Table Of Content- - - - - --
ELECTROMAGNETIC COMPATIBILITY OF
INTEGRATED CIRCUITS
ELECTROMAGNETIC COMPATIBILITY OF
INTEGRATED CIRCUITS
Techniques for low emission and susceptibility
Edited by
Sonia Ben ~hia'M, ohamed ~amdanain~d Etienne ~icard'
'
INSA-LESIA, Toulouse, France
*
ESEO, Angers, France
-
Q
Springer
Editors:
Sonia Ben Dhia, INSA-LESIA, Toulouse, France
Mohamed Ramdani, ESEO, Angers, France
Etienne Sicard, INSA-LESIA, Toulouse, France
Electromagnetic Compatibility of Integrated Circuits:
Techniques for Low Emission and Susceptibility
Library of Congress Control Number: 2005934276
ISBN 0-387-26600-3 e-ISBN 0-387-26601-1
ISBN 978-0387-26600-8
Printed on acid-free paper.
O 2006 Springer Science+Business Media, Inc.
All rights reserved. This work may not be translated or copied in whole or in part without
the written'permission of the publisher (Springer Science+Business Media, Inc., 233 Spring
Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or
scholarly analysis. Use in connection with any form of information storage and retrieval,
electronic adaptation, computer software, or by similar or dissimilar methodology now
know or hereafter developed is forbidden.
The use in this publication of trade names, trademarks, service marks and similar terms,
even if the are not identified as such, is not to be taken as an expression of opinion as to
whether or not they are subject to proprietary rights.
Printed in the United States of America.
9 8 7 6 5 4 3 2 1 SPIN 11055105
Dedication
To our children
Camille
Cyrine
Daniel
Sadri
Selma
Soumaya
Contents
Contributing authors ix
Preface xi
.. .
Acknowledgements Xlll
Chapter 1 - Basic Concepts in EMC for ICs 1
Chapter 2 Historical Review and State-of-the-art 19
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Chapter 3 - Fundamentals and Theory 5 5
Chapter 4 - Measurement Methods 105
Chapter 5 - EMC Modeling 189
Chapter 6 - Case Studies 311
Chapter 7 - Guidelines 395
Appendix A - Useful Tables 43 1
Appendix B - Companion CD-ROM 437
Glossary 467
Index 47 1
Contributing Authors
Author Affiliation Contribution to
Sttphane Baffreau IUT, Tarbes, France Chapter 5,6,7
Sandeep Bakshi Philips, Eindhoven, Netherlands Chapter 4
Sonia Ben Dhia INSA, Toulouse, France Chapter 3,4,5,6,CD
Sebastia Bota UIB Palma, Spain Chapter 5
Lahoucine Bouhouch ENSA, Agadir, Maroc Chapter 6
Alexandre Boyer INSA, Toulouse, France CD
Mart Coenen Philips, Eindhoven, Netherlands Chapter 4,6,7
Franqois de Daran Valeo, CrCteil, France Chapter 5,CD
Bernard DCmoulin University of Lille, France Chapter 3,4
Bernd Deutschmann AMS, Unterpremstaetten, Austria Chapter 5
Jean-Marc Dienot IUT, Tarbes, France Chapter 5
M'Hamed Drissi INSA, Rennes, France Chapter 4
Kazuhiko Eguchi Aichi Institute of Technology, Japan Chapter 5
Franco Fiori Politecnico di Torino, Italia Chapter 7
Saburo Hojo Renesas Technology, Japan Chapter 5
Todd H.Hubing Univ. of Missouri Rolla, USA Chapter 1,2
Kouji Ichikawa DENSO, Japan Chapter 6
Eugeni Isern UIB Palma, Spain Chapter 5
CCcile LabussiBre. Freescale, Toulouse, France Chapter 4, CD
FrCdCric Laffont Valeo, France Chapter 5,CD
Enrique Lamoureux EADSICCR, Toulouse, France Chapter 6
Jean-Luc Levant ATMEL, Nantes, France Chapter 33
Christophe Lochot Freescale, Toulouse,France Chapter 4
Christian Marot Siemens VDO, Toulouse, France Chapter 4
Olivier Maurice EADSICCR, Suresnes, France Chapter 5
Mohamed MCdiouni ENSA, Agadir, Maroc Chapter 6
Shinichiro Mitani Hitachi Ltd, Japan Chapter 5
Richard Perdriau ESEO, Angers, France Chapter 5,6,CD
Mohamed Ramdani ESEO, Angers, France Chapter 3, 5
Miquel Roca UIB Palma, Spain Chapter 5
Bob Ross Teraspeed Consulting Group, USA Chapter 5
Electromagnetic Compatibility Of Integrated Circuits
Author Affiliation Contribution to
Etienne Sicard INSA, Toulouse, France Chapter 1,2,3,7,CD
Gilles Sicard TIMA, Grenoble, France Chapter 7
Amaury Soubeyran EADSICCR, Suresnes, France CD
Thomas Steinecke Infineon, Munich, Germany Chapter 6
Bertrand Vrignon ST Microelectronics, Crolles, France Chapter 5,6
Osami Wada Kyoto University, Japan Chapter 5,6
Preface
The project of writing a book on electromagnetic compatibility of
integrated circuits took form and substance during the international
workshop EMC Compo 2004 in Angers, France, and led to this present
work. More than thirty contributors to the workshop have been asked to
participate the book chapters, according to their expertise. The editors
gathered the technical contributions and did their best to build self-consistent
chapters related to the major hot topics of this field, namely the
measurements methods, the modeling approaches, and the design techniques
for low emission. Several test cases have been gathered into a specific
chapter. The technical contents of this document are intended to help IC
designers and electronics system designers reduce the parasitic emission as
well as susceptibility to radio-frequency interference.
This book is a unique collection of information focused on the
electromagnetic compatibility of integrated circuits. The basic concepts,
theory, and an extensive historical review of integrated circuit emission and
susceptibility are provided. Standardized measurement methods are detailed
through various case studies. EMC models for the core, I/Os, supply
network, and packaging are described with applications to conducted
switching noise, signal integrity, near-field and radiated noise. Case studies
from different companies and research laboratories are presented with in-
depth descriptions of the ICs, test set-ups, and comparisons between
measurements and simulations. Specific guidelines for achieving low
emission and susceptibility derived from the experience of EMC experts are
presented. The companion CD-ROM includes software illustrating key
aspects of the book and a collection of demo tools applicable to EMC
analysis of ICs.
Acknowledgements
We would like our early colleagues of the IERSET project in Toulouse as
well as the partners from the European MEDEA project "EMC Workbench"
and "Mesdie" for their support throughout the development of test circuits
and design methodologies for improved EMC. We would like to thank
Joseph-Georges Ferrante, Werner John for provided their continuous support
over the last ten years. Productive technical discussions with the French
UTE standardization group, the authors and contributors to EMC Compo 02
in Toulouse, France and EMC Compo 04 in Angers, France, are also
gratefully acknowledged.
Special thanks are due to technical contributors to the companion CD-
ROM, to our colleagues at INSA and ESEO who always supported our
research work, to numerous professors, students and engineers who patiently
built the technical contents of the book and gave valuable comments and
suggestions. Also, we would like to thank Marie-Agnes Detourbe, John Kerr
and Langis Roy for having carefully reviewed the manuscript.
Finally we would like to acknowledge our biggest debt to our parents and
to our companion for their constant support.
Chapter I
BASIC CONCEPTS IN EMC FOR ICS
Abstract: This chapter introduces key concepts related to Electromagnetic Compatibility
(EMC) of Integrated Circuits (ICs), describes basic measurement methods and
provides an outline of IC modeling for EMC prediction. A brief description of
electric and magnetic field coupling, conducted and radiated mode emissions,
as well as susceptibility, are also given in this chapter.
Key words: Electromagnetic compatibility; electric field; magnetic field; coupling;
simultaneous switching noise; crosstalk; radiated emission; conducted
emission; EMC modeling; EMC measurement methods
1. INTEGRATED CIRCUIT EMC
Integrated circuits (ICs) often play an important role in the
electromagnetic compatibility of an electronic system. Generally, ICs are the
ultimate source of signals and noise that produce interference. They convert
the D.C. power supplied to them into the high-frequency currents and
voltages that are responsible for unintentional emissions or coupling. The
ultimate victims of electromagnetic interference are also, very often, ICs. Of
all the components in a typical electronic system, ICs tend to be the most
susceptible to damage caused by over-voltage or over-current conditions.
Even if they are not damaged, noise coupled to the input or power pins of
ICs may cause them to malfunction. Although ICs are generally the ultimate
source and/or victim of an EMC problem, the focus of most EMC-related
research and problem solving has been external to the IC package. EMC
engineers have traditionally focused their efforts on the design of printed
circuit boards, enclosures, and cabling. With a few notable exceptions (e.g.
over-voltage protection and slew rate control), EMC has not played a major
role in the design of the integrated circuit itself.
EMC problems associated with integrated circuits can generally be
classified as intra-chip or externally-coupled.
