Table Of ContentAdvances in Atom and Single Molecule Machines
Series Editor: Christian Joachim
Xavier Baillin
Christian Joachim
Gilles Poupon Editors
Nanopackaging:
From
Nanomaterials to
the Atomic Scale
Proceedings of the 1st International
Workshop on Nanopackaging, Grenoble
27–28 June 2013
Advances in Atom and Single Molecule
Machines
Series editor
Christian Joachim, Toulouse, France
Editorial Board
L. Grill
F. Jelezko
D. Martrou
T. Nakayama
G. Rapenne
F. Remacle
K. Ohmori
More information about this series at http://www.springer.com/series/10425
Xavier Baillin Christian Joachim
(cid:129)
Gilles Poupon
Editors
Nanopackaging: From
Nanomaterials to the Atomic
Scale
Proceedings of the 1st International
Workshop on Nanopackaging,
–
Grenoble 27 28 June 2013
123
Editors
Xavier Baillin Gilles Poupon
CEAGrenoble CEAGrenoble
Grenoble Grenoble
France France
Christian Joachim
CEMES-CNRS
University PaulSabatier
Toulouse
France
ISSN 2193-9691 ISSN 2193-9705 (electronic)
Advances in AtomandSingle Molecule Machines
ISBN978-3-319-21193-0 ISBN978-3-319-21194-7 (eBook)
DOI 10.1007/978-3-319-21194-7
LibraryofCongressControlNumber:2015943834
SpringerChamHeidelbergNewYorkDordrechtLondon
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Preface
Single atom and molecule manipulations are now possible thanks to the scanning
tunnelingmicroscope(STM)anditsderivativesopeninganewtechnologicalfield,
named “Atom Technology” with the objective to produce one-day atomic scale
logic circuits. STM operates in ultra-high vacuum (UHV) and thanks to its
picometerscaleprecision,isabletoconstructorpatternanatomicscalecircuitona
specific surface. The electronic chip such achieved and connected will be only
suitableforinsituoperationintheUHV.Therequirementforfutureapplicationsis
to get a standalone chip, similar to electronics ones currently produced.
Consequently, it clearly appears a special need for developing a dedicated pack-
aging technology for this new kind of chip. The most constraining specification
concernstheUHVcontrolinside thepackage. Moreover,thesurfacequality needs
to as perfect as possible (atomic roughness and large terraces) with a controlled
surface structure and material band gap suitable for atom by atom manipulations.
Among the available existing materials, silicon (100) wafers, commonly used in
microelectronicsmanufacturing,areverypromisingbecausetheyaresatisfyingthe
requirement of surface quality and benefit from the very important know-how
developed in the microelectronics industry.
The first exploration of such a nano-packaging technology has been launched
with the Integrated European Project AtMol on January 1, 2011. A first interna-
tional AtMol workshop took place at MINATEC, France, on June 2013 with
participantscomingfromuniversitylaboratories,researchinstitutes,andindustries.
This volume compiles most of the contributions presented during this event.
Besides the first driver for nano-packaging as described above, this workshop
was also opened to a second trend which concerns nanomaterials for microelec-
tronics. Nanomaterials bring new solutions for detection not only in sensor appli-
cation or in passive components technology, but also in improving packaging of
actual microelectronics components. In particular, CNT could be a solution for
highlyelectricallyandthermallyconductiveinterconnections.CNTincorporatedin
an insulator matrix could also make the composite conductor. Biomaterials also
appear as a new solution for nanoscale interconnections. By analyzing actual and
future microelectronics and packaging requirements, it seems that solutions could
v
vi Preface
befoundattheinterfacebetweenatop-downapproachlyingonsiliconandatomic
scale technologies and a bottom-up approach consisting in the integration of
functionalized nano-objects.
We thank the European Commission’s ICT-FET program and the staff of
Springer Verlag for their help in producing this book. The organizing committee
also wishes to thank all the participants for their fantastic participation to the
workshop.
Xavier Baillin
Christian Joachim
Gilles Poupon
Contents
Utilization of Peridynamic Theory for Modeling at the Nano-Scale . . . 1
E. Oterkus, C. Diyaroglu, N. Zhu, S. Oterkus and E. Madenci
DNA Metallization Processes and Nanoelectronics. . . . . . . . . . . . . . . . 17
Arianna Filoramo
EvaluationofLeakageCurrentin1-DSilicon Dangling-Bond Wire
Due to Dopants. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
R. Robles, M. Kepenekian and N. Lorente
Direct Integration of Carbon Nanotubes in Si Microsystems . . . . . . . . 41
Knut E. Aasmundtveit
Nanopackaging Requests for Atomic Scale Circuits
and Molecule-Machines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Christian Joachim
Single-Crystal Au Triangles as Reconfigurable Contacts
for Atomically Smooth Surfaces: Ultra-High Vacuum
Transfer-Printing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Cedric Troadec, René Heimbuch, Deng Jie, Olga Neucheva,
Ramesh Thamankar, Yap Tiong Leh and Christian Joachim
Site-SelectiveSelf-AssemblyofNano-ObjectsonaPlanarSubstrate
Based on Surface Chemical Functionalization. . . . . . . . . . . . . . . . . . . 93
FranciscoPalazon,PedroRojoRomeo,AliBelarouci,CélineChevalier,
HassanChamas,ÉlianeSouteyrand,AbdelkaderSouifi,YannChevolot
and Jean-Pierre Cloarec
vii
viii Contents
Silicon Technologies for Nanoscale Device Packaging . . . . . . . . . . . . . 113
AurélieThuaire,Gaëlle LeGac,GuillaumeAudoit,FrançoisAussenac,
Caroline Rauer, Emmanuel Rolland, Jean-Michel Hartmann,
Anne-Marie Charvet, Hubert Moriceau, Pierrette Rivallin,
Patrick Reynaud, Severine Cheramy, Nicolas Sillon and Xavier Baillin
Designing Carbon Nanotube Interconnects for Radio Frequency
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Christophe Brun, Chin Chong Yap, Dominique Baillargeat
and Beng Kang Tay
Packaging of Buckyballs/Buckytubes in Transparent Photo-Active
Inorganic Polymers: New Hope in the Area of Electronics
and Optoelectronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
Radhaballabh Debnath
Novel Nanostructured Passives for RF and Power Applications:
Nanopackaging with Passive Components. . . . . . . . . . . . . . . . . . . . . . 175
P. Markondeya Raj, Parthasarathi Chakraborti, Dibyajat Mishra,
Himani Sharma, Saumya Gandhi, Srikrishna Sitaraman
and Rao Tummala
Utilization of Peridynamic Theory
for Modeling at the Nano-Scale
E. Oterkus, C. Diyaroglu, N. Zhu, S. Oterkus and E. Madenci
Abstract Peridynamic theory is a new continuum mechanics formulation that has
several advantages over the traditional approaches, such as Classical Continuum
Mechanics (CCM) and Molecular Dynamics (MD). Due to its length-scale
parameter, horizon, it is capable of capturing phenomena occurring at different
length scales, including the nano-scale. Furthermore, van der Waals forces can be
represented in a straightforward manner using a buffer-layer approach. In this
chapter, various demonstration problems are presented to show the capability of
peridynamics at the nano-scale, including nano-indentation and failure analysis of
graphene sheets.
1 Introduction
Traditionally,thereexisttwomainapproachestosimulatethemechanicalbehavior
of materials at the nano-scale. The first approach is based on Classical Continuum
Mechanics (CCM) when the continuum assumption is valid. When nano-scale
effects become significant, it is no longer applicable since it does not have a
length-scale parameter. Furthermore, its equation of motion is not suitable for
problems including discontinuities since the spatial derivatives are not defined in
such cases. The second approach is based on Molecular Dynamics (MD). It is a
powerful tool as long as the interactions between atoms and molecules are well
defined.However,evenwithcurrentpowerfulsupercomputers,thetotalsimulation
time and size of the models are still limited. Therefore, it is necessary to use a
methodology that is based on continuum mechanics and have a length-scale
E.Oterkus(&)(cid:1)C.Diyaroglu(cid:1)N.Zhu
DepartmentofNavalArchitecture,OceanandMarineEngineering,
UniversityofStrathclyde,100MontroseStreet,GlasgowG40LZ,UK
e-mail:[email protected]
S.Oterkus(cid:1)E.Madenci
DepartmentofAerospaceandMechanicalEngineering,UniversityofArizona,
1130N.MountainAvenue,Tucson,AZ85721,USA
©SpringerInternationalPublishingSwitzerland2015 1
X.Baillinetal.(eds.),Nanopackaging:FromNanomaterials
totheAtomicScale,AdvancesinAtomandSingleMoleculeMachines,
DOI10.1007/978-3-319-21194-7_1
