PCI Express 225 W/300 W High Power Card Electromechanical Specification, Revision 1.0RC

48 Pages·2008·0.742 MB·English

PCI Express®
225 W/300 W High Power
Card Electromechanical
Specification
Revision 1.0RC
March 14, 2008
REVISION REVISION HISTORY DATE
0.9 PCI-SIG member review draft 12/17/07
1.0RC 1.0 Release Candidate 3/14/08

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DISCLAIMER
This specification is provided “as is” with no warranties whatsoever, including any warranty of
merchantability, noninfringement, fitness for any particular purpose, or any warranty
otherwise arising out of any proposal, specification, or sample. PCI-SIG disclaims all liability
for infringement of proprietary rights, relating to use of information in this specification. No
license, express or implied, by estoppel or otherwise, to any intellectual property rights is
granted herein.
PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG.
All other product names are trademarks, registered trademarks, or servicemarks of their respective
owners.

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Copyright © 2007 PCI-SIG
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Contents
OBJECTIVES OF THE SPECIFICATION..............................................................................8
REFERENCE DOCUMENTS.....................................................................................................8
DOCUMENTATION CONVENTIONS.....................................................................................8
TERMS AND ACRONYMS........................................................................................................9
1. INTRODUCTION...............................................................................................................10
2. SYSTEM IMPLEMENTATION.......................................................................................12
2.1. USAGE RULES................................................................................................................14
2.2. SYSTEM POWER DELIVERY REQUIREMENTS..................................................................14
3. CARD POWER...................................................................................................................16
3.1. POWER-UP SEQUENCING................................................................................................17
4. PCI EXPRESS 2 X 4 AUXILIARY POWER CONNECTOR DEFINITION..............22
4.1. 2 X 4 AUXILIARY POWER CONNECTOR PERFORMANCE REQUIREMENTS........................24
4.2. 2 X 4 RECEPTACLE.........................................................................................................24
4.2.1. Connector Drawing................................................................................................24
4.2.2. PCB Footprint.........................................................................................................26
4.3. CABLE ASSEMBLY.........................................................................................................27
4.4. CONNECTOR MATING-UNMATING KEEP-OUT AREA (LATCH LOCK RELEASE)..............29
4.5. 2 X 4 AUXILIARY POWER CONNECTOR SYSTEM PIN ASSIGNMENT.................................30
4.6. ADDITIONAL CONSIDERATIONS.....................................................................................32
5. MECHANICAL SPECIFICATION..................................................................................33
5.1. PCI EXPRESS 225 W/300 W ADD-IN CARD DIMENSIONS..............................................33
5.2. ADD-IN CARD MOUNTING.............................................................................................35
5.3. CARD RETENTION..........................................................................................................38
5.4. CARD MASS LIMIT.........................................................................................................38
5.5. BOARD KEEPOUT...........................................................................................................38
6. THERMAL AND ACOUSTIC MANAGEMENT...........................................................41
6.1. INLET TEMPERATURE.....................................................................................................41
6.2. CARD THERMAL CHARACTERIZATION PROCEDURE.......................................................42
6.3. ACOUSTIC MANAGEMENT..............................................................................................46
6.3.1. Background and Scope...........................................................................................46
6.3.2. Card Acoustic Characterization Procedure...........................................................46
6.3.3. Acoustic Recommendations and Guidelines...........................................................47

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Figures
FIGURE 2-1: EXAMPLE ORIENTATION FOR PCI EXPRESS 225 W ADD-IN CARD............................12
FIGURE 2-2: EXAMPLE ORIENTATION FOR PCI EXPRESS 300 W CARDS........................................13
FIGURE 4-1: 2 X 4 PLUG MATING WITH A 2 X 4 RECEPTACLE........................................................22
FIGURE 4-2: 2 X 3 PLUG MATING WITH A 2 X 4 RECEPTACLE........................................................23
FIGURE 4-3: 2 X 4 PLUG IS PHYSICALLY PREVENTED FROM MATING WITH A 2 X 3 RECEPTACLE.23
FIGURE 4-4: 2 X 4 R/A THRU-HOLE RECEPTACLE DRAWING........................................................25
FIGURE 4-5: 2 X 4 R/A THRU-HOLE RECPTACLE RECOMMENDED PCB FOOTPRINT......................26
FIGURE 4-6: CABLE PLUG CONNECTOR HOUSING.........................................................................27
FIGURE 4-7: CONNECTOR MATING-UNMATING KEEP-OUT AREA (LATCH LOCK RELEASE).........29
FIGURE 4-8: 2 X 4 AUXILIARY POWER CONNECTOR PLUG SIDE PIN-OUT......................................30
FIGURE 4-9: 2 X 4 AUXILIARY POWER CONNECTOR RECEPTACLE SIDE PIN-OUT..........................30
FIGURE 4-10: 2 X 3 AUXILIARY POWER CONNECTOR PIN-OUT AS DEFINED IN PCI EXPRESS 150W
1.0..........................................................................................................................................32
FIGURE 5-1: PCI EXPRESS 225 W ADD-IN CARD DIMENSIONAL DRAWING..................................34
FIGURE 5-2: PCI EXPRESS 300 W ADD-IN CARD DIMENSIONAL DRAWING..................................35
FIGURE 5-3: DETAILED TWO-SLOT I/O BRACKET DESIGN............................................................36
FIGURE 5-4: TWO-SLOT I/O BRACKET EXAMPLE (ISOMETRIC VIEW)...........................................36
FIGURE 5-5: DETAILED THREE-SLOT I/O BRACKET DESIGN.........................................................37
FIGURE 5-6: THREE-SLOT I/O BRACKET EXAMPLE (ISOMETRIC VIEW)........................................37
FIGURE 5-7: KEEPOUT AREA IN MM [INCHES]...............................................................................39
FIGURE 6-1: EXAMPLE OF A HIGH POWER CARD SHOWING TEMPERATURE SENSOR PLACEMENTS
AT THE THERMAL SOLUTION INLET.......................................................................................42
FIGURE 6-2: THERMAL CHARACTERIZATION FIXTURE – TWO-SLOT VERSION..............................43
FIGURE 6-3: THERMAL CHARACTERIZATION FIXTURE – THREE-SLOT VERSION...........................44
FIGURE 6-4: THERMAL CHARACTERIZATION FIXTURE – TANDEM TWO-SLOT VERSION................45

Tables
TABLE 2-1: POWER SUPPLY RAIL REQUIREMENTS........................................................................14
TABLE 3-1: PCI EXPRESS 300 W CARD (WITH ONE 2 X 4 AND ONE 2 X 3 CONNECTOR) PERMITTED
INITIAL POWER DRAW...........................................................................................................18
TABLE 3-2: PCI EXPRESS 300W CARD (WITH THREE 2 X 3 CONNECTORS) PERMITTED INITIAL
POWER DRAW........................................................................................................................19
TABLE 3-3: PCI EXPRESS 225 W CARD (WITH ONE 2 X 4 CONNECTOR) PERMITTED INITIAL POWER
DRAW....................................................................................................................................20
TABLE 3-4: PCI EXPRESS 225 W CARD (WITH TWO 2 X 3 CONNECTORS) PERMITTED INITIAL
POWER DRAW........................................................................................................................20
TABLE 3-5: PCI EXPRESS 225 W CARD (WITH ONE 2 X 3 AND ONE 2 X 4 CONNECTOR) PERMITTED
INITIAL POWER DRAW...........................................................................................................21
TABLE 4-1: 2 X 4 AUXILIARY POWER CONNECTOR PIN-OUT ASSIGNMENT....................................31
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TABLE 4-2: SENSE PINS DECODING BY A GRAPHICS CARD...........................................................31
TABLE 4-3: 2 X 3 PLUG TO 2 X 4 RECEPTACLE PIN MAPPING........................................................32
TABLE 4-4: ADDITIONAL REQUIREMENTS.....................................................................................32
TABLE 5-1: PCI EXPRESS 225 W/300 W ADD-IN CARD DIMENSIONS...........................................33

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Objectives of the Specification
The main objective of this specification is to support PCI Express® add-in cards that require higher
power than specified in the PCI Express Card Electromechanical Specification and the PCI Express x16
Graphics 150W-ATX Specification. This specification includes the following:
(cid:137) System implementations
(cid:137) Card power
(cid:137) Auxiliary power connectors
(cid:137) Mechanical specification
(cid:137) Thermal and acoustic management
Reference Documents
PCI Express Base Specification, Rev. 2.0 (PCI Express Base 2.0)
PCI Express Card Electromechanical Specification, Rev. 2.0 (PCI Express CEM 2.0)
PCI Express x16 Graphics 150W-ATX Specification, Rev. 1.0 (PCI Express 150W 1.0)
ISO 3744, Acoustics – Determination of Sound Power Levels of Noise Sources Using Sound Pressure –
Engineering Method in an Essentially Free Field Over a Reflecting Plane
ISO 7779, Acoustics – Measurement of Airborne Noise Emitted by Information Technology and
Telecommunications Equipment
Documentation Conventions
Capitalization
Some terms are capitalized to distinguish their definition in the context of this document from their
common English meaning. Words not capitalized have their common English meaning. When
terms such as “memory write” or “memory read” appear completely in lower case, they include all
transactions of that type.
Register names and the names of fields and bits in registers and headers are presented with the first
letter capitalized and the remainder in lower case.
Numbers and Number Bases
Hexadecimal numbers are written with a lower case “h” suffix, e.g., FFFh and 80h. Hexadecimal
numbers larger than four digits are represented with a space dividing each group of four digits, as in
1E FFFF FFFFh. Binary numbers are written with a lower case “b” suffix, e.g., 1001b and 10b.
Binary numbers larger than four digits are written with a space dividing each group of four digits, as
in 1000 0101 0010b.
All other numbers are decimal.
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Implementation Notes
Implementation Notes should not be considered to be part of this specification. They are included
for clarification and illustration only.
Terms and Acronyms
AGP Accelerated Graphics Port
AIC Add-in card
CEM Card Electromechanical
ECN Engineering Change Notice
HE High-End
Add-in card A card that is plugged into a connector and mounted in a chassis slot
ATX A system board form factor. Refer to the ATX Specification, Rev. 2.2.
ATX-based form
factor Refers to a form factor that does not exactly conform to the ATX specification,
but uses the key features of ATX, such as the slot spacing, I/O panel definition,
etc.
Evolutionary strategy A strategy to develop the PCI Express connector and card form factors within
today’s chassis and system board form factor infrastructure constraints
PCIe PCI Express

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1. Introduction
This specification addresses PCI Express cards with power and thermals greater than those
supported by PCI Express CEM 2.0 and PCI Express 150W 1.0. Its purpose is to provide
additional capabilities for PCI Express cards within the existing framework of an evolutionary
strategy that is based on existing motherboard form factors. This specification is primarily designed
to deliver additional electrical power to a PCI Express graphics card, or other add-in card, and to
provide increased card volume for the management of thermals and acoustics.
This specification directly leverages PCI Express CEM 2.0 and PCI Express Base 2.0. Only
differences from, or additions to, required areas for support of PCI Express 225 W/300 W High
Power Cards are provided. This specification does not replace PCI Express 150W 1.0. It simply
extends the existing usage model to support 225 W and 300 W high power cards. Therefore, this
specification is applicable only when the application consumes more than 150 W of power. For PCI
Express graphics add-in cards that are 150 W or lower, refer to PCI Express 150W 1.0.
This specification comprehends only the ATX form factor. The existence of other form factors,
such as the BTX (Balanced Technology Extended Interface Specification 1.0), is recognized. Expanding this
specification in the future to support other form factors may be considered when compelling needs
arise. Additionally, this specification addresses only the single card scenario, just like PCI Express
150W 1.0. It is expected that, with tight cooperation between graphics card vendors or other high
power card vendors and system OEMs, systems can scale and support multiple high power cards in
a modular fashion.
This specification does not support the optional hot-plug functionality of PCI Express CEM 2.0.

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