12-Bit Analog Monitoring and Control Solution w/ADC, DACs

92 Pages·2016·2.36 MB·English

AMC7812
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12-Bit Analog Monitoring and Control Solution
with Multichannel ADC, DACs, and Temperature Sensors
CheckforSamples:AMC7812
FEATURES DESCRIPTION
1
• 12,12-BitDACswithProgrammableOutputs: The AMC7812 is a complete analog monitoring and
234 control solution that includes a 16-channel, 12-bit
– 0Vto 5V
analog-to-digital converter (ADC), twelve 12-bit
– 0Vto 12.5V digital-to-analogconverters(DACs), eight GPIOs,and
• DACShutdowntoUser-Defined Level tworemote/onelocaltemperaturesensorchannels.
• 12-Bit,500kSPSADCwith16Inputs: TheAMC7812hasaninternalreferenceof+2.5V that
– 16Single-Endedor can configure the DAC output voltage to a range of
either 0V to +5V or 0V to +12.5V. An external
– TwoDifferential+12Single-Ended
reference can be used as well. Typical power
• TwoRemoteTemperatureSensors: dissipation is 95mW. The AMC7812 is ideal for
– –40°Cto +150°C, ±2°CAccuracy multichannel applications where board space, size,
andlowpower arecritical.
• OneInternalTemperatureSensor:
– –40°Cto +125°C, ±2.5°CAccuracy The AMC7812 is available in either a 64-lead QFN or
HTQFP-64 PowerPAD™ package and is fully
• Input Out-of-RangeAlarms
specified over the –40°C to +105°C temperature
• 2.5VInternalReference range.
• Eight General-PurposeInput/Outputs
For applications that require a different channel
• ConfigurableI2C-Compatible/SPI™Interface count, additional features, or converter resolutions,
with5V/3VLogic Texas Instruments offers a complete family of analog
monitor and control (AMC) products. Visit
• Power-DownMode
http://www.ti.com/amc for moreinformation.
• WideTemperatureRange:
– –40°Cto +105°C ADC-REF-IN/CMP AMC7812
• S10mmamll Pxa1c0kmagmesH:T9QmFmP-x649mmQFN-64,and Single-Ended/Differential CCCCCCCHHHHHHH0123456 Re(f2e.r5eVn)ce REF-OUT
A• PRPFLPICoAweTrIOAmNpSlifierControlinBaseStations Single-Ended CCCCCCCCCHHHHHHHHH111111012345789 ADC Trigger DAC-0 RDDDEAAAFCCC-012D---OOOACUUUTTT
D1+ GPIO-5 Control/Limits/Status DAC3-OUT
• Testand Measurement Registers DAC4-OUT
DAC5-OUT
•• IGnednuesrtarilaAlnCaolnotgroMlonitoringandControl TEMP/GPIO DD21+- GGPPIIOO--47 TemRSDepermenivrsoeaotrterure TemSLpeoencrsaaoltrure DDDDAAAACCCC6789----OOOOUUUUTTTT
DAC10-OUT
D2- GPIO-6 DAC-11 DAC11-OUT
GPIO GGPPIIOO--30 GPIO Controller LOAD-DAC
ALARM
Out-of-Range
Alarms DACs Clear Logic DAC-CLR-0
DAC-CLR-1
RESET
Control Serial Interface Register and Control
DAV Logic (SPI/I2C)
DVDD DGND CNVT IOVDD SPI/I2C SCLK/SCL SDI/SDA CS/A0 SDO/A1 A2 AVCC AVDD1 AVDD2 AGND1 AGND2 AGND3 AGND4
1
Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof
TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
SPI,QSPIaretrademarksofMotorola,Inc.
2
MICROWIREisatrademarkofNationalSemiconductor.
3
Allothertrademarksarethepropertyoftheirrespectiveowners.
4
PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2011–2013,TexasInstrumentsIncorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarilyincludetestingofallparameters.
AMC7812
SBAS513E–JANUARY2011–REVISEDSEPTEMBER2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore
susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
PACKAGE/ORDERING INFORMATION(1)
MAXIMUM MAXIMUM
RELATIVE DIFFERENTIAL SPECIFIED
ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING
QFN-64 RGC –40°Cto+105°C AMC7812
AMC7812 ±1 ±1
HTQFP-64 PAP –40°Cto+105°C AMC7812
(1) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orvisitthe
deviceproductfolderatwww.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Overoperatingfree-airtemperaturerange,unlessotherwisenoted.
AMC7812 UNIT
AV toGND –0.3to+6 V
DD
DV toGND –0.3to+6 V
DD
IOV toGND –0.3to+6 V
DD
AV toGND –0.3to+18 V
CC
DV toDGND –0.3to+6 V
DD
AnaloginputvoltagetoGND –0.3toAV +0.3 V
DD
ALARM,GPIO-0,GPIO-1,GPIO-2,GPIO-3,SCLK/SCL,andSDI/SDAtoGND –0.3to+6 V
D1+/GPIO-4,D1–/GPIO-5,D2+/GPIO-6,D2–/GPIO-7toGND –0.3toAV +0.3 V
DD
DigitalinputvoltagetoDGND –0.3toIOV +0.3 V
DD
SDOandDAVtoGND –0.3toIOV +0.3 V
DD
Operatingtemperaturerange –40to+105 °C
Storagetemperaturerange –40to+150 °C
Junctiontemperaturerange(T max) +150 °C
J
Humanbodymodel(HBM) 2.5 kV
ESDratings
Chargeddevicemodel(CDM) 1.0 kV
(1) StressesabovethoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Exposuretoabsolute
maximumconditionsforextendedperiodsmayaffectdevicereliability.
THERMAL INFORMATION
AMC7812
THERMALMETRIC(1) RGC(QFN) PAP(HTQFP) UNITS
64PINS 64PINS
θ Junction-to-ambientthermalresistance 24.1 33.7
JA
θ Junction-to-case(top)thermalresistance 8.1 9.5
JCtop
θ Junction-to-boardthermalresistance 3.2 9.0
JB
°C/W
ψ Junction-to-topcharacterizationparameter 0.1 0.3
JT
ψ Junction-to-boardcharacterizationparameter 3.3 8.9
JB
θ Junction-to-case(bottom)thermalresistance 0.6 0.2
JCbot
(1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953.
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ELECTRICAL CHARACTERISTICS
AtT =–40°Cto+105°C,AV =DV =4.5Vto5.5V,AV =+15V,AGND=DGND=0V,IOV =2.7Vto5.5V,internal
A DD DD CC DD
2.5Vreference,andtheDACoutputspan=0Vto5V,unlessotherwisenoted.
AMC7812
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
DACPERFORMANCE
DACDCACCURACY
Resolution 12 Bits
Measuredbylinepassingthroughcodes020h
INL Relativeaccuracy ±1 LSB
andFFFh
12-bitmonotonic,Measuredbylinepassing
DNL Differentialnonlinearity ±0.3 ±1 LSB
throughcodes020handFFFh
T =+25°C,DACoutput=5.0V ±10 mV
A
TUE Totalunadjustederror
T =+25°C,DACoutput=12.5V ±30 mV
A
T =+25°C,DACoutput=0Vto+5V,
A ±2 mV
code020h
Offseterror
T =+25°C,DACoutput=0Vto+12.5V,
A ±5 mV
code020h
Offseterrortemperaturecoefficient ±1 ppm/°C
Externalreference,output=0Vto+5V ±0.025 ±0.15 %FSR
Gainerror
Externalreference,output=0Vto+12.5V -0.15 ±0.3 %FSR
Gaintemperaturecoefficient ±2 ppm/°C
DACOUTPUTCHARACTERISTICS
V =2.5V,gain=2 0 5 V
Outputvoltagerange(1) REF
V =2.5V,gain=5 0 12.5 V
REF
DACoutput=0Vto+5V,code400htoC00h,to
Outputvoltagesettlingtime(2) ½LSB,fromCSrisingedge, 3 µs
R =2kΩ,C =200pF
L L
Slewrate(2) 1.5 V/µs
Short-circuitcurrent(2) Full-scalecurrentshortedtoground 30 mA
Sourcewithin200mVofsupply,T =+25°C +10 mA
A
Sinkwithin300mVofsupply,T =+25°C -10 mA
A
Loadcurrent
DACoutput=0Vto+5V,codeB33h.Source
and/orsinkwithvoltagedrop<25mV,T :-40°C ±8 mA
A
to95°C(3)
Capacitiveloadstability(2) R =∞ 10 nF
L
DCoutputimpedance(2) Code800h 0.3 Ω
Power-onovershoot AV 0to5V,2msramp 5 mV
CC
Digital-to-analogglitchenergy Codechangesfrom7FFhto800h,800hto7FFh 0.15 nV-s
Digitalfeedthrough Deviceisnotaccessed 0.15 nV-s
T =+25°C,at1kHz,code800h,gain=2,
A 81 nV/√Hz
Outputnoise excludesreference
f=0.1Hzto10Hz,excludesreference 8 µV
PP
DACREFERENCEINPUT
Referencevoltageinputrange REF-DACpin 1 2.6 V
Inputcurrent(2) V =2.5V 170 µA
REF
(1) TheoutputvoltagemustnotbegreaterthanAV .SeetheDACOutputsectionformoredetails.
CC
(2) Sampledduringinitialreleasetoensurecompliance;notsubjecttoproductiontesting.
(3) ValidonlyformaterialmanufacturedonorafterOctober2012.
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ELECTRICAL CHARACTERISTICS (continued)
AtT =–40°Cto+105°C,AV =DV =4.5Vto5.5V,AV =+15V,AGND=DGND=0V,IOV =2.7Vto5.5V,internal
A DD DD CC DD
2.5Vreference,andtheDACoutputspan=0Vto5V,unlessotherwisenoted.
AMC7812
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
INTERNALREFERENCE
Outputvoltage T =+25°C,REF-OUTpin 2.495 2.5 2.505 V
A
Outputimpedance 0.4 Ω
Referencetemperaturecoefficient 10 25 ppm/°C
Outputcurrent(sourcing/sinking) ±5 mA
T =+25°C,f=1kHz 260 nV/√Hz
A
Outputvoltagenoise
f=0.1Hzto10Hz 13 µV
PP
ADCPERFORMANCE
ADCDCACCURACY(forAV =5V)
DD
Resolution 12 Bits
INL Integralnonlinearity ±0.5 ±1 LSB
DNL Differentialnonlinearity ±0.5 ±1 LSB
Single-EndedMode
Offseterror ±1 ±3 LSB
Offseterrormatch ±0.4 LSB
Gainerror Externalreference ±1 ±5 LSB
Gainerrormatch ±0.4 LSB
DifferentialMode
Externalreference,0Vto(2·V )mode,V =
REF CM ±2 ±5 LSB
2.5V
Gainerror
Externalreference,0VtoV mode,
REF ±1 ±5 LSB
V =1.25V
CM
Gainerrormatch ±0.5 LSB
0Vto(2·V )mode,V =2.5V ±1 ±3 LSB
REF CM
Zerocodeerror Externalreference,0VtoV mode,
REF ±1 ±3 LSB
V =1.25V
CM
Zerocodeerrormatch ±0.5 LSB
Commonmoderejection DC,0Vto(2·V )mode 67 dB
REF
SAMPLINGDYNAMICS
Externalsingleanalogchannel,automode 500 kSPS
Conversionrate
Externalsingleanalogchannel,directmode 167 kSPS
Conversiontime(4) Externalsingleanalogchannel 2 µs
Autocycleupdaterate(4) All16single-endedinputsenabled 32 µs
Throughputrate SPIclock12MHzorgreater,singlechannel 500 kSPS
ANALOGINPUT(5)
Single-ended,0VtoV 0 V V
REF REF
Single-ended,0Vto(2·V ) 0 2·V V
REF REF
Full-scaleinputvoltage
V –V ,fully-differential,0VtoV –V +V V
IN+ IN- REF REF REF
V –V ,fully-differential,0Vto(2·V ) –2·V 2·V V
IN+ IN- REF REF REF
Absoluteinputvoltage GND-0.2 AV +0.2 V
DD
0VtoVREFmode 118
Inputcapacitance(4) pF
0Vto(2·VREF)mode 73
DCinputleakagecurrent UnselectedADCinput ±10 µA
(4) Sampledduringinitialreleasetoensurecompliance;notsubjecttoproductiontesting.
(5) V orV mustremainwithinGND-0.2VandAV +0.2V.SeeAnalogInputssection.
IN+ IN– DD
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ELECTRICAL CHARACTERISTICS (continued)
AtT =–40°Cto+105°C,AV =DV =4.5Vto5.5V,AV =+15V,AGND=DGND=0V,IOV =2.7Vto5.5V,internal
A DD DD CC DD
2.5Vreference,andtheDACoutputspan=0Vto5V,unlessotherwisenoted.
AMC7812
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
ADCREFERENCEINPUT
Referenceinputvoltagerange 1.2 AV V
DD
Inputcurrent V =2.5V 145 µA
REF
INTERNALADCREFERENCEBUFFER
Offset T =+25°C ±5 mV
A
INTERNALTEMPERATURESENSOR
Operatingrange –40 +125 °C
AV =5V,T =–40°Cto+125°C ±1.25 ±2.5 °C
DD A
Accuracy
AV =5V,T =0°Cto+100°C ±1.5 °C
DD A
Resolution PerLSB 0.125 °C
Conversionrate Externaltemperaturesensorsaredisabled 15 ms
EXTERNALTEMPERATURESENSOR(Using2N3906externaltransistor)
Operatingrange Limitedbyexternaldiode –40 +150 °C
AV =5V,T =0°Cto+100°C,
DD A ±1.5 °C
T =–40°Cto+150°C
Accuracy(6)(7) D
AV =5V,T =–40°Cto+100°C,
DD A ±2 °C
T =–40°Cto+150°C
D
Resolution PerLSB 0.125 °C
Withresistancecancellation
72 93 100 ms
(RCbit='1')
Conversionratepersensor
Withoutresistancecancellation
33 44 47 ms
(RCbit='0')
DIGITALLOGIC:GPIO(8)(9)andALARM
IOV =+5V 2.1 0.3+IOV V
DD DD
V Inputhighvoltage
IH
IOV =+3.3V 2.1 0.3+IOV V
DD DD
IOV =+5V –0.3 0.8 V
DD
V Inputlowvoltage
IL
IOV =+3.3V –0.3 0.8 V
DD
IOV =+5V,sinking5mA 0.4 V
DD
V Outputlowvoltage
OL
IOV =+3.3V,sinking2mA 0.4 V
DD
High-impedanceleakage 5 µA
High-impedanceoutputcapacitance 10 pF
(6) T istheexternaldiodetemperature.
D
(7) Autoconversionmodedisabled
(8) ForpinsGPIO0-3,theexternalpullupresistormustbeconnectedtoavoltagelessthanorequalto5.5V.
(9) ForpinsGPIO4-7,theexternalpullupresistormustbeconnectedtoavoltagelessthanorequaltoAV .
DD
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ELECTRICAL CHARACTERISTICS (continued)
AtT =–40°Cto+105°C,AV =DV =4.5Vto5.5V,AV =+15V,AGND=DGND=0V,IOV =2.7Vto5.5V,internal
A DD DD CC DD
2.5Vreference,andtheDACoutputspan=0Vto5V,unlessotherwisenoted.
AMC7812
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
DIGITALLOGIC:AllExceptSCL,SDA,ALARM,andGPIO
IOV =+5V 2.1 0.3+IOV V
DD DD
V Inputhighvoltage
IH
IOV =+3.3V 2.1 0.3+IOV V
DD DD
IOV =+5V –0.3 0.8 V
DD
V Inputlowvoltage
IL
IOV =+3.3V –0.3 0.8 V
DD
Inputcurrent ±1 µA
Inputcapacitance 5 pF
IOV =+5V,sourcing3mA 4.8 V
DD
V Outputhighvoltage
OH
IOV =+3.3V,sourcing3mA 2.9 V
DD
IOV =+5V,sinking3mA 0.4 V
DD
V Outputlowvoltage
OL
IOV =+3.3V,sinking3mA 0.4 V
DD
High-impedanceleakage ±5 µA
High-impedanceoutputcapacitance 10 pF
DIGITALLOGIC:SDA,SCL(I2C-CompatibleInterface)
IOV =+5V 2.1 0.3+IOV V
DD DD
V Inputhighvoltage
IH
IOV =+3.3V 2.1 0.3+IOV V
DD DD
IOV =+5V –0.3 0.8 V
DD
V Inputlowvoltage
IL
IOV =+3.3V –0.3 0.8 V
DD
Inputcurrent ±5 µA
Inputcapacitance 5 pF
IOV =+5V,sinking3mA 0 0.4 V
DD
V Outputlowvoltage
OL
IOV =+3.3V,sinking3mA 0 0.4 V
DD
High-impedanceleakage ±5 µA
High-impedanceoutputcapacitance 10 pF
TIMINGREQUIREMENTS
FromAV ,DV ≥2.7VandAV ≥4.5Vto
Power-ondelay DD DD CC 100 250 µs
normaloperation
Power-downrecoverytime fromCSrisingedge 70 µs
Resetdelay Delaytonormaloperationfromanyreset 100 250 µs
Convertpulsewidth 20 ns
Resetpulsewidth 20 ns
POWER-SUPPLYREQUIREMENTS
AV AV mustbe≥(V +1.2V) +2.7 +5.5 V
DD DD REF
AV andDV combined,
DD DD 7.9 12.5 mA
normaloperation,noDACload
AI
DD
AV andDV combined,
DD DD 1.6 mA
allblocksinpowerdown
AV +4.5 +18 V
CC
IV AV ,noload,DACsatcode800h 6.5 mA
CC CC
Normaloperation(10),AV =DV =5V,AV
Powerdissipation DD DD CC 95 120 mW
=15V
DV +2.7 +5.5 V
DD
IOV +2.7 +5.5 V
DD
TEMPERATURERANGE
Specifiedperformance –40 +105 °C
(10) NoDACload,allDACsat800handbothADCsatthefastestautoconversionrate
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FUNCTIONAL BLOCK DIAGRAM
ADC-REF-IN/CMP AMC7812
Ended/ential CCHH01
e-er CH2
nglDiff CH3
Si CH4
Reference
CH5 REF-OUT
(2.5V)
CH6
CH7
d
Ende CCHH89 REF-DAC
e- CH10
ngl CH11 Trigger
Si CH12
CH13 DAC-0 DAC0-OUT
ADC
CH14
DAC1-OUT
CH15
DAC2-OUT
D1+ GPIO-5 Control/Limits/Status DAC3-OUT
Registers
DAC4-OUT
DAC5-OUT
O
GPI D1- GPIO-4 Local DAC6-OUT
MP/ D2+ GPIO-7 TemRepmeroatteure TemSpeenrsaotrure DAC7-OUT
TE Sensor DAC8-OUT
Driver
DAC9-OUT
DAC10-OUT
D2- GPIO-6
DAC-11 DAC11-OUT
O GPIO-3 GPIO Controller
PI
G GPIO-0
LOAD-DAC
ALARM
Out-of-Range
Alarms DAC-CLR-0
DACs Clear Logic
DAC-CLR-1
RESET
Control Serial Interface Register and Control
DAV Logic (SPI/I2C)
DVDD DGND CNVT IOVDD SPI/I2C CLK/SCL SDI/SDA CS/A0 SDO/A1 A2 AVCC AVDD1 AVDD2 AGND1 AGND2 AGND3 AGND4
S
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PIN CONFIGURATION
RGCPACKAGE
QFN-64 PAPPACKAGE
(TOPVIEW) HTQFP-64
(TOPVIEW)
DGND2 DAC-CLR-1 ALARM DAC11-OUT DAC10-OUT DAC9-OUT REF-DAC REF-OUT AVCC1 AGND2 AGND1 DAC8-OUT DAC7-OUT DAC6-OUT AVDD2 AVDD1 DGND2 DAC-CLR-1 ALARM DAC11-OUT DAC10-OUT DAC9-OUT REF-DAC REF-OUT AVCC1 AGND2 AGND1 DAC8-OUT DAC7-OUT DAC6-OUT AVDD2 AVDD1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
RESET 1 48 CH15 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
DAV 2 47 CH14 RESET 1 48 CH15
CNVT 3 46 CH13 DAV 2 47 CH14
SDI/SDA 4 45 CH12 CNVT 3 46 CH13
SCLK/SCL 5 44 CH11 SDI/SDA 4 45 CH12
DGND 6 43 CH10 SCLK/SCL 5 44 CH11
IOVDD 7 42 CH9 DGND 6 43 CH10
DVDD 8 41 CH8 IOVDD 7 42 CH9
CS/A0 9 40 CH7 DVDD 8 41 CH8
CS/A0 9 40 CH7
SDO/A1 10 39 CH6
SDO/A1 10 39 CH6
A2 11 38 CH5
A2 11 38 CH5
SPI/I2C 12 37 CH4 SPI/I2C 12 37 CH4
GPIO-0 13 36 CH3 GPIO-0 13 36 CH3
GPIO-1 14 35 CH2 GPIO-1 14 35 CH2
GPIO-2 15 34 CH1 GPIO-2 15 34 CH1
GPIO-3 16 33 CH0 GPIO-3 16 33 CH0
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
DAC-CLR-0 DAC5-OUT DAC4-OUT DAC3-OUT AGND4 AGND3 AVCC2 DAC2-OUT DAC1-OUT DAC0-OUT -D2/GPIO-6 D2+/GPIO-7 -D1/GPIO-4 D1+/GPIO-5 C-REF-IN/CMP ADC-GND DAC-CLR-0 DAC5-OUT DAC4-OUT DAC3-OUT AGND4 AGND3 AVCC2 DAC2-OUT DAC1-OUT DAC0-OUT D2-/GPIO-6 D2+/GPIO-7 D1-/GPIO-4 D1+/GPIO-5 REF-IN/CMP ADC-GND
AD DC-
A
PINDESCRIPTIONS
PIN(QFN/HTQFP)
DESCRIPTION
NO. NAME
1 RESET Resetinput,activelow.Logiclowonthispincausesthedevicetoperformahardwarereset.
Dataavailableindicator,activelowoutput.Indirectmode,theDAVpingoeslow(active)whentheconversion
2 DAV ends.Inautomode,a1µspulse(activelow)appearsonthispinwhenaconversioncyclefinishes(seethe
PrimaryADCOperationandRegisterssectionsfordetails).DAVstayshighwhendeactivated.
3 CNVT Externalconversiontrigger,activelow.ThefallingedgestartsthesamplingandconversionoftheADC.
Serialinterfacedata.SDIfortheserialperipheralinterface(SPI)whentheSPI/I2Cpinishigh.SDAforI2C
4 SDI/SDA
whentheSPI/I2Cpinislow.
Serialclockinputofthemainserialinterface.SPIclockwhentheSPI/I2Cpinishigh;I2Cclockwhenthe
5 SCLK/SCL
SPI/I2Cpinislow.
6 DGND Digitalground
7 IOV Interfacepowersupply
DD
8 DV Digitalpowersupply(+3Vto+5V).MustbethesamevalueasAV .
DD DD
ChipselectsignalforSPIwhentheSPI/I2Cpinishigh.SlaveaddressselectionA0forI2CwhentheSPI/I2C
9 CS/A0
pinislow.
10 SDO/A1 SDOforSPIwhentheSPI/I2Cpinishigh.SlaveaddressselectionA1forI2CwhentheSPI/I2Cpinislow.
11 A2 SlaveaddressselectionA2forI2CwhentheSPI/I2Cpinislow.
Interfaceselectionpin.Digitalinput.WhenthispinistiedtoIOV ,theSPIisenabledandtheI2Cinterfaceis
12 SPI/I2C disabled.Whenthispinistiedtoground,theSPIisdisabledandDDtheI2Cinterfaceisenabled.
13 GPIO-0
14 GPIO-1 General-purposedigitalinput/output.Thispinisabidirectionalopen-drain,digitalinput/output,andrequiresan
15 GPIO-2 externalpull-upresistor.SeetheGeneralPurposeInput/OutputPinssectionformoredetails.
16 GPIO-3
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PINDESCRIPTIONS(continued)
PIN(QFN/HTQFP)
DESCRIPTION
NO. NAME
DACclearcontrolsignal,digitalinput,activelow.Whenlow,allDACsassociatedwiththeDAC-CLR-0pinenter
aclearstate,theDACLatchisloadedwithpredefinedcode,andtheoutputissettothecorrespondinglevel.
17 DAC-CLR-0 However,theDAC-DataRegisterdoesnotchange.WhentheDACgoesbacktonormaloperation,theDAC
LatchisloadedwiththepreviousdatafromtheDAC-DataRegisterandtheoutputreturnstothepreviouslevel,
regardlessofthestatusoftheSLDAC-nbit.Whenthispinishigh,theDACsareinnormaloperation.
18 DAC5-OUT
19 DAC4-OUT OutputofDACchannels3,4,and5
20 DAC3-OUT
21 AGND4
Analogground
22 AGND3
PositiveanalogpowerforDAC0-OUT,DAC1-OUT,DAC2-OUT,DAC3-OUT,DAC4-OUT,DAC5-OUT,mustbe
23 AV
CC2 tiedtoAV
CC1
24 DAC2-OUT
25 DAC1-OUT OutputofDACchannels0,1,and2
26 DAC0-OUT
27 D2–/GPIO-6 RemotesensorD2negativeinputwhenD2enabled;GPIO-6whenD2disabled.Pull-uprequiredforoutput.
28 D2+/GPIO-7 RemotesensorD2positiveinputwhenD2enabled;GPIO-7whenD2disabled.Pull-uprequiredforoutput.
29 D1–/GPIO4 RemotesensorD1negativeinputwhenD1enabled;GPIO-6whenD1disabled.Pull-uprequiredforoutput.
30 D1+/GPIO-5 RemotesensorD1positiveinputwhenD1enabled;GPIO-7whenD1disabled.Pull-uprequiredforoutput.
ExternalADCreferenceinputwhenexternalV isusedtodriveADC.Compensationcapacitorconnection
31 ADC-REF-IN/CMP REF
(connect4.7µFcapacitorbetweenthispinandAGND)whenInternalV isusedtodriveADC.
REF
32 ADC-GND ADCground.MustbeconnectedtoAGND.
33- Analoginputsofchannel0to15.CH4toCH15aresingle-ended.CH0,CH1,CH2,andCH3canbe
CH0toCH15
48 programmedasdifferentialorsingle-ended.
49 AV
DD1
Positiveanalogpowersupply
50 AV
DD2
51 DAC6-OUT
52 DAC7-OUT OutputofDACchannels6,7,and8
53 DAC8-OUT
54 AGND1
Analogground
55 AGND2
PositiveanalogpowerforDAC6-OUT,DAC7-OUT,DAC8-OUT,DAC9-OUT,DAC10-OUT,DAC11-OUT,must
56 AV
CC1 betiedtoAV
CC2
57 REF-OUT Internalreferenceoutput
58 REF-DAC DACreferenceInput
59 DAC9-OUT
60 DAC10-OUT OutputofDACchannels9,10,and11
61 DAC11-OUT
Globalalarm.Opendrainoutput.External10kΩpull-upresistorrequired.Thispingoeslow(active)whenone
62 ALARM
(ormore)oftheanalogchannelsareoutofrange.
DACclearcontrolsignal,digitalinput,activelow.Whenlow,allDACsassociatedwiththeDAC-CLR-1pinenter
aclearstate,theDACLatchisloadedwithpredefinedcode,andtheoutputissettothecorrespondinglevel.
63 DAC-CLR-1 However,theDAC-DataRegisterdoesnotchange.WhentheDACgoesbacktonormaloperation,theDAC
LatchisloadedwiththepreviousdatafromtheDAC-DataRegisterandtheoutputreturnstothepreviouslevel,
regardlessofthestatusoftheSLDAC-nbit.Whenthispinishigh,theDACsareinnormaloperation.
64 DGND2 Digitalground
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I2C-COMPATIBLE TIMING DIAGRAMS
S Sr P S
SDA
tSU,DAT tSU,STA tBUF
tLOW tHD,DAT tHD,STA tSU,STO
SCL t
HIGH
t
HD,STA
t t
R F
S = START Condition
= Resistor Pull-Up Sr = Repeated START Condition
P = STOP Condition
Figure1. TimingforStandardandFast ModeDevicesontheI2CBus
TIMING CHARACTERISTICS: SDA and SCL for Standard and Fast Modes(1)
At–40°Cto+105°C,AV =DV =4.5Vto5.5V,AGND=DGND=0V,andIOV =2.7Vto5.5V,unlessotherwisenoted.
DD DD DD
STANDARD FAST
MODE MODE
PARAMETER MIN MAX MIN MAX UNIT
f (2) SCLclockfrequency 0 100 0 400 kHz
SCL
t LowperiodoftheSCLclock 4.7 — 1.3 — µs
LOW
t HighperiodoftheSCLclock 4.0 — 0.6 — µs
HIGH
t Set-uptimeforarepeatedstartcondition 4.7 — 0.6 — µs
SU,STA
Holdtime(repeated)startcondition.Afterthis
t 4.0 — 0.6 — µs
HD,STA period,thefirstclockpulseisgenerated
t Dataset-uptime 250 — 100 — ns
SU,DAT
t Dataholdtime:forI2C-busdevices 0 3.45 0 0.9 µs
HD,DAT
t Set-uptimeforstopcondition 4.0 — 0.6 — µs
SU,STO
t RisetimeofbothSDAandSCLsignals — 1000 20+0.1C (3) 300 ns
R B
t FalltimeofbothSDAandSCLsignals — 300 20+0.1C (3) 300 ns
F B
t Busfreetimebetweenastopandstartcondition 4.7 — 1.3 — µs
BUF
C Capacitiveloadforeachbusline — 400 — 400 pF
B
t Pulsewidthofspikesuppressed NA NA 0 50 ns
SP
(1) AllvaluesrefertoV andV levels.
IHmin ILmax
(2) AnSCLoperatingfrequencyofatleast1kHzisrecommendedtoavoidactivatingtheI2Ctimeoutfunction.SeetheTimeoutFunction
sectionfordetails.
(3) C =totalcapacitanceofonebuslineinpF.
B
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