Table Of ContentNanoimprinting and
Its Applications
Nanoimprinting and
Its Applications
edited by
Akihiro Miyauchi
Published by
Jenny Stanford Publishing Pte. Ltd.
Level 34, Centennial Tower
3 Temasek Avenue
Singapore 039190
Email: [email protected]
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Nanoimprint and Its Applications
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ISBN 978-981-4800-37-2 (Hardcover)
ISBN 978-0-429-03192-2 (eBook)
Contents
Preface
1. In troduc tion x1i
Akihiro Miyauchi
1.1 Background 1
1.2 Principle of Nanoimprinting 2
2. 1Te.3m platAep Tpelcihcnatoiloongsy 35
Akihiro Miyauchi
2.1 Template Fabrication 6
2.1.1 Photolithography 6
2.1.2 Self-Organization by a Block Copolymer 8
2.1.3 Self-Organization by Anodic Oxidation 10
2.1.4 Interference Exposure 11
2.2 Release Process 12
2.2.1 Release Layer 12
2.2.2 Degradation of the Release Layer 14
3. Thermal2 N.2a.3no imRpercionvtienrgy of the Release Layer 1261
Akihiro Miyauchi
3.1 Process 21
3.2 Resin Materials 22
3.3 Molds 24
3.4 Equipment 27
3.5 Example of Thermal Nanoimprinting: Sheet
Nanoimprinting 29
3.5.1 Experimental 29
4. Photona3n.o5i.2m prRinetsinuglt s and Analysis 3315
Akihiro Miyauchi
4.1 Process 35
vi Contents
4.2 Materials 37
4.2.1 UV-Curable Resin 37
4.2.2 Coupling Treatment 39
4.3 Molds 41
4.3.1 Glass Mold 41
4.3.2 Soft Mold 42
4.4 Equipment 43
4.4.1 Parallel Press 44
4.4.2 Roll Press 45
4.5 Example of Photonanoimprinting 46
4.5.1 Process Sequence 46
4.5.2 Soft Mold 47
4.5.3 Coupling Treatment Process 48
4.5.4 Dry Etching of Aluminum 50
Appendix A: Fidelity of a Soft Mold 50
Appendix B: Resin Viscosity in Nanospace 53
5. Room-TeAmpppeernadtiuxr eC :N Raensotirmicptiroinnt ionfg A ir Bubbles 5663
Shinji Matsui
5.1 Introduction 63
5.2 RT-NI L Using a PDMS Mold 66
5.2.1 Patterning 66
5.2.2 Three-Dimensional Nanostructure
Fabrication 71
5.3 Exam ple of NIL 73
5.3.1 Moth Eye Structure Fabrication 73
5.3.2 Gold Nanoparticle Formation Using an
Imprinted HSQ Pattern for SERS 74
6. 5B.a4s ic MCecohnacnluissmiosn osf Nanoimprint Lithography 7873
Yoshihiko Hirai
6.1 Introduction 83
6.2 Basic Process Mechanisms 84
6.3 Result and Discussion 86
6.3.1 Impact of the Applied Pressure 86
6.3.2 Impact of the Aspect Ratio 87
6.3.3 Impact of the Initial Resin Thickness 89
6.4 Defect Analysis and Process Optimization 91
Contents vii
6.4.1 Typical Defect in High-Aspect-Ratio
Pattern Fabrication 91
6.4.2 Simulation and Experiments 92
6.4.2.1 Step 1: Pressing and holding 93
6.4.2.2 Step 2: Cooling 94
6.4.2.3 Step 3: Releasing 94
6.4.3 Optimization of the Process Sequence 94
6.4.4 High-Aspect-Ratio Pattern Fabrication 95
6.5 Time-Dependent Analysis 96
6.5.1 Numerical Models 96
6.5.2 Experimental Study 97
6.5.3 Result and Discussion 98
7. 6U.V6 NanoSuimmpmrinart yL ithography Process Simulation 19093
Yoshihiko Hirai
7.1 Introduction 103
7.2 Resist-Filling Process 104
7.2.1 Numerical Model 104
7.2.2 Resist Droplet Process under Air
Ambient 105
7.2.3 Resist Spin-Coating Process under
Condensable Gas Ambient 107
7.3 UV Exposure Process 111
7.3.1 Numerical Model 111
7.3.2 Simulation Models and Demonstrations 111
7.3.2.1 Impact of feature size 111
7.3.2.2 Impact of optical index 112
7.4 UV Curing Process 113
7.4.1 Numerical Model 113
7.5 Experimental Results 115
7.5.1 Photoinitiator Concentration during
UV Exposure 115
7.5.2 Monomer Conversion 116
7.5.3 Elastic Modulus 117
8. 7D.e6m oldSinugm Pmroacreys s Simulation 111281
Yoshihiko Hirai
8.1 Introduction 121
viii Contents
8.2 Numerical Model 122
8.2.1 Numerical Model 122
8.2.2 Parameter Extraction by Experiment 123
8.3 Demolding Mechanism P P 125
8.4 Result and Discussion 128
8.4.1 Impact on the Critical Stresses sand n 128
8.4.2 Impact on Aspect Ratio 130
8.4.3 Impact on Sidewall Slope Angle 131
9. 8M.5e asureSmumenmt aarnyd Analysis Methods in Nanoimprinting 113369
Makoto Okada and Yoshihiko Hirai
9.1 Pattern Observation by Scanning Electron
Microscopy 140
9.2 Pattern Observation and Frictional Force
Measurements by Atomic Force Microscopy 143
9.3 Differential Scanning Calorimetry for Glass
10. ApplicatTioranns sition Temperature and UV Curing Speed 114593
Akihiro Miyauchi and Hiroshi Sato
10.1 Optical Applications 153
10.1.1 Antireflection 154
10.1.2 Polarizer 156
10.1.3 Microlens 158
10.2 Biodevices 160
10.2.1 Cell Culture 160
10.2.2 Immunoassay 164
10.3 Applications to Energy Devices 168
10.3.1 Fuel Cells 168
10.3.2 Solar Cells 170
10.4 Electric Devices 172
10.5 Nanoimprint Lithography for the High-Volume
Manufacturing of Advanced Semiconductor
Devices 176
10.5.1 Introduction 176
10.5.2 Wafer Imprint Tool 177
10.5.2.1 Wafer throughput 177
10.5.2.2 Alignment and overlay 179
10.5.2.3 Defectivity and mask life 182
Contents ix
10.5.3 Mask Replication Systems 184
10.5.3.1 Critical dimension uniformity 185
10.5.3.2 Image placement 186
10.5.4 Conclusions 186
Index Appendix D: Bragg’s Law 186
193
