Six Sigma for electronics design and manufacturing

393 Pages·2002·2.58 MB·English

by  Sammy G Shina

Six Sigma for
Electronics Design
and Manufacturing
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Six Sigma for
Electronics Design
and Manufacturing
Sammy G. Shina
University of Massachusetts, Lowell
McGraw-Hill
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DOI: 10.1036/0071409556
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Contents
Illustrations and Tables xvii
Abbreviations xxiii
Preface xxvi
Chapter 1. The Nature of Six Sigma and Its Connectivity 1
to Other Quality Tools
1.1 Historical Perspective 1
1.2 Why Six Sigma? 4
1.3 Defending Six Sigma 7
1.4 The Definitions of Six Sigma 8
1.5 Increasing the Cp Level to Reach Six Sigma 9
1.6 Definitions of Major Quality Tools and How 10
They Effect Six Sigma
1.7 Mandatory Quality Tools 10
1.8 Quality Function Deployment (QFD) 11
1.8.1 Engineering 11
1.8.2 Management 11
1.8.3 Marketing 12
1.9 Design for Manufacture (DFM) 00
1.10 Design of Experiments (DoE) 00
1.11 Other Quality Tools 20
1.11.1 Process mapping 21
1.11.2 Failure modes and effects analysis (FMEA) 26
1.12 Gauge Repeatability and Reproducibility (GR&R) 29
1.13 Conclusions 30
1.14 References and Bibliography 31
Chapter 2. The Elements of Six Sigma and 33
Their Determination
2.1 The Quality Measurement Techniques: SQC,
Six Sigma, Cp and Cpk 34
2.1.1 The Statistical quality control (SQC) methods 34
2.1.2 The relationship of control charts and 35
six sigma
2.1.3 The process capability index (Cp) 36
2.1.4 Six sigma approach 39
vii
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viii Contents
2.1.5 Six sigma and the 1.5 (cid:1)shift 41
2.2 The Cpk Approach Versus Six Sigma 42
2.2.1 Cpk and process average shift 43
2.2.2 Negative Cpk 44
2.2.3 Choosing six sigma or Cpk 45
2.2.4 Setting the process capability index 46
2.3 Calculating Defects Using Normal Distribution 47
2.3.1 Relationship between zand Cpk 54
2.3.2 Example defect calculations and Cpk 54
2.3.3 Attribute processes and reject analysis for 57
six sigma
2.4 Are Manufacturing Processes and Supply Parts 59
Always Normally Distributed?
2.4.1 Quick visual check for normality 59
2.4.2 Checking for normality using chi-square tests 60
2.4.3 Example of (cid:2)2goodness of fit to normal 62
distribution test
2.4.4 Transformation data into normal distributions 63
2.4.5 The use of statistical software for 65
normality analysis
2.5 Conclusions 65
2.6 References and Bibliography 66
Chapter 3. Six Sigma and the Manufacturing Control Systems 69
3.1 Manufacturing Variability Measurement and Control 70
3.2 The Control of Variable Processes and Its 72
Relationship with Six Sigma
3.2.1. Variable control chart limits 74
3.2.2 Control chart limits calculations 74
3.2.3 Control and specifications limits 75
3.2.4 X(cid:1), R variable control chart calculations 76
example
3.2.5 Alternate methods for calculating control 78
limits
3.2.6 Control chart guidelines, out-of-control 78
conditions, and corrective action
procedures and examples
3.2.7 Examples of variable control chart 82
calculations and their relationship to
six sigma
3.3 Attribute charts and their Relationship with 84
Six Sigma
Contents ix
3.3.1 The binomial distribution 85
3.3.2 Examples of using the binomial distribution 86
3.3.3 The Poisson distribution 86
3.3.4 Examples of using the Poisson distribution 87
3.3.5 Attribute control charts limit calculations 88
3.3.6 Examples of attribute control charts 89
calculations and their relationship to
six sigma
3.3.7 Use of control charts in factories that are 91
approaching six sigma
3.4 Using TQM Techniques to Maintain Six Sigma 91
Quality in Manufacturing
3.4.1 TQM tools definitions and examples 92
3.5 Conclusions 99
3.6 References and Bibliography 99
Chapter 4. The Use of Six Sigma in Determining the 101
Manufacturing Yield and Test Strategy
4.1 Determining Units of Defects 102
4.2 Determining Manufacturing Yield on a Single 104
Operation or a Part with Multiple Similar Operations
4.2.1 Example of calculating yield in a part with 105
multiple operations
4.2.2 Determining assembly yield and PCB and 106
product test levels in electronic products
4.2.3 PCB yield example 107
4.3 Determining Design or Manufacturing Yield on 108
Multiple Parts with Multiple Manufacturing
Operations or Design Specifications
4.3.1 Determining first-time yield at the electronic 110
product turn-on level
4.3.2 Example of yield calculations at the PCB 110
assembly level
4.3.3 DPMO methods for standardizing defect 112
measurements
4.3.4 DPMO charts 113
4.3.5 Critique of DMPO methods 115
4.3.6 The use of implied Cpk in product and 116
assembly line manufacturing and
planning activities
4.3.7 Example and discussion of implied Cpk in 118
IC assembly line defect projections
4.4 Determining Overall Product Testing Strategy 120