Table Of ContentHigh-Speed and
Lower Power Technologies
Electronics and Photonics
Devices, Circuits, and Systems
Series Editor
Krzysztof Iniewski
Wireless Technologies
Circuits, Systems, and Devices
Krzysztof Iniewski
Circuits at the Nanoscale
Communications, Imaging, and Sensing
Krzysztof Iniewski
Internet Networks
Wired, Wireless, and Optical Technologies
Krzysztof Iniewski
Semiconductor Radiation Detection Systems
Krzysztof Iniewski
Electronics for Radiation Detection
Krzysztof Iniewski
Radiation Effects in Semiconductors
Krzysztof Iniewski
Electrical Solitons
Theory, Design, and Applications
David Ricketts and Donhee Ham
Semiconductors
Integrated Circuit Design for Manufacturability
Artur Balasinski
Integrated Microsystems
Electronics, Photonics, and Biotechnology
Krzysztof Iniewski
Nano-Semiconductors
Devices and Technology
Krzysztof Iniewski
Atomic Nanoscale Technology in the Nuclear Industry
Taeho Woo
Telecommunication Networks
Eugenio Iannone
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High-Speed and
Lower Power Technologies
Electronics and Photonics
Edited by
Jung Han Choi
Krzysztof Iniewski
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Library of Congress Cataloging‑in‑Publication Data
Names: Choi, Jung Han, editor. | Iniewski, Krzysztof, 1960- editor.
Title: High-speed and lower power technologies : electronics and photonics /
Jung Han Choi and Krzysztof Iniewski, editors.
Description: Boca Raton : Taylor & Francis, a CRC title, part of the
Taylor & Francis imprint, a member of the Taylor & Francis Group,
the academic division of T&F Informa, plc, 2018. | Series: Devices, circuits,
and systems | Includes bibliographical references and index.
Identifiers: LCCN 2018026596| ISBN 9780815374411 (hardback : alk. paper) |
ISBN 9781351242295 (ebook : alk. paper)
Subjects: LCSH: Low voltage integrated circuits. | Integrated optics--Power supply. |
Electronic apparatus and appliances--Energy conservation. |
Very high speed integrated circuits.
Classification: LCC TK7874.66 .H54 2018 | DDC 621.3815--dc23
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Contents
Contents
Special thanks to my parents
for
their endless love and support
Contents
Preface ......................................................................................................................ix
Series Editor .........................................................................................................xiii
Editor.......................................................................................................................xv
Contributors ........................................................................................................xvii
1 The End of Moore’s Law and Reinventing Computing ..........................1
Suhas Kumar
2 When the Physical Disorder of CMOS Meets Machine Learning .......9
Xiaolin Xu, Shuo Li, Raghavan Kumar, and Wayne Burleson
3 SiGe BiCMOS Technology and Devices ..................................................37
Edward Preisler
4 Base Doping Profile Engineering for High-Performance SiGe
PNP Heterojunction Bipolar Transistors .................................................59
Guangrui (Maggie) Xia and Yiheng Lin
5 Performance Evaluation of AsF5-intercalated Top-Contact
Multilayer Graphene Nanoribbons for Deeply Scaled
Interconnects ...............................................................................................125
Rohit Sharma and Atul Kumar Nishad
6 Silicon-on-Chip Lasers for Chip-level Optical Interconnects ..........141
Il-Sug Chung
7 Integrated Photonic Interconnects for Computing Platforms ..........165
Nicola Andriolli, Isabella Cerutti, and Odile Liboiron-Ladouceur
8 Ultra-Low Power SiGe Driver-IC for High-Speed InP
Mach-Zehnder Modulator .........................................................................187
Jung Han Choi
9 Efficient and Low-Power NoC Router Architecture ............................211
Gul N. Khan
10 Rapid Static Memory Read-Write for
Energy-Aware Applications......................................................................253
Theodoros Simopoulos, Themistoklis Haniotakis, George Ph. Alexiou,
and Nicolas Sklavos
vii
viii Contents
11 Application Specific Integrated Circuits for Direct X-Ray and
Gamma-Ray Conversion in Security Applications .............................269
Kris Iniewski, Chris Siu, and Adam Grosser
12 High-Efficiency Power Amplifiers ..........................................................309
Guillermo Velasco-Quesada, Herminio Martínez-García, and Alfonso
Conesa-Roca
Index .....................................................................................................................345
Preface
Advances in semiconductor technologies over the last few years have led
to such rapid and considerable improvements with respect to speed, power,
integration density, and cost, that the semiconductor device, especially the
Si CMOS gate length, is now approaching the theoretical quantum limit of
its feature size. Many academic institutions and industries are aggressively
investing their efforts in discovering next-generation technologies in every
area: for example, nano devices using carbon-based materials, new struc-
ture-materials, heterogeneous material systems to form optics in Si, and
high-temperature superconducting materials.
In addition, technological evolutions like quantum computing and quan-
tum communications, which it was believed would take at least a decade to
make practically available, are now already on the horizon. People are start-
ing to bring their attention to those areas to work out feasible future appli-
cations combined with IoT, 5G, and beyond 5G. One distinct area that has
recently attracted a lot of interest from many research institutions is artificial
intelligence, particularly since AlphaGo, developed by Google Deepmind,
won a Go match against 18-time world human champion, Lee Sedol. This his-
toric event inspired many engineers to dig into the enormous possibilities of
artificial intelligence in ever-developing electronic machinery and all sorts
of engineering areas. Machines embedded with artificial intelligence even
began mimicking human intelligence in part and people seek to imagine
applications in daily life. It is strongly anticipated that many electronics will
embed AI in the near future.
Also, the explosion of data traffic has triggered the development of higher-
speed and lower-power intra-/inter-server communication modules for
both data centers and communications. According to the survey by Cisco
in 2016, global IP traffic will show 24% compound annual growth rate
(CAGR) between 2016 and 2021, reaching 278 EB per month (EB = one bil-
lion gigabytes).* It is reported that global electricity consumption by data
centers is estimated at about 1.4% of global electricity consumption with
a CAGR of 4.4% from 2007 to 2012†. It also contributes significantly to CO
2
emissions. The significant message we have to take from these statistical sur-
veys is that we have to produce lower-power systems compared to old ones,
supporting higher speed and lower complexity. One of the key elements in
the data center as regards lower power-consumption is the interconnection
* Cisco, “White Paper: Cisco Visual Networking Index: Forecast and Methodology, 2016–
2021.” Available at: www.cisco.com/c/en/us/solutions/collateral/service-provider/visual-
networking-index-vni/complete-white-paper-c11-481360.html.
† M. Avgerinou, et al., “Trends in Data Centre Energy Consumption under the European Code
of Conduct for Data Centre Energy Efficiency,” Energies 2017, 10, 1470; doi:10.3390/en10101470.
ix
