Encyclopedia of Thermal Stresses

6715 Pages·2014·228.92 MB·English

by  Richard B. Hetnarski (eds.)

Richard B. Hetnarski
Editor
Encyclopedia of
Thermal Stresses
1 3
Reference
Encyclopedia of Thermal Stresses
MeetingofSectionEditorsoftheEncyclopediaofThermalStressesatthe9thInternational
CongressonThermalStresses(ICTS)inBudapestonJune8,2011.
Sitting,fromlefttoright:
MarinaV.Shitikova,VoronezhStateUniversityofArchitectureandCivilEngineering,
Russia;
PiergiovanniMarzocca,ClarksonUniversity,Potsdam,NY,U.S.A.;
HarryH.Hilton,UniversityofIllinoisatUrbana-Champaign,Urbana,IL,U.S.A.
RichardB.Hetnarski,RochesterInstituteofTechnology,U.S.A.;Editor-in-ChiefoftheETS;
PresidentoftheICTSorganization;Co-Chairofthe9thInt.CongressonThermalStresses;
AndrasSzekeres,BudapestUniversityofTechnologyandEconomics,Chairofthe9th
Int.CongressonThermalStresses;
NaotakeNoda,UniversityofShizuoka,Hamamatsu,Japan;Co-Chairofthe9thInt.
CongressonThermalStresses.
Standing,fromlefttoright:
TheodoreR.Tauchert,UniversityofKentucky,U.S.A.;SecretaryGeneraloftheICTS
organization;
FumihiroAshida,ShimaneUniversity,Japan;
SeiUeda,OsakaInstituteofTechnology,Japan;
JanTaler,CracowUniversityofTechnology,Poland;
YuriyA.Rossikhin,VoronezhStateUniversityofArchitectureandCivilEngineering,Russia;
M.RezaEslami,AmirkabirUniversityofTechnology,Tehran,Iran;
Ching-KongChao,NationalTaiwanUniversityofScienceandTechnology,Taipei,Taiwan,
RepublicofChina;
Cun-FaGao,NanjingUniversityofAeronauticsandAstronautics,People’sRepublic
ofChina;
DorinIesan,UniversityofIasi,Romania;
StanChirita,UniversityofIasi,Romania;
VincenzoTibulloandVittorioZampoli,representingMicheleCiarletta,DIIMA,University
ofSalerno,Italy;
RomanKushnir,PidstryhachInstituteforAppliedProblemsofMechanicsand
Mathematics,NationalAcademyofSciencesofUkraine,Lviv,Ukraine.
(PhotographtakenbyYuriyV.Tokovyy,PidstryhachInstituteforAppliedProblemsof
MechanicsandMathematics,NationalAcademyofSciencesofUkraine,Lviv,Ukraine).
Richard B. Hetnarski
Editor
Encyclopedia of
Thermal Stresses
With3310Figuresand371Tables
Editor
ProfessorEmeritus
RichardB.Hetnarski
DepartmentofMechanicalEngineering
RochesterInstituteofTechnology
Rochester,NY,USA
and
Naples,FL,USA
ISBN978-94-007-2738-0 ISBN978-94-007-2739-7(eBook)
ISBNBundle978-94-007-2740-3(printandelectronicbundle)
DOI10.1007/978-94-007-2739-7
SpringerDordrechtHeidelbergNewYorkLondon
LibraryofCongressControlNumber:2013951772
#SpringerScience+BusinessMediaDordrecht2014
Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeor
part of the material is concerned, specifically the rights of translation, reprinting, reuse of
illustrations,recitation,broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,
andtransmissionorinformationstorageandretrieval,electronicadaptation,computersoftware,
orbysimilarordissimilarmethodologynowknownorhereafterdeveloped.Exemptedfromthis
legalreservationarebriefexcerptsinconnectionwithreviewsorscholarlyanalysisormaterial
suppliedspecificallyforthepurposeofbeingenteredandexecutedonacomputersystem,for
exclusiveusebythepurchaserofthework.Duplicationofthispublicationorpartsthereofis
permitted only under the provisions of the Copyright Law of the Publisher’s location, in its
currentversion,andpermissionforusemustalwaysbeobtainedfromSpringer.Permissionsfor
usemaybeobtainedthroughRightsLinkattheCopyrightClearanceCenter.Violationsareliable
toprosecutionundertherespectiveCopyrightLaw.
Theuseofgeneraldescriptivenames,registerednames,trademarks,servicemarks,etc.inthis
publicationdoesnotimply,evenintheabsenceofaspecificstatement,thatsuchnamesare
exemptfromtherelevantprotectivelawsandregulationsandthereforefreeforgeneraluse.
Whiletheadviceandinformationinthisbookarebelievedtobetrueandaccurateatthedateof
publication, neither the authors nor the editors nor the publisher can accept any legal
responsibilityforanyerrorsoromissionsthatmaybemade.Thepublishermakesnowarranty,
expressorimplied,withrespecttothematerialcontainedherein.
Printedonacid-freepaper
SpringerispartofSpringerScience+BusinessMedia(www.springer.com)
Preface
Doctrinamultiplex,veritasuna.
TheEncyclopediaofThermalStresses(ETS)isaninterdisciplinaryreference
work. Its main emphasis is on topics in the field of Thermal Stresses, but it
contains also entries on related topics, such as Theory of Elasticity, Heat
Conduction, Thermodynamics, appropriate areas of Applied Mathematics,
andtopicsonNumericalMethods.TheETSisaimedatbothundergraduate
and graduate students, researchers and engineers. The creation of such an
extensivepublicationrequiredtheeffortoftheEditorialBoardconsistingof
29 section editors, experts in their fields of specialization, who represent
15 countries. The hard work of preparation of entries was accomplished
by 614 authors, experts in the specific topics, representing 61 countries.
The ETS is the largest single publication devoted to the field of Thermal
Stresses ever published. It contains 11 volumes comprising altogether
LXXVII + 6643 pages. Its creation took two-and-a-half years of hard work
ofdevotedsectioneditors,aswellasthedevotedauthorsof708entries.
The field of Mechanics called Thermoelasticity and Thermal Stresses
was started with the publication, in the year 1837, of the paper by
J.-M.-C. Duhamel, Second Me´moire sur les Phe´nome`nes Thermo-Me´
caniques. Since then, well over 60 published books have been devoted
explicitly to this field. The first journal that covers exclusively the subject,
theJournalofThermalStresses,initiallyaquarterly,andnowamonthly,was
started in 1978, and the first International Congress of Thermal Stresses
(which at that time was called a Symposium), was held in Hamamatsu,
Japan,in1995.Thelargestpublicationonthesubjectbeforecreationofthe
ETS, was a set of five volumes entitled Thermal Stresses, directed at
researchersand engineers. Thatseries,which appeared intheyears1986to
1999, was edited by this editor and published by Elsevier and Lastran
Corporation; it comprised 27 chapters and a total of 2129 printed pages on
state-of-the-artlevel,preparedbyspecialists.Thedatesmentionedabovewere
themilestonesinthedevelopmentofthefieldofThermoelasticityandThermal
Stresses.Overtheyears,thenumberofpapersonthesubjectthathaveappeared
intheliteraturehascontinuedtoincrease,andthisgrowthisanindicationofthe
substantial interest of researchers devoting their time to this field, and ofthe
numberofusersinindustrydependinguponthislargevolumeofknowledge.
TheETScontainsmuchofourknowledgeonThermalStresses,including
also some textbook information. Thus, the ETS should be useful to readers
v
vi Preface
withvariousneedsandvariouslevelsofpreparation.Asfortheexpositionof
thematerial,theeffortwasdirectedtowardthecreationofmanyentriesthat
arepossiblyoriginalandnew,evenifthematerialitselfhasbeenwellknown
foraverylongtime,whichisnecessaryinorderfortheETStocontainalso
the standard textbook knowledge. But even such information is presented
here in more original form, in more original context, and with original
illustrationsorexamples,wheneverpossible.Also,theETScontainshistor-
ical notes, controversial ideas, directions of future research, and – in
particular–newideas,newmethodsofsolutions,andnewresults.Thechoice
ofmaterialintheETSisgearedtowardtopicscontainingimportantdevelop-
ments,withtheintentionofopeningwideperspectivesforfurtherexpansion
ofthefieldofThermalStresses.SuchamixtureiswhatshouldmaketheETS
anespeciallyattractiveandpreciouspublication.AndthegoaloftheETSis
notonlytoinformbutalsotoencouragetheyounggenerationtoworkinthe
areasofsciencecoveredbytheETS.
Fortheauthors,takingpartinthecreationoftheETSwasconsideredboth
a privilege and hard work. All involved made an effort to do everything
possible to arrive at the best result, as its effects hopefully will be felt for
manyyears.Thebestspecialistswereinvitedtocontributeentries.Ifsomeof
those invited refused to participate, other experts were invited as replace-
ments;however,attheend,notallplannedentriesfoundappropriateauthors
andsomeentrieshadtobeabandoned.
Many of the authors worked in a close circle of similarly “initiated”
colleagues, and if not for the opportunity to write entries for the ETS, they
wouldnotcome“intheopen”andwouldneverwritetothewideraudience.
Offeringinvitationsandreceivingacceptanceofsuchinvitationsbysolarge
agroupofspecialistswasanambitiouseffort.Asaresult,thosewhousethe
ETSshouldconsiderthispublicationnotonlyasasourceofinformation,but
alsoasasourceofintellectualsatisfaction.
SpecialthanksareextendedtoMr.KevinJ.Bradley,President-USJournals,
at Taylor & Francis, who was so kind as to offer his approval of granting
copyright permissions, without charge, to use the contents of 40 papers
published in the Journal of Thermal Stresses by their authors in
the preparation of the ETS entries. The friendly attitude and generosity of
Mr. Bradley contributed to the enrichment of the ETS with the results that
otherwisewouldnotbeapartofit.
Aseditor,Iexpressmycongratulationsandthankstoallwhowereonboard
while the work on the ETS progressed: to the section editors and to the
authors, whose names and affiliations may be found on pages that follow.
My special thanks are extended to important ladies at Springer: Nathalie
Jacobs and Lydia Mueller, who approached me in the spring of 2010 with
the offer to undertake the work on the ETS, and to Editors Jutta Jaeger-
Hamers, Daniela Graf, and Gabriele Stjepanovic who worked so hard on
leadingtheprojectfromitsinceptiontoitsconclusion.
October2013 RichardB.Hetnarski
Editor
Editor
Richard B. Hetnarski Professor Emeritus, Department of Mechanical
Engineering,RochesterInstituteofTechnology,Rochester,NY,USA
Naples,FL,USA
vii

Section Editors
FumihiroAshida ShimaneUniversity,Shimane,Japan
JamesRichardBarber UniversityofMichigan,AnnArbor,MI,USA
JaniceBarton UniversityofSouthampton,Southampton,UK
ErasmoCarrera PolitecnicodiTorino,Torino,Italy
Ching-KongChao NationalTaiwanUniversityofScienceandTechnology,
Taipei,Taiwan,RepublicofChina
StanChirita “A1.I.Cuza”UniversityofIasi,Iasi,Romania
MicheleCiarletta DIIMA,UniversityofSalerno,Fisciano(SA),Italy
M.RezaEslami AmirkabirUniversityofTechnology,Tehran,Iran
Cun-FaGao NanjingUniversityofAeronauticsandAstronautics,Nanjing,
People’sRepublicofChina
HarryH.Hilton UniversityofIllinoisatUrbana-Champaign,Urbana,
IL,USA
DorinIesan “A1.I.Cuza”UniversityofIasi,Iasi,Romania
TatsuoInoue FukuyamaUniversity,Hiroshima,Japan
RomanKushnir PidstryhachInstitute forAppliedProblemsofMechanics
andMathematics,NationalAcademyofSciencesofUkraine,Lviv,Ukraine
AnatolyG.Lanin InstituteofAssociation“LUCH”,Podolsk,Russia
Lars-ErikLindgren Lulea˚ UniversityofTechnology,Lulea˚,Sweden
PiergiovanniMarzocca ClarksonUniversity,Potsdam,NY,USA
GerardMaugin UniversitePierreetMarieCurie,Paris,France
RoderickMelnik UniversityofWaterloo,Waterloo,ON,Canada
AngeloMorro UniversityofGenoa,Genoa,Italy
NaotakeNoda UniversityofShizuoka,Hamamatsu,Japan
HanySherief UniversityofAlexandria,Alexandria,Egypt
ix