LM138/LM338 5-Amp Adjustable Regulators datasheet

52 Pages·2016·0.78 MB·English

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CC1350
SWRS183–JUNE2016
CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU
1 Device Overview
1.1 Features
1
• World'sFirstDual-Band(Sub-1GHzand2.4GHz) • LowPower
WirelessMicrocontroller – WideSupplyVoltageRange:1.8to3.8 V
• Microcontroller – RX:5.4mA(Sub-1GHz),6.4mA(Bluetoothlow
– Powerful ARM® Cortex®-M3 energy,2.4GHz)
– EEMBCCoreMark® Score:142 – TXat+10dBm:13.4mA(Sub-1GHz)
– EEMBCULPBench™Score:158 – TXat+9dBm:22.3mA(Bluetoothlowenergy,
– ClockSpeedUpto48-MHz 2.4GHz)
– 128KBofIn-SystemProgrammableFlash – TXat+0dBm:10.5mA(Bluetoothlowenergy,
2.4GHz)
– 8KBofSRAMforCache
(orasGeneral-PurposeRAM) – Active-ModeMCU48MHzRunningCoremark:
2.5mA(51µA/MHz)
– 20KBofUltra-Low-LeakageSRAM
– Active-ModeMCU: 48.5CoreMark/mA
– 2-PincJTAGandJTAGDebugging
– Active-ModeSensorControllerat24MHz:
– SupportsOver-the-Air(OTA)Update
0.4mA+8.2µA/MHz
• Ultra-Low-PowerSensorController
– Sensor Controller, OneWakeupEverySecond
– CanRunAutonomouslyFromtheRestofthe
PerformingOne12-Bit ADCSampling:0.95 µA
System
– Standby:0.7 µA(RTCRunningandRAMand
– 16-Bit Architecture
CPURetention)
– 2KBofUltra-Low-LeakageSRAMforCodeand
– Shutdown:185nA(WakeuponExternalEvents)
Data
• RFSection
• EfficientCode-SizeArchitecture,Placingpartsof
TI-RTOS,Drivers, Bluetooth®lowenergy – 2.4-GHzRFTransceiverCompatibleWith
Bluetoothlowenergy4.2Specification
ControllerandBootloaderinROM
– ExcellentReceiverSensitivity –124dBmUsing
• RoHS-CompliantPackage
Long-RangeMode,–110dBmat50kbps(Sub-
– 7-mm ×7-mmRGZVQFN48(30GPIOs)
1GHz),
• Peripherals
–87dBmatBluetoothlowenergy
– AllDigitalPeripheralPinsCanBeRoutedto
– ExcellentSelectivity(±100kHz):56dB
AnyGPIO
– ExcellentBlockingPerformance(±10MHz):
– FourGeneral-PurposeTimerModules
90dB
(Eight 16-BitorFour32-BitTimers,PWMEach)
– ProgrammableOutputPowerupto+14 dBm
– 12-Bit ADC,200ksamples/s,8-Channel Analog
(Sub-1GHz)and+9dBmat2.4GHz(Bluetooth
MUX
lowenergy)
– ContinuousTimeComparator
– Single-EndedorDifferentialRFInterface
– Ultra-Low-PowerClockedComparator
– Suitablefor SystemsTargetingComplianceWith
– ProgrammableCurrentSource WorldwideRadioFrequencyRegulations
– UART • ETSIEN300220,EN303204(Europe)
– 2×SSI (SPI,MICROWIRE,TI) • EN300440Class2(Europe)
– I2C,I2S • EN300328(Europe)
– Real-TimeClock(RTC) • FCCCFR47Part15(US)
– AES-128SecurityModule • ARIBSTD-T66(Japan)
– TrueRandomNumberGenerator(TRNG)
• ARIBSTD-T108(Japan)
– SupportforEightCapacitiveSensingButtons
– WirelessM-BusandselectedIEEE802.15.4g
– IntegratedTemperatureSensor PHY
• ExternalSystem SPACER
– On-ChipInternalDC-DCConverter SPACER
– SeamlessIntegrationWiththe SimpleLink™
SPACER
CC1190andCC2592RangeExtenders
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.
CC1350
SWRS183–JUNE2016 www.ti.com
• ToolsandDevelopmentEnvironment – Sensor ControllerStudio
– Full-FeatureandLow-CostDevelopmentKits – SmartRF™Studio
– MultipleReferenceDesignsforDifferentRF – SmartRFFlashProgrammer 2
Configurations – IAREmbeddedWorkbench® for ARM
– PacketSnifferPCSoftware – CodeComposerStudio™
1.2 Applications
• 315-, 433-, 470-,500-,779-,868-,915-, • WirelessHealthcareApplications
920-MHzand2.4-GHz ISMandSRDSystems • WirelessSensor Networks
• Low-PowerWirelessSystems • ActiveRFID
With50-kHzto5-MHzChannelSpacing
• IEEE802.15.4g,IP-EnabledSmartObjects
• HomeandBuildingAutomation (6LoWPAN),WirelessM-Bus,KNXSystems,
• WirelessAlarmandSecuritySystems Wi-SUN™,andProprietarySystems
• IndustrialMonitoringandControl • Energy-HarvestingApplications
• BluetoothlowenergyBeaconManagement • ElectronicShelfLabel(ESL)
• BluetoothlowenergyCommissioning • Long-RangeSensorApplications
• Smart GridandAutomaticMeterReading • Heat-CostAllocators
1.3 Description
The CC1350 is a member of the CC26xx and CC13xx family of cost-effective, ultra-low-power, 2.4 GHz
and Sub-1 GHz RF devices. Very low active RF and microcontroller (MCU) current consumption, in
addition to flexible low-power modes, provide excellent battery lifetime and allow long range operation on
smallcoin-cellbatteriesandinenergy-harvestingapplications.
The CC1350 is the first device in the CC13xx and CC26xx family of cost-effective, ultra-low-power
wireless MCUs capable of handling both Sub-1 GHz and 2.4 GHz RF frequencies. The CC1350 device
combinesaflexible,verylow-powerRFtransceiverwithapowerful48-MHzCortex-M3microcontrollerina
platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Cortex-M0)
handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power
and flexibility to handle both Sub-1 GHz protocols and 2.4 GHz protocols (for example Bluetooth low
energy). This enables the combination of a Sub-1 GHz communication solution that offers the best
possible RF range together with a Bluetooth low energy smartphone connection that enables great user
experiencethroughaphoneapplication.TheSub-1GHzonlydeviceinthisfamilyistheCC1310.
The CC1350 device is a highly integrated, true single-chip solution incorporating a complete RF system
andanon-chipDC-DCconverter.
Sensors can be handled in a very low-power manner by a dedicated autonomous ultra-low-power MCU
that can be configured to handle analog and digital sensors; thus the main MCU (Cortex-M3) can
maximizesleeptime.
The CC1350 power and clock management and radio systems require specific configuration and handling
by software to operate correctly, which has been implemented in the TI-RTOS. TI recommends using this
software framework for all application development on the device. The complete TI-RTOS and device
driversareofferedinsourcecodefreeofcharge.
DeviceInformation(1)
PARTNUMBER PACKAGE BODYSIZE(NOM)
CC1350F128RGZ VQFN(48) 7.00mm×7.00mm
(1) Formoreinformation,seeSection9,Mechanical,Packaging,andOrderableInformation.
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1.4 Functional Block Diagram
Figure1-1showsablockdiagramfortheCC1350device.
SimpleLinkTM CC1350 Wireless MCU
cJTAG RF core
Main CPU: ROM
ADC
ADC
ARM® 128-KB
Flash
Digital PLL
Cortex®-M3
DSP Modem
8-KB
Cache ARM® 4-KB
SRAM
Cortex®-M0
20-KB
ROM
SRAM
General Peripherals / Modules Sensor Controller
Sensor Controller
I2C 4x 32-Bit Timers
Engine
UART 2x SSI (SPI,(cid:181)W,TI)
12-Bit ADC, 200ks/s
I2S Watchdog Timer
2x Analog Comparators
10 / 15 / 30 GPIOs TRNG
SPI / I2C Digital Sensor IF
AES Temp. / Batt. Monitor
Constant Current Source
32 ch. PDMA RTC
Time-to-Digital Converter
DC-DC Converter 2-KB SRAM
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Figure1-1.CC1350BlockDiagram
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Table of Contents
1 DeviceOverview......................................... 1 6.2 Main CPU........................................... 31
.............................................. .............................................
1.1 Features 1 6.3 RF Core 32
........................................... ...................................
1.2 Applications 2 6.4 Sensor Controller 33
............................................ ..............................................
1.3 Description 2 6.5 Memory 34
............................ ...............................................
1.4 FunctionalBlockDiagram 3 6.6 Debug 34
2 Revision History......................................... 4 6.7 PowerManagement................................. 35
3 DeviceComparison ..................................... 5 6.8 ClockSystems...................................... 36
..................................... ..................
3.1 RelatedProducts 5 6.9 GeneralPeripheralsandModules 36
4 TerminalConfigurationandFunctions.............. 6 6.10 System Architecture................................. 37
4.1 PinDiagram–RGZPackage........................ 6 7 Application,Implementation,andLayout......... 38
4.2 SignalDescriptions–RGZPackage................. 7 7.1 SimplelinkCC1350LaunchPadBluetoothandSub-
.....
5 Specifications ............................................ 9 1GHzLongRangeWirelessDevelopmentKit 38
.......................... 8 DeviceandDocumentationSupport............... 39
5.1 AbsoluteMaximumRatings 9
...............................
.......................................... 8.1 Device Nomenclature 39
5.2 ESDRatings 9
.................................
................ 8.2 ToolsandSoftware 40
5.3 RecommendedOperatingConditions 9
.............................
...................... 8.3 DocumentationSupport 41
5.4 PowerConsumptionSummary 10
........
.................................. 8.4 TexasInstrumentsLow-PowerRFWebsite 41
5.5 RF Characteristics 11
.........................
............. 8.5 Low-PowerRFeNewsletter 41
5.6 Receive(RX)Parameters,Sub-1GHz 11
...............................
.............. 8.6 AdditionalInformation 41
5.7 Transmit(TX)ParametersSub-1GHz 13
..............................
........ 8.7 CommunityResources 42
5.8 1-MbpsGFSK(Bluetoothlowenergy)–RX 14
..........................................
........ 8.8 Trademarks 42
5.9 1-MbpsGFSK(Bluetoothlowenergy)–TX 15
.....................
..................................... 8.9 ElectrostaticDischargeCaution 42
5.10 PLLParameters 15
...............................
............................. 8.10 ExportControlNotice 42
5.11 Thermal Characteristics 16
.............................................
............... 8.11 Glossary 43
5.12 TimingandSwitchingCharacteristics 16
.............................. 9 MechanicalPackagingandOrderable
5.13 TypicalCharacteristics 23
Information.............................................. 43
6 DetailedDescription................................... 31
..............................
............................................ 9.1 PackagingInformation 43
6.1 Overview 31
2 Revision History
DATE REVISION NOTES
June2016 SWRS183* InitialRelease
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3 Device Comparison
Table3-1.DeviceFamilyOverview
FLASH RAM
DEVICE PHYSUPPORT GPIOs PACKAGESIZE
(KB) (KB)
Proprietary,WirelessM-Bus,IEEE802.15.4g,
CC1350F128RGZ 128 20 30 7mm×7mm
Bluetoothlowenergy
3.1 Related Products
WirelessConnectivity The wireless connectivity portfolio offers a wide selection of low power RF
solutions suitable for a broad range of application. The offerings range from fully customized
solutionstoturnkeyofferingswithpre-certifiedhardwareandsoftware(protocol).
Sub-1GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1
GHzISMbands.
CompanionProducts Review products that are frequently purchased or used in conjunction with this
product.
ReferenceDesignsforCC1350 TI Designs Reference Design Library is a robust reference design
library spanning analog, embedded processor and connectivity. Created by TI experts to
help you jump-start your system design, all TI Designs include schematic or block diagrams,
BOMs and design files to speed your time to market. Search and download designs at
ti.com/tidesigns.
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4 Terminal Configuration and Functions
4.1 Pin Diagram – RGZ Package
C
C
D
O_23 SET_N DS_DC DC_SW O_22 O_21 O_20 O_19 O_18 O_17 O_16 AG_TCK
DI RE VD DC DI DI DI DI DI DI DI JT
6 5 4 3 2 1 0 9 8 7 6 5
3 3 3 3 3 3 3 2 2 2 2 2
DIO_24 37 24 JTAG_TMSC
DIO_25 38 23 DCOUPL
DIO_26 39 22 VDDS3
DIO_27 40 21 DIO_15
DIO_28 41 20 DIO_14
DIO_29 42 CC13xx 19 DIO_13
DIO_30 43 18 DIO_12
VQFN48 7x7
VDDS 44 17 DIO_11
DCDC
VDDR 45 16 DIO_10
X24M_N 46 15 DIO_9
X24M_P 47 14 DIO_8
VDDR_RF 48 13 VDDS2
1 2 3 4 5 6 7 8 9 10 11 12
P N X 1 2 1 2 3 4 5 6 7
_ _ T Q Q _ _ _ _ _ _ _
F F _ _ _ O O O O O O O
R R RX 2K 2K DI DI DI DI DI DI DI
3 3
X X
Figure4-1.RGZ(7-mm ×7-mm)Pinout,0.5-mmPitch
I/OpinsmarkedinFigure4-1inbold havehighdrivecapabilities;theyarethefollowing:
• Pin10,DIO_5
• Pin11,DIO_6
• Pin12,DIO_7
• Pin24,JTAG_TMSC
• Pin26,DIO_16
• Pin27,DIO_17
I/OpinsmarkedinFigure4-1initalics haveanalogcapabilities.
• Pin36,DIO_23
• Pin37,DIO_24
• Pin38,DIO_25
• Pin39,DIO_26
• Pin40,DIO_27
• Pin41,DIO_28
• Pin42,DIO_29
• Pin43,DIO_30
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4.2 Signal Descriptions – RGZ Package
Table4-1.Signal Descriptions –RGZPackage
PIN
TYPE DESCRIPTION
NAME NO.
DCDC_SW 33 Power OutputfrominternalDC-DC(1)(2)
DCOUPL 23 Power 1.27-Vregulateddigital-supply(decouplingcapacitor)(2)
DIO_1 6 DigitalI/O GPIO,SensorController
DIO_2 7 DigitalI/O GPIO,SensorController
DIO_3 8 DigitalI/O GPIO,SensorController
DIO_4 9 DigitalI/O GPIO,SensorController
DIO_5 10 DigitalI/O GPIO,SensorController,high-drivecapability
DIO_6 11 DigitalI/O GPIO,SensorController,high-drivecapability
DIO_7 12 DigitalI/O GPIO,SensorController,high-drivecapability
DIO_8 14 DigitalI/O GPIO
DIO_9 15 DigitalI/O GPIO
DIO_10 16 DigitalI/O GPIO
DIO_11 17 DigitalI/O GPIO
DIO_12 18 DigitalI/O GPIO
DIO_13 19 DigitalI/O GPIO
DIO_14 20 DigitalI/O GPIO
DIO_15 21 DigitalI/O GPIO
DIO_16 26 DigitalI/O GPIO,JTAG_TDO,high-drivecapability
DIO_17 27 DigitalI/O GPIO,JTAG_TDI,high-drivecapability
DIO_18 28 DigitalI/O GPIO
DIO_19 29 DigitalI/O GPIO
DIO_20 30 DigitalI/O GPIO
DIO_21 31 DigitalI/O GPIO
DIO_22 32 DigitalI/O GPIO
DIO_23 36 Digital/AnalogI/O GPIO,SensorController,analog
DIO_24 37 Digital/AnalogI/O GPIO,SensorController,analog
DIO_25 38 Digital/AnalogI/O GPIO,SensorController,analog
DIO_26 39 Digital/AnalogI/O GPIO,SensorController,analog
DIO_27 40 Digital/AnalogI/O GPIO,SensorController,analog
DIO_28 41 Digital/AnalogI/O GPIO,SensorController,analog
DIO_29 42 Digital/AnalogI/O GPIO,SensorController,analog
DIO_30 43 Digital/AnalogI/O GPIO,SensorController,analog
EGP – Power Ground;exposedgroundpad
JTAG_TMSC 24 DigitalI/O JTAGTMSC,high-drivecapability
JTAG_TCKC 25 DigitalI/O JTAGTCKC(3)
RESET_N 35 Digitalinput Reset,active-low.Nointernalpullup.
NegativeRFinputsignaltoLNAduringRX
RF_N 2 RFI/O
NegativeRFoutputsignalfromPAduringTX
PositiveRFinputsignaltoLNAduringRX
RF_P 1 RFI/O
PositiveRFoutputsignalfromPAduringTX
VDDR 45 Power 1.7-Vto1.95-Vsupply,connecttooutputofinternalDC-DC(4)(2)
(1) SeetechnicalreferencemanuallistedinSection8.3formoredetails.
(2) Donotsupplyexternalcircuitryfromthispin.
(3) Importantnotice,fordesignconsiderationregradingnoiseimmunityforthispin,refertotheJTAGInterfacechapterinCC13xx,CC26xx
SimpleLink™WirelessMCUTechnicalReferenceManual
(4) IfinternalDC-DCisnotused,thispinissuppliedinternallyfromthemainLDO.
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Table4-1.SignalDescriptions –RGZPackage(continued)
PIN
TYPE DESCRIPTION
NAME NO.
VDDR_RF 48 Power 1.7-Vto1.95-Vsupply,connecttooutputofinternalDC-DC(5)(2)
VDDS 44 Power 1.8-Vto3.8-Vmainchipsupply(1)
VDDS2 13 Power 1.8-Vto3.8-VDIOsupply(1)
VDDS3 22 Power 1.8-Vto3.8-VDIOsupply(1)
VDDS_DCDC 34 Power 1.8-Vto3.8-VDC-DCsupply
X24M_N 46 AnalogI/O 24-MHzcrystaloscillatorpin1
X24M_P 47 AnalogI/O 24-MHzcrystaloscillatorpin2
RX_TX 3 RFI/O OptionalbiaspinfortheRFLNA
X32K_Q1 4 AnalogI/O 32-kHzcrystaloscillatorpin1
X32K_Q2 5 AnalogI/O 32-kHzcrystaloscillatorpin2
(5) IfinternalDC-DCisnotused,thispinmustbeconnectedtoVDDRforsupplyfromthemainLDO.
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5 Specifications
5.1 Absolute Maximum Ratings
overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1)(2)
MIN MAX UNIT
VDDS(3) Supplyvoltage –0.3 4.1 V
Voltageonanydigitalpin(4) –0.3 VDDS+0.3,max4.1 V
VoltageoncrystaloscillatorpinsX32K_Q1,X32K_Q2,X24M_N,andX24M_P –0.3 VDDR+0.3,max2.25 V
Voltagescalingenabled –0.3 VDDS
V VoltageonADCinput Voltagescalingdisabled,internalreference –0.3 1.49 V
in
Voltagescalingdisabled,VDDSasreference –0.3 VDDS/2.9
InputRFlevel 10 dBm
T Storagetemperature –40 150 °C
stg
(1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings
only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating
Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.
(2) Allvoltagevaluesarewithrespecttoground,unlessotherwisenoted.
(3) VDDS2andVDDS3mustbeatthesamepotentialasVDDS.
(4) Includinganalog-capableDIO
5.2 ESD Ratings
VALUE UNIT
Humanbodymodel(HBM),perANSI/ESDA/JEDECJS001(1) Allpins ±3000
V Electrostaticdischarge V
ESD Chargeddevicemodel(CDM),perJESD22-C101(2) Allpins ±500
(1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.
(2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.
5.3 Recommended Operating Conditions
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
MIN MAX UNIT
Ambienttemperature –40 85 °C
Foroperationinbattery-poweredand3.3-V
Operatingsupplyvoltage(VDDS) systems(internalDC-DCcanbeusedtominimize 1.8 3.8 V
powerconsumption)
Risingsupplyvoltageslewrate 0 100 mV/µs
Fallingsupplyvoltageslewrate 0 20 mV/µs
Fallingsupplyvoltageslewrate,withlow-powerflashsetting(1) 3 mV/µs
Positivetemperaturegradientinstandby(2) Nolimitationfornegativetemperaturegradient,or 5 °C/s
outsidestandbymode
(1) Forsmallcoin-cellbatteries,withhighworst-caseend-of-lifeequivalentsourceresistance,a22-µFVDDSinputcapacitormustbeused
toensurecompliancewiththisslewrate.
(2) ApplicationsusingRCOSC_LFassleeptimermustalsoconsiderthedriftinfrequencycausedbyachangeintemperature(see32-kHz
RCOscillator(RCOSC_LF)).
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5.4 Power Consumption Summary
MeasuredontheTexasInstrumentsCC1310EM-7XD-7793referencedesignunlessotherwisenoted.T =25°C,V =3.6V
c DDS
withDC-DCenabled,unlessotherwisenoted.Usingboostmode(increasingVDDRto1.95V),willincreasecurrentsinthis
tableby15%(doesnotapplytoTX14-dBmsettingwherethiscurrentisalreadyincluded).
PARAMETER TESTCONDITIONS TYP UNIT
Reset.RESET_NpinassertedorVDDSbelowpower-on-reset
100
threshold nA
Shutdown.Noclocksrunning,noretention 185
Standby.WithRTC,CPU,RAM,and(partial)registerretention.
0.7
RCOSC_LF
Standby.WithRTC,CPU,RAM,and(partial)registerretention. µA
0.8
XOSC_LF
Idle.SupplySystemsandRAMpowered. 570
Active.MCUrunningCoreMarkat48MHz 1.2mA+25.5µA/MHz
Active.MCUrunningCoreMarkat48MHz 2.5
mA
Active.MCUrunningCoreMarkat24MHz 1.9
Corecurrent RadioRX,measuredonCC1350EM-7XD-DualBandreference
I 5.4 mA
core consumption design,868MHz
RadioRX,measuredonCC1350EM-7XD-DualBandreference
6.4 mA
design,Bluetoothlowenergy,2440MHz
RadioTX,10-dBmoutputpower,(G)FSK,868MHz 13.4 mA
RadioTX,10-dBmoutputpower,measuredonCC1350EM-
14.2 mA
7XD-DualBandreferencedesign,868MHz
RadioTXBluetoothlowenergy,0-dBmoutputpower,measured
10.5 mA
onCC1350EM-7XD-DualBandreferencedesign,2440MHz
RadioTX,boostmode(VDDR=1.95V),14-dBmoutputpower,
23.5 mA
(G)FSK,868MHz
RadioTX,boostmode(VDDR=1.95V),14-dBmoutputpower,
measuredonCC1350EM-7XD-DualBandreferencedesign,868 24.4 mA
MHz
RadioTXBluetoothlowenergy,boostmode(VDDR=1.95V),
9-dBmoutputpower,measuredonCC1350EM-7XD-DualBand 22.3 mA
referencedesign,2440MHz
PERIPHERALCURRENTCONSUMPTION(1)(2)(3)
Peripheralpower
Deltacurrentwithdomainenabled 20
domain
Serialpowerdomain Deltacurrentwithdomainenabled 13
Deltacurrentwithpowerdomainenabled,
RFcore 237
clockenabled,RFcoreidle
µDMA Deltacurrentwithclockenabled,moduleidle 130
I µA
peri
Timers Deltacurrentwithclockenabled,moduleidle 113
I2C Deltacurrentwithclockenabled,moduleidle 12
I2S Deltacurrentwithclockenabled,moduleidle 36
SSI Deltacurrentwithclockenabled,moduleidle 93
UART Deltacurrentwithclockenabled,moduleidle 164
(1) AddstocorecurrentI foreachperipheralunitactivated
core
(2) I isnotsupportedinstandbyorshutdownmodes.
peri
(3) Measuredat3.0V
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