Design Technology Co-Optimization in the Era of Sub-Resolution IC Scaling

179 Pages·1984·7.952 MB·English

by  Lars W. Liebmann, Kaushik Vaidyanathan, Lawrence Pileggi

Design Technology
Co-Optimization in the
Era of Sub-Resolution
IC Scaling
Lars W. Liebmann
Kaushik Vaidyanathan
Lawrence Pileggi

Tutorial Texts Series
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(ForacompletelistofTutorialTexts,seehttp://spie.org/tt.)
Design Technology
Co-Optimization in the
Era of Sub-Resolution
IC Scaling
Lars W. Liebmann
Kaushik Vaidyanathan
Lawrence Pileggi
Tutorial Texts in Optical Engineering
Volume TT104
SPIE PRESS
Bellingham, Washington USA
Library of Congress Cataloging-in-Publication Data
Names: Liebmann, Lars W., author. | Vaidyanathan, Kaushik, author. | Pileggi,
Lawrence, 1962- author.
Title: Design technology co-optimization in the era of sub-resolution IC scaling /
Lars W. Liebmann, Kaushik Vaidyanathan, and Lawrence Pileggi.
Other titles: Tutorial texts in optical engineering ; v. TT 104.
Description:Bellingham,Washington:SPIE,[2016]|©2016|Series:Tutorialtextsin
optical engineering ; volume TT104 | Includes bibliographical references and index.
Identifiers:LCCN2015032506|ISBN9781628419054(alk.paper)|ISBN1628419059
(alk. paper)
Subjects: LCSH: Integrated circuits—Design and construction. | Lithography,
Electron beam.
Classification: LCC TK7874.L455 2015 | DDC 621.3815—dc23
LC record available at http://lccn.loc.gov/2015032506
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Printed in the United States of America.
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We dedicate this book to all of the challenges that have made this journey
interesting and to all of the outstanding colleagues who have kept
semiconductor scaling going far beyond anyone’s expectations.

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Rutgers University
vii

Table of Contents
Preface xi
List of Acronyms and Abbreviations xv
1 The Escalating Design Complexity of Sub-Resolution Scaling 1
1.1 k .0.6: The Good Old Days 3
1
1.2 0.6.k .0.5: Optical Proximity Correction 5
1
1.3 0.5.k .0.35: Off-Axis Illumination 8
1
1.4 0.35.k .0.25: Asymmetric Off-Axis Illumination 15
1
1.5 0.25.k .0.125: Double Patterning 20
1
1.6 k ,0.125: Higher-Order Frequency Multiplication 27
1
2 Multiple-Exposure-Patterning-Enhanced Digital Logic Design 33
2.1 Introduction to Physical Design 33
2.2 The Evolution of Standard Cell Layouts 35
2.2.1 Attributes of standard logic cells 35
2.2.2 Impact of patterning-driven design constraints 41
2.3 Standard Cell Layout in the Era of Double Patterning 45
2.4 Two Generations of Double-Patterning-Enhanced P&R 48
2.4.1 Color-aware placement 49
2.4.2 Color-aware routing 55
2.5 Beyond P&R: The Impact of Double Patterning on Floor Planning 63
3 Design for Manufacturability 67
3.1 Critical Area Optimization 67
3.2 Recommended Design Rules 72
3.3 Chemical Mechanical Polishing 73
3.4 Lithography-Friendly Design 75
3.5 Prescriptive Design Rules 85
3.6 Case Study: Design Implications of Restrictive Patterning 87
3.6.1 Background 88
3.6.2 Impact of extremely restrictive lithography on SoC design 91
4 Design Technology Co-Optimization 101
4.1 The Four Phases of DTCO 101
4.1.1 Phase 1: establish scaling targets 102
ix