Electroplating of Nanostructures

287 Pages·2016·41.14 MB·English

Electroplating of Nanostructures
Edited by Mahmood Aliofkhazraei
Electroplating of Nanostructures
Edited by Mahmood Aliofkhazraei
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Copyright © 2015
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Published December 02, 2015
ISBN-10: 953-51-2213-4
ISBN-13: 978-953-51-2213-5
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C ontents
Preface
Chapter 1 Electrodeposition of Nanostructure Materials
by Souad A. M. Al-Bat’hi
Chapter 2 Electrodeposition of WO3 Nanoparticles for Sensing Applications
by L. Santos, J. P. Neto, A. Crespo, P. Baião, P. Barquinha, L. Pereira, R.
Martins and E. Fortunato
Chapter 3 Electrodeposition of Ferromagnetic Nanostructures
by Monika Sharma and Bijoy K. Kuanr
Chapter 4 Aluminum Anodic Oxide AAO as a Template for Formation of Metal
Nanostructures
by Piotr Tomassi and Zofia Buczko
Chapter 5 Pulse Electroplating of Ultrafine Grained Tin Coating
by Pulse Electroplating of Ultrafine Grained Tin Coating
Chapter 6 Nucleation Behaviors of Nd and Dy in TFSA-Based Ionic Liquids
by Masahiko Matsumiya
Chapter 7 Electrodeposition of Thin Films for Low-cost Solar Cells
by Abhijit Ray
Chapter 8 A Process for Preparing High Graphene Sheet Content Carbon Materials
from Biochar Materials
by Yan-Jia Liou and Wu-Jang Huang
Chapter 9 Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide
Emulsified Electrolyte
by Masato Sone, Tetsuya Shimizu, Nao Shinoda and Tso-Fu Mark Chang
Chapter 10 Mechanical Property Evaluation of Electrodeposited Nanocrystalline
Metals by Micro-testing
by Takashi Nagoshi, Tso-Fu Mark Chang and Masato Sone
VI Contents
Chapter 11 One-Step Electrodeposition of CZTS for Solar Cell Absorber Layer
by Marta Farinella, Patrizia Livreri, Salvatore Piazza, Carmelo Sunseri and
Rosalinda Inguanta
Chapter 12 The Coupled Magnetic Field Effects on the Microstructure Evolution and
Magnetic Properties of As-Deposited and Post- Annealed Nano-Scaled Co-Based Films
— Part I
by Donggang Li, Qiang Wang, Agnieszka Franczak, Alexandra Levesque and
Jean-Paul Chopart

Preface
The electroplating was widely used to electrodeposit the nanostructures
because of its relatively low deposition temperature, low cost and controlling
the thickness of the coatings. With advances in electronics and
microprocessor, the amount and form of the electrodeposition current applied
can be controlled.
The pulse electrodeposition has the interesting advantages such as higher
current density application, higher efficiency and more variable parameters
compared to direct current density.
This book collects new developments about electroplating and its use in
nanotechnology.

Chapter 1
Electrodeposition of Nanostructure Materials
Souad A. M. Al-Bat’hi
Additional information is available at the end of the chapter
http://dx.doi.org/10.5772/61389
Abstract
We are conducting a multi-disciplinary research work that involves development of
nanostructured thin films of semiconductors for different applications. Nanotech‐
nology is widely considered to constitute the basis of the next technological revolu‐
tion, following on from the first Industrial Revolution, which began around 1750
with the introduction of the steam engine and steelmaking. Nanotechnology is de‐
fined as the design, characterization, production, and application of materials, devi‐
ces and systems by controlling shape and size of the nanoscale. The nanoscale itself
is at present considered to cover the range from 1 to 100 nm. All samples prepared
in thin film forms and the characterization revealed their nanostructure. The major
exploitation of thin films has been in microelectronics, there are numerous and
growing applications in communications, optical electronics, coatings of all kinds,
and in energy generation. A great many sophisticated analytical instruments and
techniques, largely developed to characterize thin films, have already become indis‐
pensable in virtually every scientific endeavor irrespective of discipline. Among all
these techniques, electrodeposition is the most suitable technique for nanostruc‐
tured thin films from aqueous solution served as samples under investigation. The
electrodeposition of metallic layers from aqueous solution is based on the discharge
of metal ions present in the electrolyte at a cathodic surface (the substrate or compo‐
nent.) The metal ions accept an electron from the electrically conducting material at
the solid- electrolyte interface and then deposit as metal atoms onto the surface. The
electrons necessary for this to occur are either supplied from an externally applied
potential source or are surrendered by a reducing agent present in solution (electro‐
less reduction). The metal ions themselves derive either from metal salts added to
solution, or by the anodic dissolution of the so-called sacrificial anodes, made of the
same metal that is to be deposited at the cathode.
Keywords: Electrodeposition, nanomaterials, thin films, nanotechnology