ARM Cortex-M4 32b MCU+FPU, up to 256KB Flash+48KB SRAM 4 ADCs, 2 DACs, 7 comp., 4 ...

58 Pages·2012·0.81 MB·English

STM32F313xx
ARM Cortex-M4 32b MCU+FPU, up to 256KB Flash+48KB SRAM
4 ADCs, 2 DACs, 7 comp., 4 PGA, timers, 1.8 V operation
Data brief
Features
■ Core: ARM® 32-bit Cortex™-M4F CPU (72 MHz
max), single-cycle multiplication and HW
LQFP48 (7 × 7 mm)
division, DSP instruction with FPU (floating-point
LQFP64 (10 × 10 mm)
unit) and MPU (memory protection unit). LQFP100 (14 × 14 mm)
■ Operating conditions:
■ Up to 13 timers
– V : 1.8V +/- 8%
DD – One 32-bit timer and two 16-bit timers with
– VDDA voltage range: 1.65 to 3.6 V up to 4 IC/OC/PWM or pulse counter and
■ Memories quadrature (incremental) encoder input
– 128 to 256Kbytes of Flash memory – Up to two 16-bit 6-channel advanced-control
– Up to 40Kbytes of SRAM on data bus with timers, with up to 6 PWM channels,
HW parity check deadtime generation and emergency stop
– 8Kbytes of SRAM on instruction bus with – One 16-bit timer with 2 IC/OCs, 1
HW parity check (CCM) OCN/PWM, deadtime generation and
■ CRC calculation unit emergency stop
■ Reset and supply management – Two 16-bit timers with IC/OC/OCN/PWM,
– Low power modes: Sleep and Stop deadtime generation and emergency stop
– VBAT supply for RTC and backup registers – Two watchdog timers (independent, window)
■ Clock management – SysTick timer: 24-bit downcounter
– 4 to 32MHz crystal oscillator – Up to two 16-bit basic timers to drive the
– 32kHz oscillator for RTC with calibration DAC
– Internal 8MHz RC with x 16 PLL option ■ Calendar RTC with Alarm, periodic wakeup from
– Internal 40kHz oscillator Stop
■ Up to 87 fast I/Os ■ Communication interfaces
– All mappable on external interrupt vectors – CAN interface (2.0B Active)
– Several 5V-tolerant – Two I2C Fast mode plus (1 Mbit/s) with 20
■ 12-channel DMA controller mA current sink, SMBus/PMBus, wakeup
■ Up to four ADC 0.20µS (up to 39 channels) with from STOP
selectable resolution of 12/10/8/6 bits, 0 to 3.6V – Up to five USART/UARTs (ISO 7816
conversion range, separate analog supply from interface, LIN, IrDA, modem control)
1.8 to 3.6V – Up to three SPIs, two with multiplexed I2S
■ Up to two 12-bit DAC channels with analog interface, 4 to 16 programmable bit frame
supply from 2.4 to 3.6 V – Infrared Transmitter
■ Seven fast rail-to-rail analog comparators with ■ Serial wire debug, JTAG, Cortex-M4F ETM
analog supply from 1.65 to 3.6 V ■ 96-bit unique ID
■ Up to four operational amplifiers that can be
used in PGA mode, all terminal accessible with Table 1. Device summary
analog supply from 2.4 to 3.6 V
Reference Part number
■ Support for up to 23capacitive sensing keys
supporting touchkey, linear and rotary STM32F313xx STM32F313CC, STM32F313RC, STM32F313VC
touchsensors
September 2012 Doc ID 023636 Rev 1 1/58
For further information contact your local STMicroelectronics sales office. www.st.com 1
Contents STM32F313xx
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 ARM® Cortex™-M4F core with embedded Flash and SRAM . . . . . . . . . 10
3.2 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.4 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.6 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 11
3.7 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.7.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.7.2 Power supply supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.7.3 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.8 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.9 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.10 DMA (direct memory access) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.11 Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.11.1 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 14
3.12 Fast ADC (analog-to-digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.12.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.12.2 Internal voltage reference (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
REFINT
3.12.3 V battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
BAT
3.12.4 OPAMP reference voltage (VOPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.13 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.14 Operational amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.15 Fast comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.16 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.16.1 Advanced timers (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.16.2 General-purpose timers (TIM2, TIM3, TIM4, TIM15, TIM16, TIM17) . . 19
3.16.3 Basic timers (TIM6, TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.16.4 Independent watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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STM32F313xx Contents
3.16.5 Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.16.6 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.17 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 21
3.18 I2C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.19 Universal synchronous/asynchronous receiver transmitter (USART) . . . 22
3.20 Universal asynchronous receiver transmitter (UART) . . . . . . . . . . . . . . . 23
3.21 Serial peripheral interface (SPI)/Inter-integrated sound interfaces (I2S) . 23
3.22 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.23 Infrared Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.24 Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.25 Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.25.1 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.25.2 Embedded trace macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.2.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.2.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . . 54
7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Doc ID 023636 Rev 1 3/58
List of tables STM32F313xx
List of tables
Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. STM32F31x family device features and peripheral counts. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 4. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5. Timer feature comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 6. Comparison of I2C analog and digital filters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 7. STM32F31x I2C implementation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 8. USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 9. STM32F31x SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 10. Capacitive sensing GPIOs available on STM32F31x devices . . . . . . . . . . . . . . . . . . . . . . 26
Table 11. No. of capacitive sensing channels available on STM32F313xx devices. . . . . . . . . . . . . . 26
Table 12. Legend/abbreviations used in the pinout table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 13. STM32F313xx pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 14. Alternate functions for port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 15. Alternate functions for port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 16. Alternate functions for port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 17. Alternate functions for port D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 18. Alternate functions for port E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 19. Alternate functions for port F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 20. STM32F31x memory map and peripheral register boundary
addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 21. LQPF100 – 14 x 14mm, 100-pin low-profile quad flat package mechanical data . . . . . . . 50
Table 22. LQFP64 – 10 x 10mm, 64-pin low-profile quad flat package mechanical data . . . . . . . . . 51
Table 23. LQFP48 – 7 x 7mm, 48-pin low-profile quad flat package mechanical data . . . . . . . . . . . 52
Table 24. Package thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 25. Ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Table 26. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4/58 Doc ID 023636 Rev 1
STM32F313xx List of figures
List of figures
Figure 1. STM32F313xx block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 2. Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3. Infrared transmitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 4. STM32F313xx LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 5. STM32F313xx LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 6. STM32F313xx LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 7. STM32F31x memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 8. LQFP100, 14 x 14mm, 100-pin low-profile quad flat package outline. . . . . . . . . . . . . . . . 50
Figure 9. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 10. LQFP64 – 10 x 10mm, 64 pin low-profile quad flat package outline. . . . . . . . . . . . . . . . . 51
Figure 11. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 12. LQFP48 – 7 x 7mm, 48-pin low-profile quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 13. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 14. LQFP100 P max vs. T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
D A
Doc ID 023636 Rev 1 5/58
Introduction STM32F313xx
1 Introduction
This databrief provides the ordering information and mechanical device characteristics of
the STM32F31x microcontrollers.
This STM32F31x databrief should be read in conjunction with the STM32F31x reference
manual. The reference manual is available from the STMicroelectronics website
www.st.com.
For information on the Cortex™-M4F core please refer to the Cortex™-M4F Technical
Reference Manual, available from the www.arm.com website at the following address:
http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.subset.cortexm.m4/index.html

6/58 Doc ID 023636 Rev 1
STM32F313xx Description
2 Description
The STM32F313xx family is based on the high-performance ARM® Cortex™-M4 32-bit
RISC core operating at a frequency of up to 72MHz, and embedding a floating point unit
(FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The
family incorporates high-speed embedded memories (up to 256Kbytes of Flash memory, up
to 48Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals
connected to two APB buses.
The devices offer up to four fast 12-bit ADCs (5Msps), up to seven comparators, up to four
operational amplifiers, up to two DAC channels, a low-power RTC, up to five general-
purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor
control. They also feature standard and advanced communication interfaces: up to two I2Cs,
up to three SPIs (two SPIs are with multiplexed full-duplex I2Ss on STM32F313xx devices),
three USARTs, up to two UARTsand CAN. To achieve audio class accuracy, the I2S
peripherals can be clocked via an external PLL.
The STM32F313xx family operates in the -40 to +85°C and -40 to +105°C temperature
ranges from a 2.0 to 3.6V power supply. A comprehensive set of power-saving mode allows
the design of low-power applications.
The STM32F313xx family offers devices in three packages ranging from 48 pins to 100 pins.
The set of included peripherals changes with the device chosen.
Doc ID 023636 Rev 1 7/58
Description STM32F313xx
Table 2. STM32F31x family device features and peripheral counts
STM32F STM32F STM32F
Peripheral
313Cx 313Rx 313Vx
Flash (Kbytes) 128 256 128 256 128 256
SRAM (Kbytes) on data bus 32 40 32 40 32 40
SRAM (Kbytes) on instruction bus
8
(CCM: core coupled memory)
Advanced
2 (16-bit)
control
Timers 5 (16-bit)
General purpose
1 (32 bit)
Basic 2 (16-bit)
SPI(I2S)(1) 3(2)
I2C 2
Comm.
USART 3
interfaces
UART 2
CAN 1
Normal
I/Os 19 26 44
(TC,TTa)
GPIOs
5 volts
Tolerant
17 25 42
I/Os
( FT, Ftf)
DMA channels 12
12-bit ADCs 4
12-bit DAC channels 2
Analog comparator 7
Operational amplifiers 4
CPU frequency 72 MHz
Operating voltage V = 1.8 V +/- 8%, V = 1.65 V to 3.6 V
DD DDA
Ambient operating temperature: - 40 to 85 °C / - 40 to 105 °C
Operating temperature
Junction temperature: - 40 to 125 °C
Packages LQFP48 LQFP64 LQFP100
1. In 128K and 256K Flash STM32F313xx devices the SPI interfaces can work in an exclusive way in either
the SPI mode or the I2S audio mode.
8/58 Doc ID 023636 Rev 1
STM32F313xx Description
Figure 1. STM32F313xx block diagram
TRTARCAEDDE[C0L-3K] SWTPJTIUAG TraEcTeM/Trig VDD18 Power VVDSSDIO = 1.8 +/- 8%
JTCK/SJWTaJsRCT ASLDKFTI CoMrtePxU M/F4P CUPU Ibus OBL Flash interfaceFLAS64H b2i5ts6 KB @VDDIO
JTMS/SWDAT Dbus NRESET
AJTs DAOF FmaxN: 7V2IC MHz System BusMatrix CCS4M80RK AKRBMBAM @VDDA Reset @SVuDSpDuAeprvpilsyi on VVNDSPSDOAAR
GP DMA1 RC HS 8MHz @VDDIO
7 channels RC LS
GP DMA2 PLL X4T -A3L2 OMSHCz OOSSCC__IONUT
5 channels
Ind. WDG32K
Temp. sensor AHBPCLK
APBP1CLK
12-bit ADC1 IF APBP2CLK VBAT = 1.65V to 3.6V
VREF+ 12-bit ADC2 Reset & HCLK @VSW
VREF- 12-bit ADC3 IF AHB3 ccolnotcrko l IFU2CSCLACKRLTKCLK ARWTCUXTA(BL6 a4R3cB2ekykgutHepz) OOSSCCA3322N__TIOIN-UTATMP
12-bit ADC4 ADC SAR
Backup
1/2/3/4 CLK
interface
PA[15:0] GPIO PORT A CRC (32T-IbMitE/PRW2M ) 4 Channels, ETR as AF
PB[15:0] GPIO PORT B TIMER 3 4 Channels, ETR as AF
PC[15:0] GPIO PORT C B2 TIMER 4 4 Channels, ETR as AF
H
PD[15:0] GPIO PORT D A MOSI/SD, MISO/ext_SD,
Hz SPI2/I2S SCK/CK, NSS/WS, MCLK as AF
PE[15:0] GPIO PORT E M
PF[7:0] GPIO PORT F = 36 Fmax SUPSIA3/RI2TS2 MSRCXOK,S T/ICX/SK, D,C ,NT MSSIS,S R/OWT/SeSx,, tMa_sSC ADLF,K as AF
B1
XX Groups of Touch Sensing AP USART3 RX, TX, CTS, RTS, as AF
4 channels as AF Controller
UART4 RX, TX as AF
AHB2 AHB2
APB2 APB1 UART5 RX, TX as AF
I2C1 SCL, SDA, SMBA as AF
I2C2 SCL, SDA, SMBA as AF
WinWATCHDOG
bx CAN &
XX AF EXT.IT 512B SRAM CAN TX, CAN RX
WKUP
2 Channels,1 Comp
Channel, BRK as AF TIMER 15 TIMER6
DAC1_CH1 as AF
1C hCahnannenl,e Bl, R1K C aosm ApF TIMER 16 MHz TIMER7 IF 12bit DAC1 DAC1_CH2 as AF
1C hC4a hCnanhneanln,e nBl,e R1lsK C, aosm ApF TIMER 17 = 72 B2 fmax @VDDA
4 Comp channels, TIMER 1 / PWM AP OpAmp1 INxx / OUTxx
ETR, BRK as AF E
4 Channels, TIMER 8 / PWM FAC OpAmp2 INxx / OUTxx
4 Comp channels, R
ETR, BRK as AF SYSCFG CTL TE OpAmp3 INxx / OUTxx
N
I OpAmp4 INxx / OUTxx
MSCOKS,IN, SMSIS aOs, AF SPI1 @VDDA
@VDDA
GP Compparator 7
RX, TX, CTS, RTS,
SmartCard as AF USART1 GP CGoPm Cpoamraptoarr a1tor...
MS30364V1
Xx Ins, 7 OUTs as AF
1. AF: alternate function on I/O pins.
Doc ID 023636 Rev 1 9/58
Functional overview STM32F313xx
3 Functional overview
®
3.1 ARM Cortex™-M4F core with embedded Flash and SRAM
The ARM Cortex-M4F processor is the latest generation of ARM processors for embedded
systems. It was developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced response to interrupts.
The ARM Cortex-M4F 32-bit RISC processor features exceptional code-efficiency,
delivering the high-performance expected from an ARM core in the memory size usually
associated with 8- and 16-bit devices.
The processor supports a set of DSP instructions which allow efficient signal processing
and complex algorithm execution.
Its single precision FPU speeds up software development by using metalanguage
development tools, while avoiding saturation.
With its embedded ARM core, the STM32F313xx family is compatible with all ARM tools
and software.
Figure1 shows the general block diagrams of the STM32F313xx family devices.
3.2 Memory protection unit
The memory protection unit (MPU) is used to separate the processing of tasks from the data
protection. The MPU can manage up to 8 protection areas that can all be further divided up
into 8 subareas. The protection area sizes are between 32 bytes and the whole 4 gigabytes
of addressable memory.
The memory protection unit is especially helpful for applications where some critical or
certified code has to be protected against the misbehavior of other tasks. It is usually
managed by an RTOS (real-time operating system). If a program accesses a memory
location that is prohibited by the MPU, the RTOS can detect it and take action. In an RTOS
environment, the kernel can dynamically update the MPU area setting, based on the
process to be executed.
The MPU is optional and can be bypassed for applications that do not need it.
The Cortex-M4F processor is a high performance 32-bit processor designed for the
microcontroller market. It offers significant benefits to developers, including:
● Outstanding processing performance combined with fast interrupt handling
● Enhanced system debug with extensive breakpoint and trace capabilities
● Efficient processor core, system and memories
● Ultralow power consumption with integrated sleep modes
● Platform security robustness with optional integrated memory protection unit (MPU)
With its embedded ARM core, the STM32F313xx devices are compatible with all ARM
development tools and software.
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