Adhesives and Sealants: Basic Concepts and High Tech Bonding

515 Pages·2005·11.352 MB·English

by  Philippe Cognard (Eds.)

ADHESIVES AND SEALANTS
Basic Concepts and High Tech Bonding
Handbook of Adhesives and Sealants
Volume 1
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ADHESIVES AND SEALANTS
Basic Concepts and High Tech Bonding
Handbook of Adhesives and Sealants
Volume 1
SERIES EDITOR
PHILIPPE COGNARD
Versailles, France
2005
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Contents
Colour Plates xi–xxii
Chapter 1. Introduction— How toUse This Handbook 1
PhilippeCognard,SeriesEditor
1.1. Scope, Purposeand Contents ofthe Handbook ofAdhesives
and Sealants 1
1.2. AComprehensive Handbook 2
1.3. AUniqueFeature ofThis Handbook Isthe Fact thatthe Readers
May Use itin FourDifferent Ways 3
1.4. AComprehensive Book for Everybody 7
1.5. All Authors Are High-Level SpecialistScientists,
Engineers, orChemists 7
1.6. List ofContents for Volumes 1–4 8
1.7. Any Other Ideas orSuggestions? 10
1.8. The Publisher— Elsevier 11
1.9. ForewordtoChapter5: “Aerospace, Pioneer inStructural Bonding” 11
1.10. ForewordtoChapter2: “Technical Characteristics ofAdhesives” 11
1.11. ForewordtoChapter3: “Polyurethane Adhesives and Sealants” 13
1.12. ForewordtoChapter6: “Adhesives for Electronics” 13
1.13. Volume1, Handbook ofAdhesives and Sealants 14
1.13.1. List andAddresses ofSuppliers 14
1.13.2. Laboratoryand TestingEquipment 14
1.13.3. Polyurethanes, Raw Materials Suppliers,Adhesives
andSealants Suppliers 16
1.13.4. PUAdhesives andSealants Manufacturers 17
1.13.5. Suppliersof Adhesives and Equipmentfor Aerospace 17
1.13.6. Equipment(Autoclaves, etc.) 18
1.13.7. Suppliersof Adhesives and Potting Compounds for
Electronics 19
1.13.8. Standardization Organizations 19
Chapter 2. Technical Characteristics and Testing Methodsfor Adhesives
andSealants 21
PhilippeCognard
2.1. General Comments, How Adhesives and SealantsWork 22
vi Contents
2.1.1. Reasons for Testing 23
2.1.2. Test Methods,Standards 26
2.1.3. Sealants Standards 26
2.1.4. General Methodsof Testing 27
2.2. Technical Characteristics ofA& S before andduringUse 27
2.2.1. Quality Control(QC) Tests 27
2.2.2. Properties Related tothe MethodofUse 43
2.3. Properties ofCured/Dry Adhesives 63
2.3.1. Mechanical Characteristics 63
2.3.2. Physical Characteristics 82
2.3.3. Chemical Characteristics 85
2.3.4. Durability 89
2.3.5. Safety Characteristics 93
Conclusion 99
Chapter 3. Chemistryof Polyurethane Adhesives andSealants 101
D.M.Segura, A.D. Nurse,A. McCourt,R. PhelpsandA. Segura
3.1. Introduction 101
3.2. Polyurethane Chemistry 102
3.2.1. Reactions ofIsocyanates 103
3.2.2. ReactionofIsocyanates with Alcohols 103
3.2.3. ReactionofIsocyanates with Amine 104
3.2.4. ReactionofIsocyanates with Water 104
3.2.5. Allophanate andBiuretFormation 104
3.3. Common Polyurethane RawMaterials 105
3.3.1. Aromatic Isocyanates 105
3.3.2. Polyisocyanates 107
3.3.3. Aliphatic Isocyanates 108
3.3.4. Polyols 110
3.3.5. Catalysts 120
3.3.6. Solvents 122
3.3.7. Plasticisers 122
3.3.8. Additives 122
3.4. Structure Property Relationships 123
3.4.1. Hard–Soft Segment Theory 123
3.5. Classification of Polyurethane Adhesives andSealants 126
3.5.1. Nomenclature 127
3.5.2. Classification by GeneralType 128
3.5.3. Other Curing Characteristics 131
3.6. Applications ofPolyurethane Adhesives and Sealants 134
3.6.1. Adhesives 134
3.6.2. Polyurethane SealantsApplications 146
3.7. Testing and Standards ofPolyurethane Adhesives and Sealants 151
Contents vii
3.7.1. Tack of Adhesives and Sealants 152
3.7.2. Green Strength Adhesives 152
3.7.3. Peel Strength Adhesives and Sealants 152
3.7.4. Impact Testing AdhesiveJoints 154
3.7.5. Environmental TestingAdhesivesand Sealants 154
3.7.6. The Effect ofGlass Transition Temperature onAdhesives
andSealants 155
3.7.7. Durability ofBondedSystems 157
3.7.8. Single LapJointTest 157
3.7.9. Tensile Butt JointTest 157
3.7.10. Perforated Hydrothermal Test 159
References 159
Chapter 4. Surface Pretreatment for StructuralBonding 163
John Bishopp
4.1. Introduction 164
4.2. Overview ofSurface Pretreatment Techniques 165
4.2.1. Degreasing Methods 165
4.2.2. Abrasion Methods 167
4.3. Pretreatment of Specific Substrates 168
4.3.1. AluminiumAlloys 169
4.3.2. Titanium andTitanium Alloys 196
4.3.3. Stainless Steel 203
4.3.4. Fibre-reinforced Laminates 204
4.3.5. Non-metallic Honeycombs 210
References 211
Chapter 5. Aerospace: APioneer inStructural AdhesiveBonding 215
John Bishopp
5.1. The Wright Brothers 217
5.2. Structural Bonding inWooden Aircraft 218
5.2.1. Animal Glues 218
5.2.2. Synthetic Adhesives 223
5.3. Early Structural AdhesiveBonding inMetallic AircraftStructures 229
5.3.1. Redux andthe Redux Process 229
5.4. The Acceptance ofStructural Bonding by the Post-war
Aerospace Industry 235
5.4.1. WhyBond? 237
5.5. The AdhesiveJoint 244
5.5.1. Substrates 244
5.5.2. Substrate SurfacePretreatment 254
5.5.3. Primers andPriming 255
5.5.4. Adhesives 261
viii Contents
5.6. Applications for Structural Adhesives Within the Aerospace Industry 294
5.6.1. Phenolic Adhesives 294
5.6.2. Phenolic-epoxy Adhesives 300
5.6.3. From Phenolic-epoxy toEpoxy Adhesives 301
5.6.4. EpoxyAdhesives 302
5.6.5. Bismaleimide Adhesives 337
5.6.6. CyanateEsterAdhesives 338
5.6.7. Acrylic Adhesives 338
5.6.8. Polyurethane Adhesives 339
5.7. AdhesiveCosts andMarket Share 339
Acknowledgements 340
Appendix A5.1. European (EN) AdhesiveTest Methodsand
Specifications 341
Appendix B5.1. American (ASTM) AdhesiveTest Methods
and Specifications 342
Appendix C5.1. Adhesive Specifications 344
References 345
Chapter 6. Adhesives inElectronics 349
Guy Rabilloud
6.1. Introduction 349
6.1.1. Historical Background 349
6.1.2. SemiconductorTechnology 350
6.2. ChemicalCompounds 352
6.2.1. Free-radical andIonicPolymerization 353
6.2.2. EpoxyAdhesives 354
6.2.3. Epoxy-phenolic Resins 367
6.2.4. Epoxy-siliconeCompositions 369
6.2.5. SiliconeResins 371
6.2.6. CyanateEsterResins 372
6.2.7. Polyimides 374
6.3. Electrical andThermal Conductivities 380
6.3.1. Inorganic Fillers 380
6.3.2. Electrical Conductivity 381
6.3.3. Thermal Conductivity 385
6.4. Material Properties 390
6.4.1. Properties of Uncured Adhesives 390
6.4.2. Properties of Cured Adhesives 396
6.5. Applications ofAdhesives 413
6.5.1. Integrated CircuitFabrication 413
6.5.2. Fabrication of Bumped Connectors 414
6.5.3. Substrates for Multichip Modules 416
6.5.4. FlexibleCircuits andTape Automated Bonding 420
6.5.5. Die Attachment 423
Contents ix
6.5.6. Flip ChipBonding Technology 427
6.5.7. Surface-mounted Components 429
6.5.8. Liquid Crystal DisplayDevices 434
6.6. Reliability of AdhesiveBonds 438
6.6.1. Integrated Circuits 438
6.6.2. MultichipModules 439
6.6.3. Flexible Circuits 440
6.6.4. DieAttachment 440
6.6.5. Flip ChipBonding 453
6.6.6. Surface-mounted Components 454
6.6.7. Liquid Crystal Displays 459
6.7. Thermal Stresses 461
6.8. Conclusion 471
References 476
Index 485