Table Of ContentPlastics for Electronics
Plastics for Electronics
Second Edition
Edited by
Martin Goosey
Chief Scientist and Technology Fellow
Shipley Europe Ltd
Coventry, UK
SPRINGER-SCIENCE+BUSINESS MEDIA, B.V.
Library of Congress Cataloging-in-Publication Data is available
ISBN 978-90-481-4018-3 ISBN 978-94-017-2700-6 (e Book)
DOI 10.1007/978-94-017-2700-6
Printed on acid-free paper
AII Rights Reserved
© 1999 Springer Science+Business Media Dordrecht
Originally published by Kluwer Academic Publishers in 1999
No part of the material protected by this copyright notice may be reproduced or
utilized in any form or by any means, electronic or mechanical,
including photocopying, recording or by any information storage and
retrieval system, without written permission from the copyright owner.
Contents
List of Contributors ix
Preface Xl
Chapter 1 Introduction to polymers and their important properties
for electronic applications 1
Martin Goosey
1.1 Introduction to polymers and their properties 1
1.2 Chemistry of polymers 4
1.3 Important electrical properties of polymers 9
1.4 Important mechanical, chemical and physical
properties of polymers 16
1.5 Summary 24
Chapter 2 Silicone materials for electronic components
and circuit protection 25
Jean-Paul Mollie
2.1 Definition and history 25
2.2 Physical properties 27
2.3 Production of silicones 29
2.4 Silicone applications in electronics 33
2.5 Future developments 47
2.6 References 48
Chapter 3 Engineering thermoplastics 51
Harry van Baal
3.1 Introduction 51
3.2 Engineering thermoplastics 52
3.3 Principal standard tests 65
3.4 Further applications 69
3.5 Post-treatment of engineering thermoplastics 80
vi I I CONTENTS
3.6 Design for recyclability 81
3.7 Conclusion 81
Chapter 4 Epoxide resins and their formulation 83
Martin Goosey, Martin Roth, Thomas Kainmuller
and Wolfgang Seiz
4.1 Introduction 83
4.2 Epoxide resins 87
4.3 Curing agents 93
4.4 Extenders 106
4.5 Flame retardants 112
4.6 Other useful constituents 116
4.7 General formulation considerations 121
4.8 Recycling of cured epoxy-based materials 123
4.9 Toxicological properties and safety precautions 124
4.10 Summary 125
4.11 References 125
4.12 Further reading 125
Chapter 5 Recent developments in the encapsulation
of semiconductors by transfer moulding 131
Martin Goosey and Mike Plant
5.1 Introduction 131
5.2 Transfer moulding equipment considerations 134
5.3 Transfer moulding compound formulation
considerations 140
5.4 Common moulding problems and how to avoid them 151
5.5 Evaluation of epoxide-based transfer moulding
compounds 161
5.6 Challenges into the 21st century 167
5.7 Reference 168
5.8 Further reading 168
Chapter 6 Materials for advanced encapsulation 171
Nigel Hackett
6.1 Introduction 171
6.2 Material choices for encapsulants 174
6.3 Handling and use 186
6.4 Application techniques 189
6.5 Industry trends 196
6.6 Summary 198
6.7 Acknowledgements 199
CONTENTS I I vii
Chapter 7 Recent developments in the chemistry of lithography
for electronics production 201
David Merricks
7.1 Introduction 201
7.2 Photoresists for printed circuit board production 205
7.3 Photoresists for integrated circuit production 223
7.4 Conclusion 238
7.5 References 239
Chapter 8 Ferroelectric polymers 243
John A. Chilton
8.1 Introduction 243
8.2 Electroactive polymers 246
8.3 Poling 251
8.4 Electroactive composites 253
8.5 Properties of ferroelectric materials 258
8.6 Applications 276
8.7 SMART materials 284
8.8 Conclusions 286
8.9 Acronyms and symbolism 288
8.10 References 289
Chapter 9 Polymers in printed circuit board (PCB) and related
advanced interconnect applications 293
Martin Goosey
9.1 Introduction 293
9.2 Printed circuit board fabrication 295
9.3 Laminates for rigid printed wiring 297
9.4 Properties and testing of laminates 301
9.5 Polymers used for laminate manufacture 309
9.6 Polymers for flexible printed wiring 320
9.7 Integrated capacitors and resistors 325
9.8 Polymers in advanced interconnect applications 326
9.9 Summary and conclusions 330
9.10 Acknowledgement 332
9.11 References 332
Chapter 10 New polymers for emerging interconnect applications 333
John Everett, Philip Garrou and David Dalman
10.1 Introduction 333
10.2 PWB substrates with organic reinforcements 334
10.3 PWB substrates without reinforcements 337
10.4 Polymers for thin film microelectronics applications 338
10.5 Tradenames 349
10.6 References 350
II
viii C_O_NT_E_NT_S_ _________
L ___________ ----...l
Chapter 11 Moulded interconnect devices (MIDs) 355
Frank Pohlau and Klaus Feldmann
11.1 Introduction 355
11.2 Key advantages and introduction strategies 359
11.3 Manufacturing methods 363
11.4 Assembly and connection technology 377
11.5 Materials used 383
11.6 Example product 384
11.7 Summary 385
11.8 Literature 385
Index 387
List of Contributors
Harry van Baal
General Electric Plastics bv, Bergen op Zoom, The Netherlands
John A. Chilton
Bosworth College, Nazareth House, Barrack Road, Northampton, UK
David Dalman
The Dow Chemical Company, Midland, Michigan, MI 48674, USA
John Everett
Dow Deutschland Inc., Industriestrasse I, D-77836 Rheinmunster, Germany
Klaus Feldmann
F APS, Lehrstuhl fUr Fertigungsautomatisierung und Produktionssyste
matik, University of Erlangen-Nurnberg, Germany
Philip Garrou
The Dow Chemical Company, c/-MCNC Research Triangle Park, NC
27909, USA
Martin Goosey
Shipley Europe Ltd, Herald Way, Coventry, UK
Nigel Hackett
Dexter Electronic Materials, Langley, UK
Thomas Kainmiiller
Ciba Specialty Chemicals Inc., Basel, Switzerland
David Merricks
Shipley Company Inc., Marlborough, MA, USA
Jean-Paul Mollie
Dow Corning SA, Seneffe, Belgium
I IL-_______________
x L_IS_T__O _F_ C_O__NT_ R_ I_ B_ U_T_O_R_S_ _____________~
Mike Plant
Kemtron International, South Woodham Ferrers, UK
Frank Pohlau
F APS, Lehrstuhl fUr Fertigungsautomatisierung und Produktionssyste
matik, University of Erlangen-Numberg, Germany
Martin Roth
Ciba Specialty Chemicals Inc., Basel, Switzerland
Wolfgang Seiz
Ciba Specialty Chemicals Inc., Basel, Switzerland
Preface
The phenomenal and relentless progress in the development and commer
cialization of new electronics products has had a major impact on most
people in the civilized world. We are all now familiar with personal
computers, mobile telephones, portable camcorders and a host of other
relatively low cost devices that have transformed our everyday lives. The key
features that characterize the evolution of most of these products from one
generation to the next are typically enhanced performance and functionality
coupled with reduced size. The electronics industry is also one of the few
industries in which the real cost-performance function has continued to
decline significantly over the last 40 years or so since the mass commercial
ization of semiconductor devices. The now ubiquitous personal computer is
the classic example, where the new product introduction cycle is of the order
of only a few months and where operating speeds, memory capacity and
overall performance are increasing at an incredible rate, yet the prices are
continually reducing.
All of this has been a result of the development of increasingly
sophisticated semiconductor devices along with the supporting discrete
components, packages and interconnection and assembly methods. In
particular, one of the key drivers has been the ability to incorporate more
and more features onto silicon without any appreciable increase in size.
Again, the microprocessor and memory chips used in personal computers
are good examples. These advances have only been made possible because of
both improved and new materials such as the polymer-based photoresists
and packaging materials that have enabled the mass production of these
sophisticated devices on a scale and yield that would have seemed
impossible a few years ago.
Polymeric materials are widely used during nearly all stages of the
manufacturing process of electronics products from photoresists to printed
circuit boards and from encapsulants to equipment cases. In almost every
piece of electronics there is invariably a wide range of polymeric materials to
be found and this book gives an introductory overview of the chemistry,
