCS production-purification........................................13
1.3.4 Siemens process...........................................................................................13
1.3.5 TCS production technology.........................................................................15
1.3.6 PurificationofTCS......................................................................................18
1.3.7 Why Siemens reactor-based polysiliconis the mostadopted.....................19
1.3.8 Siemens processby CVD.............................................................................20
1.4 Alternate methods ofpolysilicon production..........................................................23
1.4.1 Upgraded metallurgical-grade process........................................................23
1.4.2 Fluidizedbed reactors and FBR process.....................................................24
1.4.3 Union carbide process..................................................................................25
Thefollowingare the major advantages of silane asa silicon sourcegas............26
Thefollowingare the major disadvantages ofsilane compared toTCS...............26
1.5 Global polysilicon manufacturing scenario.............................................................27
References................................................................................................................29
CHAPTER 2 Silicon crystal growth process..............................................................31
2.1 Specification/requirement of ingots.........................................................................31
2.2 Processofmakingingots (CZ and float zone method)...........................................32
2.2.1 Crystal growthby Czochralski method.......................................................32
Parts ofthe crystal growth puller.............................................................................33
Charge preparation...................................................................................................33
Adding dopant to charge..........................................................................................36
Meltdown..................................................................................................................36
vii
viii Contents
Seeding......................................................................................................................37
Starting ofcrystal growth.........................................................................................37
Necking process........................................................................................................37
Crownand shoulder ofthe crystal...........................................................................37
Body of the crystal...................................................................................................37
Coning andtail formation........................................................................................38
Weighing ofthe as-grown crystal............................................................................38
Croppingof topand tail...........................................................................................38
Shapingof as-growncrystal.....................................................................................38
2.3 Process ofmulticrystallineSi ingot casting.............................................................42
Charge preparation...................................................................................................43
Adding dopant tocharge..........................................................................................44
Growth process.........................................................................................................45
Annealingand cooling..............................................................................................45
2.4 Equipmentused for ingot manufacturing................................................................46
2.5 Quality testingand reliability..................................................................................48
2.6 Manufacturers of Siingots inthe world..................................................................49
2.7 Technology trend ofingots......................................................................................50
References................................................................................................................51
CHAPTER 3 Silicon wafer manufacturing process...................................................53
3.1 Specification/requirement ofwafers........................................................................53
3.2 Process ofwafer making..........................................................................................56
Slicing process..........................................................................................................58
3.2.1 Ingot slicing using annular saw orID saw..................................................59
3.2.2 Ingot slicing using wire saw–loose abrasive slurry process.......................59
3.2.3 Ingot slicing using diamond wire saw process............................................63
3.2.4 Quality testingand reliability......................................................................65
3.2.5 Equipmentused for silicon wafer manufacturing.......................................66
3.2.6 Manufacturers of silicon wafers..................................................................66
3.2.7 Technology trend andpricing analysisof wafers.......................................67
3.3 Direct wafer process (DWP)....................................................................................67
3.4 Kerf loss wafer process by epitaxy..........................................................................69
3.5 What is the new trend inwafer manufacturing?.....................................................69
References................................................................................................................70
CHAPTER 4 Making of crystalline silicon solar cells.............................................71
4.1 Introduction..............................................................................................................71
4.2 Basics ofsolar cell/physicsofsolarcell..................................................................71
4.2.1 Light absorption and generation ofchargecarriers....................................73
4.2.2 Recombination ofcharge carriersandlifetime...........................................75
4.2.3 Separation ofthe light-generated chargecarriers........................................77
Contents ix
Charge carrierseparation.........................................................................................77
Diffusion...................................................................................................................78
Solar cell I-V characteristics....................................................................................79
Resistance effect.......................................................................................................81
Loss mechanisms......................................................................................................82
4.3 Specifications ofthe solar cell.................................................................................83
4.4 Manufacturing process ofsolar cell.........................................................................84
4.4.1 Wafer sorting inspection..............................................................................85
4.4.2 Saw damage removal and texturization.......................................................86
4.4.3 Doping ofsiliconmaterial...........................................................................90
4.4.4 Etching ofphosphosilicate glass(PSG).......................................................94
4.4.5 Edge isolation...............................................................................................94
4.4.6 Antireflection coating...................................................................................96
4.4.7 Contactmaking..........................................................................................101
4.4.8 Testing andsorting ofsolar cells...............................................................106
4.5 P-type vs N-type solar cells...................................................................................108
4.6 PERC/PERL cells andthe manufacturingprocess................................................110
Basics ofpassivation..............................................................................................112
4.7 Bifacialsolar cells andthe manufacturing process...............................................113
Key drivers for bifacial solar cells/modules..........................................................115
4.8 Advanced high efficiency cells and the manufacturing process...........................120
4.8.1 IBC solar cell.............................................................................................120
4.8.2 TOPCon solar cell......................................................................................124
4.8.3 HJT solar cells............................................................................................125
Advantages.............................................................................................................126
Processflow of HJT...............................................................................................126
4.9 Equipmentused for advancedsolarcell manufacturing.......................................128
4.10 Manufacturersofsilicon solar cells and technologytrends..................................129
References..............................................................................................................132
CHAPTER 5 Manufacturing of crystalline silicon solar PV modules..................135
5.1 Introduction............................................................................................................135
Design of asolarPV module.................................................................................135
Bypass diodes.........................................................................................................139
Cell tomodule loss (CTM)....................................................................................139
5.2 Specifications/requirements ofsolarPV modules.................................................143
Dimensions.............................................................................................................143
Weight....................................................................................................................143
Cells........................................................................................................................143
Cell dimensions......................................................................................................144