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About ECE467: Introduction To VLSI: Physical Structure and Fabrication Process of Integrated Circuits
This document provides an overview of ECE467: Introduction to VLSI. It discusses the physical structure and fabrication process of integrated circuits in three main parts: 1. It describes the layers that make up an integrated circuit, including the wafer/substrate, wells, diffusions, channels, contacts, insulation layers, interconnect lines, and vias. 2. It explains the cross-sectional and top views of an IC and how different parts can be seen from each perspective. 3. It gives a brief overview of the IC fabrication process, mentioning photolithography, optical masks, design rules, and the basic steps involved like oxidation, photoresist coating, exposure, and development.
Detailed Information
| Author: | ['snagaraj.cool7813'] |
|---|---|
| Publication Year: | 2021 |
| Pages: | 38 |
| Language: | English |
| Format: | |
| Price: | FREE |
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