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About Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore
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Detailed Information
| Author: | Che, Faxing; Jin, Cheng; Lin, Tingyu; Zhao, Wensheng |
|---|---|
| Publication Year: | 2019 |
| ISBN: | 9780081025321 |
| Pages: | 427 |
| Language: | English |
| File Size: | 25.225 |
| Format: | |
| Price: | FREE |
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