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Leakage in Nanometer CMOS Technologies PDF

310 Pages·2006·17.226 MB·English
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by Siva G. Narendra, Anantha P. Chandrakasan| 2006| 310 pages| 17.226| English

About Leakage in Nanometer CMOS Technologies

Взято с ozon.ru:"The goal of Leakage in Nanometer CMOS Technologies is to provide a sample detail so that the reader can understand why leakage power components are becoming increasingly relevant in CMOS systems that use nanometer scale MOS devices. Leakage current sources at the MOS device level including sub-threshold and different types of tunneling are discussed in detail. The book covers a promising solutions at the device, circuit, and architecture levels of abstraction. Manifestation of these MOS device leakage components at the full chip level depends considerably on several aspects including the nature of the circuit block, its state, its application workload, and Process/Voltage/Temperature conditions. The sensitivity of the various MOS leakage sources to these conditions are described from the first principles. The resulting manifestations are discussed at length to help the reader understand the effectiveness of leakage power reduction solutions under these different conditions. Case studies are presented to highlight real world examples that reap the benefits of leakage power reduction solutions. Finally, the book highlights different device design choices that exist to mitigate increases in the leakage components as technology scales."-Целью данной книги является детальное рассмотрение примеров для того, чтобы читатель мог понять, почему утечка мощности становится всё более и более значимой в КМОП системах, которые используют наноразмерные МОП элементы. То, что источники тока утечки на уровне МОП устройств включают в себя подпороговое и прочие типы туннелирования, подробно обсуждаются. В книге рассматриваются решения данной проблемы на уровне устройств, схем и архитектуры. Проявление этих КМОП компонетнов утечки в масштабах микросхемы значительно зависит от нескольких факторов таких как структура блока микросхем, его состояния, применения, техпроцесса/напряжения/температуры. Влияние этих факторов на различные источники утечки объясняется на основе вышеперечисленных принципов.В завершении,в книге подчёркнуты различные структуры устройств, выбор которых позволит перейти к рассмотрению такого компоненты утечки как технологический размер.Скриншот

Detailed Information

Author:Siva G. Narendra, Anantha P. Chandrakasan
Publication Year:2006
ISBN:9780387281339
Pages:310
Language:English
File Size:17.226
Format:PDF
Price:FREE
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