MEMS and Nanotechnology-based Sensors and Devices for Communications Medical and Aerospace Appli

434 Pages·2008·6.04 MB·English

by  A. R. Jha

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MEMS and
Nanotechnology-Based
Sensors and Devices
for Communications,
Medical and
Aerospace
Applications
A.R. Jha,
Ph.D.
A.R.Jha/MEMSandNanotechnology-BasedSensorsandDevices AU8069_C000 FinalProof page ii 8.3.2008 6:13pm CompositorName:BMani
CRC Press
Taylor & Francis Group
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© 2008 by Taylor & Francis Group, LLC
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International Standard Book Number-13: 978-0-8493-8069-3 (Hardcover)
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Library of Congress Cataloging-in-Publication Data
Jha, A. R.
MEMS and nanotechnology-based sensors and devices for communications,
medical and aerospace applications / A.R. Jha.
p. cm.
“An Auerbach title.”
Includes bibliographical references and index.
ISBN-13: 978-0-8493-8069-3 (alk. paper)
ISBN-10: 0-8493-8069-3 (alk. paper)
1. Microelectromechanical systems. 2. Detectors. 3.
Telecommunication--Equipment and supplies. 4. Medical instruments and apparatus.
5. Aerospace engineering--Equipment and supplies. 6. Aeronautics--Equipment and
supplies. I. Title.
TK7875.J485 2008
620’.5--dc22 2007040799
Visit the Taylor & Francis Web site at
http://www.taylorandfrancis.com
and the CRC Press Web site at
http://www.crcpress.com
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Dedication
This book is dedicated to my beloved parents who always encouraged
metopursueadvancedresearchanddevelopmentstudiesinthefieldsof
science and latest technology for the benefits to mankind.
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Contents
Foreword...........................................................................................................xix
Preface...............................................................................................................xxi
Author.............................................................................................................xxix
1
Highlights and Chronological Developmental History of MEMS
Devices Involving Nanotechnology...............................................................1
1.1 Introduction..........................................................................................1
1.2 What Is MEMS?...................................................................................3
1.2.1 Frequently Used Terms in Nanotechnology..............................3
1.2.2 2005 MEMS Industry Overview and Sales Projections
for MEMS Devices...................................................................4
1.3 Potential Applications of MEMS Devices in Commercial
and Space Systems.................................................................................4
1.3.1 MEMS for Wireless, Base Stations, Satellites,
and Nanosatellites.....................................................................5
1.3.1.1 RF-MEMS Amplifier-Switched Filter Bank
Capabilities.................................................................6
1.3.1.2 Passive RF-MEMS Components................................7
1.3.2 RF-MEMS Technology for Base Station Requirements............9
1.4 MEMS Technology for Military Systems Applications........................11
1.4.1 Material Requirements for Fabrication
of MEMS Devices...................................................................13
1.4.2 Types of Nanostructures and Their Properties........................14
1.4.2.1 Surface Plasmon Resonance......................................16
1.4.2.2 Ceramics for MEMS Sensors...................................17
1.4.3 Fabrication of Critical Elements of a MEMS Device..............17
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1.4.4 MEMS Technology for Electronic Circuits
and Detectors for Military Applications................................19
1.4.4.1 Passive MEMS Devices for Commercial,
Military, and Space Applications............................19
1.4.5 Nanotechnology for Armors to Provide Protection
to Soldiers.............................................................................20
1.4.6 Nanotechnology-Based Biometric Structures
to Monitor Soldier Health....................................................20
1.4.7 Nanomaterials for External Support Muscles and Artificial
Muscles for Injured Soldiers on the Battlefield......................21
1.4.8 Robotic Arms for Battlefield Applications.............................21
1.4.9 Portable Radar Using MEMS/Nanotechnology
for Military Applications.......................................................22
1.5 MEMS for Commercial, Industrial, Scientific,
and Biomedical System Applications.................................................23
1.5.1 Nanotubes and Nanotube Arrays for Various
Applications..........................................................................23
1.5.2 MEMS-Based Video Projection System................................24
1.5.3 Nanotechnology for Photovoltaic Solar Cells and 3-D
Lithium Ion Microbatteries for MEMS Devices....................25
1.6 MEMS Technology for Hard-Disk Drives........................................26
1.6.1 MEMS Devices for Thermographic Nondestructive
Testing..................................................................................27
1.7 MEMS Devices for Uncooled Thermal Imaging Arrays
and Cooled Focal Planar Arrays for Various Applications..................28
1.8 Applications of Nanotechnology in IR and Electro-Optical
Sensors for Biometric and Security Applications................................29
1.8.1 Nanotechnology-Based Laser Scanning Systems....................30
1.8.2 MEMS-Based Sensors for Detection of Chemical
and Biological Threats...........................................................31
1.8.3 Potential Applications of Nanophotonic Sensors
and Devices...........................................................................31
1.8.4 MEMS Technology for Photonic Signal Processing
and Optical Communications...............................................32
1.9 MEMS Technology for Medical Applications...................................33
1.10 MEMS Technology for Satellite Communications
and Space Systems Applications........................................................34
1.11 MEMS Devices for Auto Industry Applications................................36
1.12 MEMS Technology for Aerospace System Applications....................37
1.13 Summary...........................................................................................38
References....................................................................................................39
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2
Potential Actuation Mechanisms, Their Performance Capabilities,
and Applications.........................................................................................41
2.1 Introduction........................................................................................41
2.2 Classification of Actuation Mechanisms..............................................43
2.3 Structural Requirements and Performance Capabilities
of Electrostatic Actuation Mechanism.................................................43
2.3.1 Electrostatic Actuation Mechanism.........................................43
2.3.1.1 Cantilever Beam Design Requirements....................45
2.3.2 Electrostatic Force Computation.............................................48
2.3.3 Pull-In and Pull-Out Voltage Requirements...........................54
2.3.3.1 Pull-In Voltage.........................................................57
2.3.3.2 Pull-Out Voltage......................................................62
2.3.3.3 Electrostatic Microactuator Configurations
for Generating Higher Force and Energy
Density Capabilities.................................................65
2.4 Piezoelectric Actuation Mechanism.....................................................66
2.4.1 Structural Material Requirements for Cantilever Beams..........68
2.4.2 Threshold Voltage...................................................................69
2.4.3 Tip Deflection of the Cantilever Beam...................................71
2.4.4 Bending Moment of the Cantilever Beam...............................71
2.4.5 Contact Force Requirements...................................................75
2.5 Electrothermal Actuation Mechanism.................................................78
2.6 Electromagnetic Actuation Mechanism...............................................83
2.6.1 Pull-In and Pull-Out Magnetomotive Forces..........................84
2.6.2 Actuation Force due to Induced Magnetic Force....................85
2.6.2.1 Parametric Trade-Off Computations........................87
2.7 Electrodynamic Actuation Mechanism................................................88
2.8 Electrochemical Actuation Mechanism................................................91
2.8.1 Classification and Major Benefits of CNT..............................92
2.8.2 MWCNT Arrays and Electrochemical Actuator
Performance............................................................................92
2.8.3 Fabrication and Material Requirements for the Actuator.........92
2.9 Summary.............................................................................................94
References....................................................................................................95
3
Latest and Unique Methods for Actuation.................................................97
3.1 Introduction........................................................................................97
3.2 Electrostatic Rotary Microactuator with Improved Shaped Design......98
3.2.1 Performance Limitation of Conventional Parallel-Plate
Electrodes................................................................................99
3.2.2 ESRM with Tilted Configuration.........................................100
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3.2.3 Requirements for Optimum Shaped Electrodes.....................100
3.2.4 Force Generation Computations of Rotary Actuator
with Conventional and Tilted Configurations.......................101
3.2.4.1 Actuation Force Computation
for Conventional Configuration.............................102
3.2.4.2 Force Generation Computation
for Tilted Configuration.........................................102
3.2.5 Torque-Generating Capability of the Rotary Actuator
with Tilted Configuration.....................................................109
3.2.6 Optimum Curve Shape of the Electrodes..............................110
3.2.6.1 Potential Electrode Shapes......................................110
3.2.6.2 Normalized Torque as a Function
of Normalized Angular Displacement.....................111
3.2.6.3 Parametric Requirements for Optimum
Rotary Microactuator.............................................115
3.3 Unique Microactuator Design for HHD Applications......................118
3.3.1 Introduction..........................................................................118
3.3.2 Benefits and Design Aspects of a Dual-Stage
Servomechanism (or MEMS Piggyback Actuator).................119
3.3.2.1 Architecture of a Third-Generation
Microactuator.........................................................120
3.3.2.2 Performance Capabilities of the MEMS
Piggyback Microactuator........................................120
3.3.3 Force Generation Capability, Displacement Limit,
and Mechanical Resonance Frequency Range........................122
3.3.3.1 Electrostatic Force Calculation...............................123
3.3.3.2 Mechanical Resonance Frequency
Calculation.............................................................123
3.3.3.3 Electrode Mass Computation.................................125
3.3.3.4 Displacement (x) as a Function of
Gap Size (g) and Number of Electrodes (N).........126
3.4 Capabilities of Vertical Comb Array Microactuator...........................127
3.4.1 Structural Requirements and Critical Design Aspects
of VCA Actuator...................................................................129
3.4.2 VCAM Performance Comparison with Other
Actuators...............................................................................130
3.4.3 Potential Comb Finger Shapes..............................................130
3.5 Capabilities of Bent-Beam Electrothermal Actuators.........................133
3.5.1 Performance Capabilities and Design Configuration
of Bent-Beam Electrothermal Actuators................................133
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3.5.2 Brief Description of the BBET Structure..............................134
3.5.3 Input Power Requirements for BBET Actuators...................139
3.6 Summary...........................................................................................140
References..................................................................................................140
4
Packaging, Processing, and Material Requirements
for MEMS Devices...................................................................................141
4.1 Introduction......................................................................................141
4.2 Packaging and Fabrication Materials.................................................142
4.2.1 Packaging Material Requirements and Packaging
Processes................................................................................144
4.2.1.1 Sealing Methods.....................................................145
4.2.2 Effects of Temperature on Packaging....................................146
4.2.3 Effect of Pressure on Packaging and Device Function...........146
4.2.4 Fabrication Aspects for MEMS Devices Incorporating
Nanotechnology....................................................................147
4.2.4.1 Thin-Film Capping Requirements
for MEMS Devices................................................149
4.2.4.2 Chip Capping and Bonding Requirements.............149
4.2.4.3 Transition and Feedthrough Requirements
for MEMS Devices................................................150
4.2.4.4 Material Requirements for Piezoelectric
Actuators................................................................151
4.2.4.5 Material Requirements for Structural
Support, Electrodes, and Contact Pads...................153
4.2.4.6 Requirements for Electrodeposition
and Electroplating Materials...................................153
4.3 Impact of Environments on MEMS Performance.............................154
4.3.1 Impact of Temperature Variations on Coefficient
of Thermal Expansion...........................................................155
4.3.2 Effects of Temperature on Thermal Conductivity
of Materials Used in MEMS.................................................156
4.3.3 Special Alloys Best Suited for MEMS Applications...............159
4.3.3.1 Benefits of CE-Alloys in RF/Microwave
MEMS Packaging..................................................160
4.3.3.2 Benefits of CE-Alloys for Thermal Backing
Plates......................................................................160
4.3.3.3 Benefits of CE-Alloys in Integrated Circuit
Assemblies..............................................................161
4.3.4 Bulk Materials Best Suited for Mechanical Design
of MEMS Devices.................................................................161