Optical Interconnects for Data Centers

431 Pages·2016·12.891 MB·English

by  Tolga Tekin, Nikos Pleros, Richard Pitwon, Andreas Hakansson

Optical Interconnects for Data Centers
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Woodhead Publishing Series in Electronic
and Optical Materials: Number 90
Optical Interconnects
for Data Centers
Edited by
Tolga Tekin
Richard Pitwon
Andreas Ha˚kansson
Nikos Pleros
AMSTERDAM(cid:129)BOSTON(cid:129)HEIDELBERG(cid:129)LONDON
NEWYORK(cid:129)OXFORD(cid:129)PARIS(cid:129)SANDIEGO
SANFRANCISCO(cid:129)SINGAPORE(cid:129)SYDNEY(cid:129)TOKYO
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Contents
Listofcontributors ix
Biography xiii
Preface xv
Woodheadpublishingseriesinelectronic andopticalmaterials xvii
Part I Introduction
1 Datacenterarchitectures 3
C.DeCusatis
1.1 Introduction 3
1.2 Datacenterenvironmentconsiderations 4
1.3 Datacenterclassifications 9
1.4 Applicationarchitectures 10
1.5 Clouddatacenterarchitectures 14
1.6 Physicalarchitecture 17
1.7 Datacenterdesignconsiderations 21
1.8 Nextgenerationdatacenterarchitectures 32
1.9 Opticalinterconnectsfordatacenters 36
References 39
2 Opticalinterconnects:fundamentals 43
D.TsiokosandG.T.Kanellos
2.1 Opticalinterconnects: thedriverbehindfuturedatacenters 43
2.2 Classesofopticalinterconnectsindatacenters 46
2.3 Currentstatusandfuturetrendsofopticalinterconnectssystems 51
2.4 Overviewofphotonickeyenablingtechnologies 56
2.5 Summaryandpracticalconclusions 66
References 67
3 Keyrequirementsforopticalinterconnectswithindatacenters 75
M.Duranton,D.DutoitandS.Menezo
3.1 Anexplosionofdata 75
3.2 Whataredatacenters? 78
3.3 Datacommunicationrequirements 82
3.4 Opticalinterconnect:asolutiontoenergyandbandwidth
requirements? 83
vi Contents
3.5 Conclusion 90
References 92
Part II Materials and Components
4 Indiumphosphide(InP)foropticalinterconnects 97
M.Lebby,S.Ristic,N.CalabrettaandR.Stabile
4.1 Introduction 97
4.2 InPphotonicintegrationplatforms 98
4.3 State-of-the-artinInPphotonicintegratedcircuits(PICs)
fordatacenters 100
4.4 Futuretrends 114
References 118
5 Photoniccrystalcavitiesforopticalinterconnects 121
LiamO’Faolain
5.1 Photoniccrystalbackground 121
5.2 Massproduction 127
5.3 Lightemission 131
5.4 Thefibercouplingproblemanditssolution 137
5.5 Opticalmodulation 142
5.6 Photo-detection 149
5.7 Outlook 152
References 153
6 Typesandperformanceofhighperformingmulti-mode
polymerwaveguidesforopticalinterconnects 157
M.SinghandK.Weidner
6.1 Introduction 157
6.2 Polynorbornene 159
6.3 Silicones 163
6.4 Connectorsandcoupling 166
6.5 Conclusions 169
References 169
7 Designandfabricationofmultimodepolymerwaveguides
foropticalinterconnects 171
T.IshigureandM.Immonen
7.1 Introduction 171
7.2 Structureofmultimodepolymeropticalwaveguide 172
7.3 Fabricationmethod 174
7.4 Characterization 179
7.5 PolymeropticalwaveguidecircuitforopticalPCB 192
7.6 Summary 193
References 194
Contents vii
8 Siliconphotonicsformulti-modetransmission 197
K.Kurata,Y.Suzuki,M.TokushimaandK.Takemura
8.1 Expectationsforoptical interconnection 197
8.2 Multi-modewiringforsiliconphotonicstechnology 198
8.3 Chip-scalesiliconphotonicstransceiver“opticalI/Ocore” 201
8.4 Evaluation 216
8.5 Application 219
References 221
9 Scalablethree-dimensionalopticalinterconnectsfordatacenters 223
R.Morris,A.K.KodiandA.Louri
9.1 Introduction 223
9.2 Photonicandthree-dimensionalinterconnects 224
9.3 Opticalarchitecture:three-dimensional-NoC 225
9.4 Reconfiguration 232
9.5 Performanceevaluation 236
9.6 Conclusionsandfuturedirections 244
References 244
10 Electronicdrivers/TIAsforopticalinterconnects 247
J.BauwelinckandX.Yin
10.1 Co-designandco-simulationofelectronicsandphotonics 250
10.2 Electronic drivers 252
10.3 Transimpedanceamplifiers 256
References 262
Part III Circuit Boards
11 Electrical andphotonicoff-chipinterconnectionandsystem
integration 265
M.Zia,C.Wan,Y.ZhangandM.Bakir
11.1 Introduction 265
11.2 Emergingelectrical andphotonicinterconnects 267
11.3 Large-scaleinterconnectedsystemusinga“siliconbridging”
concept 272
11.4 Conclusion 282
References 283
12 Electro-opticalcircuitboardswithsingle-ormulti-modeoptical
interconnects 287
L.Brusberg,M.ImmonenandT.Lamprecht
12.1 Motivationandclassificationofopticalinterconnects
attheboardlevel 287
12.2 Manufacturingofintegratedplanarpolymerwaveguides 289
12.3 IntegratedglasswaveguidebasedEOCBs 297
viii Contents
12.4 Massproductionandreliability 304
References 305
13 Internationalandindustrialstandardizationofopticalcircuit
boardtechnologies 309
R.Pitwon,M.Immonen,J.Wu,L.Brusberg,H.Itoh,T.Shioda,
S.Dorresteiner,H.J.Yan,H.Schro¨der,D.ManessisP.Schneider
andK.Wang
13.1 Introduction 309
13.2 IndustrialmanufacturingprocessesforOPCBs 312
13.3 International standardizationofOPCBs 324
13.4 OPCBmeasurement 326
13.5 Conclusion 339
References 340
14 Requirementsforprocessautomationofopticalinterconnect
technologies 343
I.PiacentiniandT.Vahrenkamp
14.1 Anintroductionandalistofissues 343
14.2 Positionalaccuracy andthedebateonpassive/activealignment 351
14.3 Machine“ingredients”andmachinetechnologies 354
14.4 Machinevision 363
14.5 TheroleofsoftwareandHMIintheoptimizationofnewprocesses 367
14.6 Testandmeasurementinstrumentation 369
14.7 Designforautomatedassembly/testingandstandardization 370
14.8 Automatedtesting 371
14.9 Conclusions 371
References 372
Part IV Using Optical Interconnects to Improve Network
Architectures in Data Centers
15 Theroleofopticalinterconnectsinthedesignofdatacenter
architectures 375
A.Siokis,K.ChristodoulopoulosandE.Varvarigos
15.1 Introduction 375
15.2 Overviewofopticalinterconnectstechnologies 376
15.3 Applicationsofopticalinterconnectsintheindividuallayers
ofthepackaginghierarchy 376
15.4 On-opticalprintedcircuitboards(OPCB)layoutstrategies 378
15.5 Conclusion 390
Acknowledgments 390
References 391
Index 395
List of contributors
M.Bakir GeorgiaInstituteofTechnology,Atlanta,GA,UnitedStates
J.Bauwelinck GhentUniversity-iMinds-imec,Ghent,Belgium
L. Brusberg Fraunhofer Institute for Reliability and Microintegration (IZM),
Berlin,Germany
N.Calabretta EindhovenUniversityofTechnology,Eindhoven,TheNetherlands
K. Christodoulopoulos University of Patras, Patras, Greece; Computer Technology
InstituteandPress(cid:1)DiophantusPatras,Greece
C.DeCusatis MaristCollege,Poughkeepsie,NY,UnitedStates
S.Dorresteiner TEConnectivity,s’Hertogenbosch,TheNetherlands
M. Duranton Commissariat a` l’e´nergie atomique et aux e´nergies alternatives, Gif-
sur-YvetteCedex,France
D. Dutoit Commissariat a` l’e´nergie atomique et aux e´nergies alternatives,
GrenobleCedex,France
M. Immonen Meadville Aspocomp International Limited, TTM Technologies,
Inc.,Salo,Finland; TTMTechnologiesInc.TurkuArea,Finland
T.Ishigure KeioUniversity,Yokohama,Japan
H.Itoh IndustrialTechnologyCenterofTochigiPrefecture,Tochigi,Japan
G.T.Kanellos AristotleUniversityofThessaloniki,Thessaloniki,Greece; Centerfor
ResearchandTechnologyHellas,Thessaloniki,Greece
A.K.Kodi OhioUniversity,Athens,OH,UnitedStates
K. Kurata Photonics Electronics Technology Research Association (PETRA),
Tsukuba,Japan