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About Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
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Detailed Information
| Author: | American Society of Mechanical Engineers. Applied Mechanics Division.; et al |
|---|---|
| Publication Year: | 1994 |
| ISBN: | 9780791814420 |
| Pages: | 336 |
| Language: | English |
| File Size: | 35.59 |
| Format: | |
| Price: | FREE |
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