Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

200 Pages·2003·7.8 MB·English

by  Erdogan Madenci

FATIGUE LIFE PREDICTION OF
SOLDER JOINTS IN ELECTRONIC
PACKAGES WITH ANSYS®
THE KLUWER INTERNATIONAL SERIES
IN ENGINEERING AND COMPUTER SCIENCE
FATIGUE LIFE PREDICTION OF
SOLDER JOINTS IN ELECTRONIC
PACKAGES WITH ANSYS®
by
Erdogan Madenci
Ibrahim Guven
Bahattin Kilic
The University ofA rizona
Tucson, AZ, U.S.A.
SPRINGER SCIENCE+BUSINESS MEDIA, LLC
Library of Congress Cataloging-in-Publication Data
Madenci, Erdogan.
Fatigue life prediction of solder joints in electronic packages with ANSYS® / Erdogan Madenci,
lbrahim Guven, Bahattin Kilic.
Boston, Mass. : Springer Science+Business Media, LLC
p. cm.-{The Kluwer international series in engineering and computer science; SECS 719)
IncIudes bibliographical references and index.
Additional material to this book can be downloaded from http://extras.springer.com.
ISBN 978-1-4613-4989-1 ISBN 978-1-4615-0255-5 (eBook)
DOI 10.1007/978-1-4615-0255-5
1. Electronic packaging-Computer-aided design. 2. Solder and
soldering-Quality control. 3. Metals-fatigue. 4. Service life
(Engineering}-forecasting. 5. ANSYSoo (computer system).
TK7870.15 .M32 2002
621.381 '046-dc21
Copyright © 2003 Springer Science+Business Media New York
Originally published by Kluwer Academic Publisher,
New York in 2003
Softcover reprint of the hardcover 1s t edition 2003
AII rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted in any form or by any means, mechanical, photo
copying, recording, or otherwise, without the prior written permission of the
Publisher,Springer Science+Business Media, LLC
Permission for books published in Europe: [email protected]
Permissions for books published in the United States of America: [email protected]
ANSYS® is a registered trademark of ANSYS, Inc.
Printed an acid-free paper.
PREFACE
The fatigue life prediction of solder joints is an important issue in the
electronics industry. Over the last decade, one method has emerged as the
most widely used for a multitude of package configurations. However, this
method requires knowledge of finite element modeling and simulation with
ANSYS®, a commercially available finite element program. Furthermore,
the three-dimensional finite element modeling of any electronic package
remains a formidable task, even if the analyst has extensive knowledge of
ANSYS®. This book describes the method in great detail, startini from its
theoretical basis. The reader is supplied with a F.0up of ANSYS macros,
ReliANS, that are integrated into the ANSYS -GUI. These macros have
been specifically designed for the life prediction analysis of solder joint
fatigue in electronic packages. ReliANS transforms the complicated fatigue
life prediction analysis process into a sequence of simple building blocks. In
order to avoid any confusion, examples are utilized to explain specific steps
of the analysis method. Case studies are included to assist the readers in
regenerating the solutions on their computers.
Upon installation of ReliANS, a menu item named "Packaging" is added to
the preprocessor, solution, and postprocessor menus within the ANSYS®
.G UI environment. The packaging menu under the preprocessor menu con
cerns model generation and material properties. Under the solution menu,
the packaging menu contains items related to the application of boundary
conditions and the simulation of the thermal or mechanical cycle. The post
processor menu is used for calculating the expected life of the critical solder
joint under consideration.
Chapter 1 provides an overview of several mathematical modeling tech
niques for inelastic solder behavior and several solder joint failure predic
tion methods. In Chapter 2, the methods utilizing the finite element method
with ANSYS for the thermomechanical fatigue life prediction analysis of
electronic packages are presented. Following the theoretical basis, a case
study is considered in detail. The mechanical fatigue life prediction analysis
of electronic packages is presented in Chapter 3, also with a case study. A
compilation of the add-on ANSYS® macros, ReliANS, along with detailed
information for each of the macros, is presented in Chapter 4. The installla
tion instructions for ReliANS are included in Appendix A, and the com
mand line input listings for the two case studies in Chapters 2 and 3 are
given in Appendix B.
vi LIFE PREDICTION OF SOLDER JOINTS
We would like to acknowledge the support and information provided by the
Semiconductor Research Corporation (SRC), its member companies, and
Ericsson Components AB of Sweden.
We are greatly indebted to Connie Spencer for her invaluable efforts in typ
ing, editing, and assisting with each detail associated with the completion of
this book.
TABLE OF CONTENTS
PREFACE ................................................................................................... v
LIST OF COMMANDS .............................................................................. ix
LIST OF TABLES ...................................................................................... xi
LIST OF FIGURES ................................................................................... xiii
INTRODUCTION ... ........ ....... ........................................... .......... .......... 1
1.1 Numerical Modeling with Finite Element Analysis ..................... 2
1.2 Constitutive Relations .................................................................. 2
1.3 Failure Prediction ......................................................................... 8
1.4 References....... ......... ................... ............ ........... ....... ....... ..... ..... 14
2 THERMOMECHANICAL FATIGUE LIFE PREDICTION
ANALYSIS ...... .............. ......... .................. ........... .......... ....... .............. 17
2.1 Approach .................................................................................... 17
2.2 Analysis Steps ............................................................................. 21
2.3 Case Study: BGA-Type Package ................................................ 22
2.3.1 Data Needed Before Beginning ANSYS® Session ......... 22
2.3.2 Global Model Generation ............................................... 24
2.3.3 Global Model Solution and Preparation for Sub-
modeling ......................................................................... 58
2.3.4 Submodel Generation ..................................................... 60
2.3.5 Submodel Solution and Life Calculation ........................ 66
2.4 References .................................................................................. 68
3 MECHANICAL BENDING FATIGUE LIFE PREDICTION
ANALYSIS ......................................................................................... 69
3.1 Approach .................................................................................... 69
3.1.1 Combined Creep and Time-Independent Plastic
Deformation .................................................................... 72
3.1.2 Life Prediction ................................................................ 73
3.2 Analysis Steps ............................................................................ 73
viii LIFE PREDICTION OF SOLDER JOINTS
3.3 Case Study: BGA-Type Package ............................................... 74
3.3.1 Data Needed Before Beginning ANSYS® Session ......... 74
3.3.2 Global Model Generation ............................................... 76
3.3.3 Global Model Solution and Preparation for Creep/
Plasticity Simulation ....................................................... 77
3.3.4 Combined Creep and Plasticity Simulation .................... 79
3.4 References .................................................................................. 86
4 MACRO REFERENCE LIBRARy .................................................... 87
4.1 Overview .................................................................................... 87
4.2 Preprocessor ............................................................................... 87
4.2.1 Solder Joint Submenu Commands .................................. 92
4.2.2 Motherboard Submenu Commands .............................. 106
4.2.3 Layer Submenu Commands .......................................... 122
4.2.4 Material Properties Submenu Commands .................... 136
4.2.5 Additional Menu Commands ........................................ 138
4.3 Solution ...... .......... ....... ................ ............................................. 140
4.3.1 Packaging Menu Commands ........................................ 143
4.3.2 Thermal Submenu Commands ..................................... 145
4.3.3 Mechanical Submenu Commands ................................ 153
4.4 Postprocessing .......................................................................... 155
4.4.1 Thermal Life Menu Command ..................................... 156
4.4.2 Equivalent Stress and Strain Menu Item ....................... 158
4.4.3 Assembly Stiffness Menu Item...................................... 159
4.4.4 Mechanical Life Menu item .... ...................................... 160
4.5 Reference .................................................................................. 161
APPENDIX A: INSTALLATION AND EXECUTION ......................... 163
A.1 Steps for ReliANS Installation on a PC Platform .................... 164
A.2 Steps for Adding Working Directories for Use in ReliANS .... 164
A.3 Demonstration of ReliANS Installation and Adding New
Directories ................................................................................ 164
A.4 Installation of ReliANS on UNIX Systems .............................. 171
APPENDIX B: INPUT LISTINGS FOR CASE STUDIES ..................... 175
B.1 Input Listing for the Case Study Given in Chapter 2 ............... 175
B.2 Input Listing for the Case Study Given in Chapter 3 ............... 178
INDEX ...................................................................................................... 183
LIST OF COMMANDS
BLCK 1 ..................................................................................................... 122
BLCK2 ..................................................................................................... 124
BLCK3 ..................................................................................................... 131
BLCK4 ..................................................................................................... 132
BLCK5 ..................................................................................................... 133
BLCK6 ..................................................................................................... 134
BLCK7 ..................................................................................................... 112
BLCK8 ..................................................................................................... 114
BLCK9 ..................................................................................................... 116
BLCK 10 """"""""""""'"'''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''' 118
BLCK11 ................................................................................................... 120
CBCYCL ................................................................................................. 149
CHGVISC ................................................................................................ 139
CUTDOF .................................................................................................. 147
DISK1 ...................................................................................................... 127
DISK2 ...................................................................................................... 129
EPEDEL .................................................................................................. 138
EPMAT .................................................................................................... 136
F BCLIFE ................................................................................................ 160
F E EFF .................................................................................................. 159
F V ONM ................................................................................................. 158
FR4GE01 ................................................................................................ 106
FR4GE02 ................................................................................................ 108
FR4GE03 """'''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''' 110
GL 1 ........................................................................................................ 143
GL 2 .. ........... .................... ....................................................................... 144
GLMEC 1 .................................................................................................. 153
LIFE1 ....................................................................................................... 156
LSSOLVE ................................................................................................ 152
SJFULL .................................................................................................... 103
SJGE01 ..................................................................................................... 92
SJGE02 ..................................................................................................... 96
SJGE03 ..................................................................................................... 99
SUB5 ........................................................................................................ 145
SUB6 ........................................................................................................ 150
SUB20 ...................................................................................................... 154
USMAT .................................................................................................... 137
LIST OF TABLES
1.1 Material properties in a typical electronic package-temperature
dependent ........................................................................................... 3
1.2 Material properties in a typical electronic package-temperature
independent........................................................................................ 3
1.3 Numerical values for a eutectic solder alloy in Anand's material
model ................................................................................................. 5
1.4 Material constants for power-law creep as employed by Akay
et al. (1997) ........................................................................................ 6
1.5 Material constants in the Integrated Matrix Creep Model ................. 7
1.6 Material constants in Eqs. (1.10) and (1.11) ...................................... 7
1.7 Numerical values of empirical constants used in thermal fatigue
life prediction................................................................................... 10
1.8 Numerical values of empirical constants used in mechanical
fatigue life prediction....................................................................... II
2.1 Material property correspondence in the thermomechanical case
study ................................................................................................ 58