High-Speed Circuit Board Signal Integrity (Artech House Microwave Library (Hardcover))

262 Pages·2004·2.89 MB·English

by  Stephen C. Thierauf

High-Speed Circuit Board
Signal Integrity
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High-Speed Circuit Board
Signal Integrity
Stephen C. Thierauf
Artech House, Inc.
Boston • London
www.artechhouse.com
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CoverdesignbyIgorValdman
©2004ARTECHHOUSE,INC.
685CantonStreet
Norwood,MA02062
Allrightsreserved.PrintedandboundintheUnitedStatesofAmerica.Nopartofthisbook
maybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includ-
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Alltermsmentionedinthisbookthatareknowntobetrademarksorservicemarkshave
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InternationalStandardBookNumber:1-58053-131-8
10987654321
ToAnn,Christopher,andKevin
.
Contents
Preface xiii
CHAPTER 1
Characteristics and Construction of Printed Wiring Boards 1
1.1 Introduction 1
1.2 UnitSystem 1
1.3 PWBConstruction 2
1.3.1 Resins 3
1.3.2 AlternateResinSystems 3
1.3.3 Reinforcements 5
1.3.4 VariabilityinBuildingStackups 6
1.3.5 MixingLaminateTypes 7
1.4 PWBTraces 7
1.4.1 CopperCladding 8
1.4.2 CopperWeightsandThickness 9
1.4.3 PlatingtheSurfaceTraces 9
1.4.4 TraceEtchShapeEffects 9
1.5 Vias 10
1.5.1 ViaAspectRatio 13
1.6 SurfaceFinishesandSolderMask 14
1.7 Summary 14
References 15
CHAPTER 2
Resistance of Etched Conductors 17
2.1 Introduction 17
2.2 ResistanceatLowFrequencies 17
2.3 LoopResistanceandtheProximityEffect 20
2.3.1 ResistanceMatrix 21
2.3.2 ProximityEffect 22
2.4 ResistanceIncreasewithFrequency:SkinEffect 24
2.5 HandCalculationsofFrequency-DependentResistance 27
2.5.1 ReturnPathResistance 28
2.5.2 ConductorResistance 28
2.5.3 TotalLoopResistance 29
2.6 ResistanceIncreaseDuetoSurfaceRoughness 29
2.7 Summary 30
vii
viii Contents
References 30
CHAPTER 3
Capacitance of Etched Conductors 31
3.1 Introduction 31
3.2 CapacitanceandCharge 31
3.2.1 DielectricConstant 32
3.3 ParallelPlateCapacitor 33
3.4 SelfandMutualCapacitance 35
3.5 CapacitanceMatrix 37
3.6 DielectricLosses 39
3.6.1 ReactanceandDisplacementCurrent 40
3.6.2 LossTangent 40
3.6.3 CalculatingLossTangentandConductanceG 41
3.7 EnvironmentalEffectsonLaminateε andLossTangent 43
r
3.7.1 TemperatureEffects 44
3.7.2 MoistureEffects 44
3.8 Summary 45
References 45
CHAPTER 4
Inductance of Etched Conductors 47
4.1 Introduction 47
4.2 FieldTheory 47
4.2.1 Permeability 48
4.2.2 Inductance 48
4.2.3 InternalandExternalInductance 49
4.2.4 PartialInductance 49
4.2.5 ReciprocityPrincipalandTransverseElectromagneticMode 50
4.3 CircuitBehaviorofInductance 51
4.3.1 InductiveVoltageDrop 53
4.3.2 InductiveReactance 54
4.4 InductanceMatrix 55
4.4.1 UsingtheReciprocityPrincipletoObtainthe
InductanceMatrixfromaCapacitanceMatrix 55
4.5 MutualInductance 55
4.5.1 CouplingCoefficient 56
4.5.2 BeneficialEffectsofMutualInductance 57
4.5.3 DeleteriousEffectsofMutualInductance 59
4.6 HandCalculationsforInductance 60
4.6.1 InductanceofaWireAboveaReturnPlane 60
4.6.2 InductanceofSide-by-SideWires 61
4.6.3 InductanceofParallelPlates 61
4.6.4 InductanceofMicrostrip 63
4.6.5 InductanceofStripline 63
4.7 Summary 64
References 65
Contents ix
CHAPTER 5
Transmission Lines 67
5.1 Introduction 67
5.2 GeneralCircuitModelofaLossyTransmissionLine 67
5.2.1 RelationshipBetweenωLandR 70
5.2.2 RelationshipBetweenωCandG 70
5.3 Impedance 71
5.3.1 CalculatingImpedance 72
5.4 TravelingWaves 73
5.4.1 PropagationConstant 74
5.4.2 PhaseShift,Delay,andWavelength 75
5.4.3 PhaseConstantatHighFrequenciesWhenRandGAreSmall 78
5.4.4 Attenuation 79
5.4.5 NeperandDecibelConversion 80
5.5 SummaryandWorkedExamples 82
References 86
CHAPTER 6
Return Paths and Power Supply Decoupling 87
6.1 Introduction 87
6.2 ProperReturnPaths 87
6.2.1 ReturnPathsofGround-ReferencedSignals 89
6.2.2 Stripline 90
6.3 StriplineRoutedBetweenPowerandGroundPlanes 90
6.3.1 WhenPowerPlaneVoltageIstheSameasSignalVoltage 90
6.3.2 WhenPowerPlaneVoltageDiffersfromSignalVoltage 93
6.3.3 PowerSystemInductance 94
6.4 SplitPlanes,Motes,andLayerChanges 95
6.4.1 Motes 95
6.4.2 LayerChanges 98
6.5 ConnectorsandDensePinFields 98
6.5.1 PlanePerforation 99
6.5.2 Antipads 99
6.5.3 NonfunctionalPads 102
6.5.4 GuidelinesforRoutingThroughDensePinFields 103
6.6 PowerSupplyBypass/DecouplingCapacitance 105
6.6.1 PowerSupplyIntegrity 106
6.6.2 DistributedPowerSupplyInterconnectModel 110
6.7 ConnectingtoDecouplingCapacitors 112
6.7.1 ViaInductance 112
6.8 Summary 114
References 115
CHAPTER 7
Serial Communication, Loss, and Equalization 117
7.1 Introduction 117
7.2 HarmonicContentsofaDataStream 117