MEMS Cost Analysis: From Laboratory to Industry

308 Pages·2014·42.177 MB·English

by  Ron Lawes

MEMS
Cost Analysis

Pan Stanford Series on Renewable Energy — Volume 2
MEMS
Cost Analysis
From Laboratory to Industry
editors
Preben Maegaard
Anna Krenz
Wolfgang Palz
Ron Lawes
The Rise of Modern Wind Energy
Wind Power
for the World
CRC Press
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Version Date: 20140514
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May1,2014 15:30 PSPBook-9inx6in 00-Ron-Lawes–prelims
To my wife, Jean, who has listened for 54 years (and
counting)tomyobsessionwithtechnology.Itwouldnot
have been possible to write this book if she had not
fed me, watered me and corrected some of the text,
butmainlyhadshenotpatientlywaitedseveralyearsfor
metoaddressnumeroushouseholdjobs.

May1,2014 15:30 PSPBook-9inx6in 00-Ron-Lawes–prelims
Contents
Preface xi
Acknowledgements xv
1 TheWorldofMEMS 1
1.1 Introduction 1
2 BasicFabricationProcesses 13
2.1 Introduction 13
2.2 Lithography,MasksandReticles 15
2.3 DepositionandEtching 19
2.4 TheSacrificialLayer 20
2.5 NumberofDiesperWafer 23
2.6 CleanRooms 29
3 SurfaceMicromachining 31
3.1 Introduction 31
3.2 OpticalMaskAligner 32
3.3 OpticalWaferStepper 36
3.4 Low-PressureChemicalVapourDeposition 41
3.5 Plasma-EnhancedChemicalVapourDeposition 44
3.6 ThermalOxideGrowth 46
3.7 DCandRFSputterDeposition 51
3.8 WetEtching 54
3.9 Reactive-IonEtching 57
3.10ChemicalMechanicalPolishing 61
3.11Electron-BeamPatternGeneration 63
3.12SurfaceMicroengineeringEquipmentSummary 69
May1,2014 15:30 PSPBook-9inx6in 00-Ron-Lawes–prelims
viii Contents
4 High-Aspect-RatioMicromachining 73
4.1 Introduction 73
4.2 DeepReactive-IonEtching 77
4.3 ExcimerLaserAblation 82
4.4 X-RayLIGA 85
4.5 UVLIGA 91
4.6 BulkMicromachining 94
4.7 WaferBonding 97
4.8 Electrodeposition 100
4.9 Critical-Point-Drying 104
4.10InjectionMoulding 107
4.11High-Aspect-RatioEquipmentSummary 109
5 MEMSTesting 115
5.1 Introduction 115
5.2 TestingofSemiconductors 116
5.3 TestingofMEMS 120
6 MEMSPackaging 125
6.1 Introduction 125
6.2 Packages 127
6.3 Dicing 131
6.4 DieAttach 134
6.5 WireBonding 136
6.6 LidSeal 140
6.7 Single-andMulti-DiePackaging 141
6.8 MEMSPackagingSummary 143
7 CleanRooms,BuildingsandPlant 147
7.1 Introduction 147
7.2 CleanRoomsandBuildingsforIntegratedCircuits 150
7.3 CleanRoomsandBuildingsforaMEMSFoundry 156
8 TheMEMSCOSTSpreadsheet 165
8.1 Introduction 165
8.2 BasicStructureoftheMEMSCOSTSpreadsheet 166
8.3 MasterSet-Up 167
8.4 ProcessLibraries 170
May1,2014 15:30 PSPBook-9inx6in 00-Ron-Lawes–prelims
Contents ix
8.5 FabricationMachineSimulators 173
8.6 TestandPackagingMachineSimulators 174
8.7 CMOS/BiCMOSSimulation 179
8.8 FinancialData 186
8.9 WaferandDieCalculations 187
8.10MEMSCOSTReports 188
8.11UnitCosts 190
9 ProductCosts:Accelerometers 197
9.1 Introduction 197
9.2 CostsforDieFabrication 205
9.3 RevenueEstimates 209
9.4 CostComparisonforTestingRegimes 215
9.5 CostComparisonbetweenSingle-andMulti-Die
Assemblies 218
9.6 SensitivityofCoststoManufacturingParameters 221
10 ProductCosts:Microphones 225
10.1 Introduction 225
10.2 CostsforDieFabrication 231
10.3 RevenueEstimates 235
10.4 CostComparisonsforTestingRegimes 240
10.5 CostComparisonbetweenSingle-andMulti-Die
Assembly 241
10.6 SensitivitytoManufacturingCosts 243
11 MEMSFoundries 247
11.1 Introduction 247
11.2 MEMSFoundries 248
11.3 Multi-ProductUseofProcessesandEquipment 249
11.4 MEMSFoundryLightlyLoaded 250
11.5 Multi-ProjectWafers 252
12 FinancialReportingandAnalysis 263
12.1 Introduction 263
12.2 KeyFinancialStatements 263
12.3 BusinessCase 264
12.3.1 ProductSpecification 265