ISTFA 2000 : proceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington

515 Pages·2000·45.122 MB·English

ISTFA 2000
Proceedings of the
26th International Symposium for
Testing and Failure Analysis
12 - 16 November 2000
Meydenbauer Convention Center
Bellevue, Washington
Sponsored by
Published by
ASM International
Materials Park, Ohio 44073-0002
Copyright©2000
by
ASMInternational®
Allrightsreserved
Nopartofthisbookmaybereproduced,storedinaretrievalsystem,or transmitted,inanyformorbyany
means, electronic, mechanical, photocopying, recording, or otherwise, without the written permission of
thecopyrightowner.
Firstprinting,October2000
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ISBN:0-87170-701-2
SAN:204-7586
ASMInternational®
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The image on the cover shows one of the latest developments in microelectromechanical systems
(MEMS) at Sandia National Laboratories. The device shown is an electrostatically driven mechanical
actuator that operates at less than 20 volts using a simple square wave drive signal. The use of low
voltages and simple waveforms to drive MEMS devices is a key issue for the evolution of MEMS-based
microsystems. This actuator uses a torsional electrostatic comb drive that is coupled to an external ring
gear through a ratcheting system. In this design, the application of a periodic voltage signal causes the
inner combs to angularly vibrate about the torsional support springs. These small angular displacements
are converted to continuous rotation of the ring gear by the ratchet pawls. Because the actuator
producesa discrete displacement outputfor every applied voltage pulse,itcan be used for precise open-
looppositioncontrol.
The image is courtesy of Samuel L. Miller (Manager for Advanced Concepts for MEMS) and Stephen M.
Barnes(Torsionalratchetingactuatordesigner)fromSandiaNationalLaboratories. Formoreinformation,
pleasecontact:
SamuelL.Miller
[phone]
[email protected]
orvisittheSandiaNationalLaboratoriesMEMSwebsiteathttp://www.mems.sandia.gov.
iii
The Organizers of the 2000 International Symposium on Testing and Failure Analysis would like to
acknowledgeandthankthefollowingpeoplefortheirassistanceineditingthisproceedings:
D.Bodoh K.M.McCray
Motorola,Inc. DiversifiedTechnologiesResources
Austin,Texas ColoradoSprings,Colorado
V.Chowdhury J.McDaniel
AlteraCorporation LucentTechnologies
SanJose,California Orlando,Florida
S.Delgado S.V.Pabbisetty
AccurelSystemsInternational TexasInstruments
Sunnyvale,California Stafford,Texas
I.DeWolf J.C.H.Phang
IMEC NationalUniversityofSingapore
Leuven,Belgium Singapore
D.Dylis J.D.Plante
IITResearchInstitute PhilipsSemiconductors
ReliabilityAnalysisCenter(RAG) Sunnyvale,California
Rome,NewYork
H.S.Silvus,Jr.
B.Ebersberger SouthwestResearchInstitute
InfineonTechnologiesAG SanAntonio,Texas
Munich,Germany
J.Soden
C.Hartfield SandiaNationalLaboratories
TexasInstruments Albuquerque,NewMexico
Dallas,Texas
T.Taylor
C.L.Henderson WhiteOakSemiconductor
SandiaNationalLaboratories Sandston,Virginia
Albuquerque,NewMexico
M.Thayer
L.G.Henry AdvancedMicroDevices
ESD/TLPConsultant Austin,Texas
Fremont,California
M.Vanzi
K.N.Hooghan Universita'diCagliari
LucentTechnologies Cagliari,Italy
Allentown,Pennsylvania
K.-W.Yang
TektronixOscilloscopeGroup
Beaverton,Oregon
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ISTFA 2000 Organizing Committee
DanielL.Barton ChristopherL.Henderson
GeneralChair PanelDiscussion/UserGroupChair
SandiaNationalLaboratories SandiaNationalLaboratories
Albuquerque,NewMexico Albuquerque,NewMexico
RichardJ.Ross SandraDelgado
GeneralViceChair PublicityChair
IBMMicroelectronics AccurelSystemsInternational
EssexJunction,Vermont Sunnyvale,California
H.StanSilvus,Jr. ChristianBoit
TechnicalProgramChair SeminarCommitteeChair
SouthwestResearchInstitute InfineonTechnologiesAG
SanAntonio,Texas Munich,Germany
JamesB.Colvin JerryM.Soden
ExpositionChair SeminarCommitteeVice-Chair
ConsultingServices SandiaNationalLaboratories
Newark,California Albuquerque,NewMexico
ThomasM.Moore
AudioVisualChair
TexasInstruments
Dallas,Texas
EDFAS 2000 - 2001 Board of Directors
EdwardI.Cole,Jr. DanielL.Barton
EDFASPresident EDFASDirector-At-Large
SandiaNationalLaboratories SandiaNationalLaboratories
Albuquerque,NewMexico Albuquerque,NewMexico
LarryWagner ChristianBoit
EDFASImmediatePastPresident EDFASDirector-At-Large
TexasInstruments InfineonTechnologies/FA
Dallas,Texas Munich,Germany
RichardJ.Ross SandraDelgado
EDFASVicePresident EDFASDirector-At-Large
IBMMicroelectronics AccurelSystemsInternational
EssexJunction,Vermont Sunnyvale,California
GaryF.Shade JamesJ.Erickson
EDFASSecretary EDFASDirector-At-Large
VisteonMicroelectronics HughesSpaceandCommunicationsCo.
ColoradoSprings,Colorado ElSegundo,California
GlenGilfeather
EDFASDirector-At-Large
AMD
Austin,Texas
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ISTFA 2000 Committee Members
Expo Committee
JimColvin,Chair ConsultingServices,Newark,California
KathyRenteria Compaq,Cupertino,California
EfratRaz SelaUSA,Sunnyvale,California
A/V Committee
TomMoore,Chair TexasInstruments,Dallas,Texas
CherylHartfield,Vice-Chair TexasInstruments,Dallas,Texas
AnuBarman OkiSemiconductor,Sunnyvale,California
ChrisHenderson SandiaNationalLaboratories,Albuquerque,NewMexico
ScottWills TexasInstruments,Stafford,Texas
LeeKnauss Neocera,Beltsville,Maryland
EdwardKeyes SemiconductorInsights,Kanata,Ontario,Canada
StanSilvus SouthwestResearchInstitute,SanAntonio,Texas
CharlesOdegard TexasInstruments,Stafford,Texas
Seminar Committee
ChristianBoit,Chair Infineon,Munich,Germany
JerryM.Soden SandiaNationalLaboratories,Albuquerque,NewMexico
DaveBurgess AcceleratedAnalysis,HalfmoonBay,California
TomMoore TexasInstruments,Dallas,Texas
DickRoss IBMMicroelectronics,EssexJunction,Vermont
DeanTomasi IBMMicroelectronics,EastFishkill,NewYork
BrentWahl Agilent,SanJose,California
ScottWills TexasInstruments,Stafford,Texas
Discretes Committee
MassimoVanzi,Chair Universita'diCagliari,Cagliari,Italy
JimErickson HughesSpace&CommunicationsCo.,ElSegundo,California
GaryMolle KaiserElectronics,SanJose,California
NathalieLabat IXL–UniversityofBordeaux,Bordeaux,France
PaoloMalberti ETH,Zurich,Switzerland
Advanced Techniques Committee
JacobC.H.Phang,Chair UniversityofSingapore,Singapore
LudwigJ.Balk UniversityofWuppertal,Wuppertal,Germany
MehrdadMahanpour AdvancedMicroDevices,Sunnyvale,California
KiyoshiNikawa NECCorporation,Kanagawa,Japan
ValluriRao Intel,SantaClara,California
ScottWills TexasInstruments,Stafford,Texas
Backside Committee
MattThayer,Co-Chair AdvancedMicroDevices,Austin,Texas
DanBodoh,Co-Chair Motorola,Austin,Texas
MarkE.Potter LucentTechnologies,Allentown,Pennsylvania
DaveVallett IBMMicroelectronics,EssexJunction,Vermont
PeterNguyen TexasInstruments,Dallas,Texas
Testing Committee
JerryM.Soden,Chair SandiaNationalLaboratories,Albuquerque,NewMexico
CharlesF.Hawkins UniversityofNewMexico,Albuquerque,NewMexico
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ISTFA 2000 Committee Members (continued)
SPM Committee
BerndEbersberger,Chair InfineonTechnologies,Munich,Germany
RolandWiesendanger UniversityofHamburg,Hamburg,Germany
WilfriedVandervorst IMEC,Leuven,Belgium
PhilKaszuba IBMMicroelectronics,EssexJunction,Vermont
PaiboonTangyunyong SandiaNationalLaboratories,Albuquerque,NewMexico
NobuyukiNakagiri NikonCorporation,Tokyo,Japan
Techniques Committee
IngridDeWolf,Chair IMEC,Leuven,Belgium
SandraDelgado AccurelSystemsInternational,Sunnyvale,California
Jean-PierreLandesman Thomson-CSF,Orsay,France
JenniferMcDaniel LucentTechnologies,Orlando,Florida
ChrisPlougonven IBM,CorbeilEssonnes,France
Case Histories Committee
JimPlante,Chair PhilipsSemiconductors,Sunnyvale,California
SteveFerrier SDGAnalytic,Inc.,Corvallis,Oregon
ChristopherHenderson SandiaNationalLaboratories,Albuquerque,NewMexico
StacyGleixner SanJoseStateUniversity,SanJose,California
MakotoYamazaki AdvantestCorp.,Gunma,Japan
SandraDelgado AccurelSystemsInternational,Sunnyvale,California
Packaging Committee
KathyMcCray,Co-Chair DiversifiedTechnologies,ColoradoSprings,Colorado
CherylHartfield,Co-Chair TexasInstruments,Dallas,Texas
TomMoore TexasInstruments,Dallas,Texas
TomPaquette InsightAnalyticalLabs,ColoradoSprings,Colorado
DeepakGoyal Intel,Chandler,Arizona
RajenDias Intel,Chandler,Arizona
RodMartens Hewlett-Packard,FortCollins,Colorado
Military Committee
DavidDylis,Chair ReliabilityAnalysisCenter(RAC),Rome,NewYork
PerryMartin MartinEngineering,NorthHighlands,California
GeorgeSlenski USAirForce,WrightPattersonAFB,Ohio
DavidJohnson USAirForce,WrightPattersonAFB,Ohio
EddieWhite USAirForce,WrightPattersonAFB,Ohio
DaleHart UniversityofDaytonInstitute,USAirForce,WrightPattersonAFB,Ohio
JoeBuben DefenseSupplyCenterColumbus(DSCC),Columbus,Ohio
FIB Committee
KultaransinghHooghan,Chair LucentTechnologies,Allentown,Pennsylvania
AlanStreet IntegratedReliability,SanDiego,California
WilliamVanderlinde MicroelectronicsResearchLaboratory,Columbia,Maryland
AnnCampbell SandiaNationalLaboratories,Albuquerque,NewMexico
RoseRing AdvancedMicroDevices,Austin,Texas
StevenHerschbein IBMMicroelectronics,HopewellJunction,NewYork
vii
ISTFA 2000 Committee Members (continued)
Yield Enhancement Committee
TomTaylor,Co-Chair WhiteOakSemiconductor,Sandston,Virginia
SeshuPabbisetty,Co-Chair TexasInstruments,Stafford,Texas
SweeYongKhim UnitedTestandAssemblyCenterLtd.,Singapore
MarkRatner LSILogic,FortCollins,Colorado
LuisAndrade WhiteOakSemiconductor,Sandston,Virginia
EOS/ESD Committee
LeoG.Henry,Co-Chair ESD/TLPConsultant,Fremont,California
VijayChowdhury,Co-Chair AlteraCorporation,SanJose,California
MehrdadMahanpour AdvancedMicroDevices,SunnyvaleCalifornia
KoenVerhaege SarnoffCorporation,Princeton,NewJersey
MarkA.Kelly DelphiDelcoElectronics,Kokomo,Indiana
viii
1999 BEST PAPER AWARD
Detecting Power Shorts from Front and Backside of
IC Packages Using Scanning SQUID Microscopy
L.A.Knauss,B.M.Frazier,H.M.Christen,S.D.Silliman,K.S.Harshavardhan
Neocera,Inc.
Beltsville,Maryland
E.F.Fleet,F.C.Wellstood
UniversityofMaryland
CollegePark,Maryland
M.Mahanpour,A.Ghaemmaghami
AdvancedMicroDevices,Inc.
Sunnyvale,California
1999 OUTSTANDING PAPER AWARD
Light Emission Spectral Analysis: The Connection
Between the Electric Field and the Spectrum
D.L.Barton,P.Tangyunyong,J.M.Soden,C.L.Henderson,E.I.Cole,Jr.
SandiaNationalLaboratories
Albuquerque,NewMexico
R.Danz,R.Steiner
CarlZiess,Inc.
Jena,Germany
Z.Iwinski
CarlZeiss,Inc.
Thornwood,NewYork
Future ISTFA Dates
27th International Symposium for Testing and Failure Analysis
11 - 15 November 2001
Santa Clara Convention Center
Santa Clara, California
Be sure to put this date on your calendar!
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FirstAnnouncementAnd
ISTFA 2001 • Call for Papers
27th International Symposium for Testing and Failure Analysis
SponsoredbytheASMElectronicDeviceFailureAnalysisSociety(EDFAS)
11-15November2001(cid:129)SantaClara,California,USA
ISTFAsolicitsoriginal,previouslyunpublishedpapersonawiderangeofTestingandFailure
Analysistopicsofpracticalvaluetoanyoneworkingtodetect,understandandeliminateelectronic
devicefailures. Non-commercialpapersfromequipmentvendorsdealingwithneworuniquetoolsand
methodologies,applicationsandresultsarewelcome. Paperswillbeselectedforinclusioninthe
technicalprogramonthebasisofappropriatenessandqualityofdata,technicalimportance,
novelty/originality,andinterpretationofresults. Paperacceptanceisbasedentirelyonthe
informationincludedintheabstract.
We arecurrently seeking papers on(but not limitedto) thefollowingrelevant topics:
(cid:129) AdvancedFaultLocalizationTechniques (cid:129) DefectCharacterizationMethods
(cid:129) SamplePreparationandDeprocessingMethods (cid:129) CaseHistories
(cid:129) Discrete/PassiveComponentFailureAnalysis (cid:129) DesignforTest/DesignforAnalysis
(cid:129) TestingandDeviceCharacterization (cid:129) PackagingRelatedFailureAnalysis
(cid:129) BacksideandFlip-ChipAnalysisTechniques (cid:129) CompoundSemiconductorDevices
(cid:129) Micro-ElectroMechanicalSystems(MEMS) (cid:129) SignatureAnalysis
ABSTRACT SUBMISSIONGUIDELINES
AbstractPreparation:
1. Beginyourabstractwiththeconferencename,ISTFA2001,followedbythetitleofyourpaper.
2. Typeyourabstract(two-pagemaximum)inEnglishandincludesignificantrepresentativeimages,
figures,references,etc. Allabstractsmustadheretothetwo-pagemaximumlengthtobeconsidered.
Withinthetwo-pagemaximum,itishighlyadvisabletoincludesufficientdetail(atleastonefullpage)
toallowforfairevaluationoftheworkdiscussed. AfullcopyofthemanuscriptinMicrosoftWord
formatmaybesubmittedinadditiontotheabstractifdesired.
3. Attheendofyourabstract,describein25wordsorless,thesignificanceofyourwork(conclusions
andbenefits). Thenlistthree(3)keywordsfromyourabstractthatcanbeusedforindexinginthe
ConferenceProceedings,andindicatetowhichtopicalarea(fromthelistabove,or“other”if
appropriate)yourabstractrelates.
4. Onanadditionalpage(s),providethefollowinginformationforthepresentingauthorfirst,thenforall
co-authorsofthework:Completename(includingDr./Mr./Mrs./Ms./Prof.etc.),title,affiliationwith
completemailingaddress(noP.O.Boxnumbers),telephoneandfaxnumbers,ande-mailaddress.
Thisinformationmustbeincludedwithyourabstractoritwillnotbeconsideredforevaluation.
AbstractandManuscriptDeadlines:
1. Abstractsmustbesubmittedby1MARCH2001tobeconsideredforinclusionintheprogram.
2. AConferenceProceedingsisplannedforpublicationanddistributionattheevent. Afullmanuscriptin
MicrosoftWordformatmustbesubmittedforreviewby15JUNE2001,theninfinalcamera-readyand
electronicformatsby13JULY2001.
AbstractSubmissionOptions:
(cid:129) [e-mail]. Inthe
“SubjectLine,”pleaseenterISTFA2001.
(cid:129) Ifyouabsolutelycannotsubmityourabstractelectronically,mailittoarrivebeforethedeadlineto:
ISTFAConferenceAdministrator,ASMInternational,MaterialsPark,Ohio44073-0002(telephone:
+440.338.5151).
VisittheEDFASWebsitefrequentlyatwww.edfas.orgforupdatesonthisevent.
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