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Course Title: VLSI Technology Course No.: EEE 489 PDF

18 Pages·2021·English
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by ['Rubel Riad']| 2021| 18 pages| English

About Course Title: VLSI Technology Course No.: EEE 489

This document discusses wafer cleaning processes in VLSI fabrication. It introduces the concepts of front-end-of-line and back-end-of-line cleaning and the differences in surfaces that must be cleaned. It describes hydrophilic and hydrophobic surfaces and how they affect cleaning. The RCA clean process is discussed in detail as the most widely used clean. Variations of the RCA clean like the IMEC clean are also summarized. Common contaminants and cleaning chemicals are briefly outlined. The document concludes with an introduction to metallization and passivation steps.

Detailed Information

Author:['Rubel Riad']
Publication Year:2021
Pages:18
Language:English
Format:PDF
Price:FREE
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