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About Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a pract
Detailed Information
| Author: | E-H Wong |
|---|---|
| Publication Year: | 2015 |
| Pages: | 477 |
| Language: | English |
| File Size: | 25.44 |
| Format: | |
| Price: | FREE |
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