10-Bit, Multichannel ADCs/DACs with FIFO, Temperature

39 Pages·2008·0.4 MB·English

19-3294; Rev 3; 3/08 EVAALVUAAILTAIOBNL EKIT
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
General Description Features M
The MAX1040/MAX1042/MAX1046/MAX1048 integrate a ♦ 10-Bit, 225ksps ADC A
multichannel, 10-bit, analog-to-digital converter (ADC) Analog Multiplexer with True-Differential
Track/Hold (T/H) X
and a quad, 10-bit, digital-to-analog converter (DAC) in a
Eight Single-Ended Channels or Four
single IC. The devices also include a temperature sensor 1
Differential
and configurable general-purpose I/O ports (GPIOs) with Channels (Unipolar or Bipolar) 0
a 25MHz SPI™-/QSPI™-/MICROWIRE™-compatible seri- (MAX1040/MAX1042) 4
al interface. The ADC is available in a four or an eight Four Single-Ended Channels or Two Differential
0
input-channel version. The four DAC outputs settle within Channels (Unipolar or Bipolar)
2.0µs, and the ADC has a 225ksps conversion rate. (MAX1046/MAX1048) /M
Excellent Accuracy: ±0.5 LSB INL, ±0.5 LSB
All devices include an internal reference (4.096V) provid- DNL, No Missing Codes Over Temperature
A
ing a well-regulated, low-noise reference for both the ♦ 10-Bit, Quad, 2µs Settling DAC
ADC and DAC. Programmable reference modes for the X
Ultra-Low-Glitch Energy (4nV•s)
ADC and DAC allow the use of an internal reference, an Power-Up Options from Zero Scale or Full Scale 1
external reference, or a combination of both. Features Excellent Accuracy: ±0.5 LSB INL
0
such as an internal ±1°C accurate temperature sensor, ♦ Internal Reference or External Single-Ended/
FIFO, scan modes, programmable internal or external Differential Reference 4
clock modes, data averaging, and AutoShutdown™ allow Internal Reference Voltage (4.096V) 2
users to minimize both power consumption and proces- ♦ Internal ±1°C Accurate Temperature Sensor /
M
sor requirements. The low glitch energy (4nV•s) and low ♦ On-Chip FIFO Capable of Storing 16 ADC
digital feedthrough (0.5nV•s) of the integrated quad Conversion Results and One Temperature Result A
DACs make these devices ideal for digital control of fast-
♦ On-Chip Channel-Scan Mode and Internal X
response closed-loop systems.
Data-Averaging Features
The devices are guaranteed to operate with a supply volt- ♦ Analog Single-Supply Operation:+4.75V to +5.25V 1
age from +4.75V to +5.25V. These devices consume 0
♦ Digital Supply:+2.7V to AVDD
2.5mA at 225ksps throughput, only 22µA at 1ksps 4
♦ 25MHz, SPI/QSPI/MICROWIRE Serial Interface
throughput, and under 0.2µA in the shutdown mode. The
6
MAX1042/MAX1048 offer four GPIOs that can be config- ♦ AutoShutdown Between Conversions
/
ured as inputs or outputs. ♦ Low-Power ADC M
2.5mA at 225ksps
The MAX1040/MAX1042/MAX1046/MAX1048 are avail-
22µA at 1ksps A
able in 36-pin thin QFN packages. All devices are speci-
0.2µA at Shutdown X
fied over the -40°C to +85°C temperature range.
♦ Low-Power DAC: 1.5mA
1
Applications ♦ Evaluation Kit Available (Order MAX1258EVKIT)
0
Closed-Loop Controls for Optical Components
SPI and QSPI are trademarks of Motorola, Inc. 4
and Base Stations
MICROWIRE is a trademark of National Semiconductor Corp. 8
System Supervision and Control AutoShutdown is a trademark of Maxim Integrated Products, Inc.
Data-Acquisition Systems Pin Configurations appear at end of data sheet.
Ordering Information/Selector Guide
REF ANALOG SUPPLY RESOLUTION ADC DAC
PART PIN-PACKAGE GPIOs
VOLTAGE (V) VOLTAGE (V) BITS** CHANNELS CHANNELS
MAX1040BETX 36 Thin QFN-EP* 4.096 4.75 to 5.25 10 8 4 0
MAX1042BETX 36 Thin QFN-EP* 4.096 4.75 to 5.25 10 8 4 4
MAX1046BETX 36 Thin QFN-EP* 4.096 4.75 to 5.25 10 4 4 0
MAX1048BETX 36 Thin QFN-EP* 4.096 4.75 to 5.25 10 4 4 4
Note:All devices are specified over the -40°C to +85°C operating temperature range.
*EP = Exposed pad.
**Number of resolution bits refers to both DAC and ADC.
________________________________________________________________Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
8 ABSOLUTE MAXIMUM RATINGS
4
AVDDto AGND.........................................................-0.3V to +6V Maximum Current into OUT_.............................................100mA
0 DGND to AGND.....................................................-0.3V to +0.3V Continuous Power Dissipation (TA= +70°C)
1 DVDDto AVDD.......................................................-3.0V to +0.3V 36-Pin Thin QFN (6mm x 6mm)
Digital Inputs to DGND.............................................-0.3V to +6V (derate 26.3mW/°C above +70°C)..........................2105.3mW
X
Digital Outputs to DGND.........................-0.3V to (DVDD + 0.3V) Operating Temperature Range...........................-40°C to +85°C
A Analog Inputs, Analog Outputs and REF_ Storage Temperature Range.............................-60°C to +150°C
to AGND...............................................-0.3V to (AVDD + 0.3V) Junction Temperature......................................................+150°C
M
Maximum Current into Any Pin (except AGND, DGND, AVDD, Lead Temperature (soldering, 10s).................................+300°C
DVDD, and OUT_)...........................................................50mA
/
6
Note: If the package power dissipation is not exceeded, one output at a time can be shorted to AVDD, DVDD, AGND, or DGND
4
indefinitely.
0
1 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
X
absolute maximum rating conditions for extended periods may affect device reliability.
A
ELECTRICAL CHARACTERISTICS
M
(AVDD= DVDD= 4.75V to 5.25V, external reference VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless
/
2 otherwise noted. Typical values are at AVDD= DVDD= 5V, TA= +25°C. Outputs are unloaded, unless otherwise noted.)
4
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
0
ADC
1
DC ACCURACY (Note 1)
X
Resolution 10 Bits
A
Integral Nonlinearity INL ±0.5 ±1.0 LSB
M Differential Nonlinearity DNL ±0.5 ±1 LSB
/ Offset Error ±0.25 ±2.0 LSB
0
Gain Error (Note 2) ±0.025 ±2.0 LSB
4
Gain Temperature Coefficient ±1.4 ppm/°C
0
Channel-to-Channel Offset ±0.1 LSB
1
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, VIN = 4.096VP-P, 225ksps, fCLK = 3.6MHz)
X
Signal-to-Noise Plus Distortion SINAD 61 dB
A
Total Harmonic Distortion
M THD -70 dBc
(Up to the Fifth Harmonic)
Spurious-Free Dynamic Range SFDR 66 dBc
Intermodulation Distortion IMD fIN1 = 9.9kHz, fIN2 = 10.2kHz 72 dBc
Full-Linear Bandwidth SINAD > 70dB 100 kHz
Full-Power Bandwidth -3dB point 1 MHz
CONVERSION RATE (Note 3)
External reference 0.8 µs
Co nvers io n
Power-Up Time tPU
Internal reference (Note 4) 218 clo ck
cycle s
2 _______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ELECTRICAL CHARACTERISTICS (continued) M
(AVDD= DVDD= 4.75V to 5.25V, external reference VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless A
otherwise noted. Typical values are at AVDD= DVDD= 5V, TA= +25°C. Outputs are unloaded, unless otherwise noted.)
X
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
1
Acquisition Time tACQ (Note 5) 0.6 µs 0
Internally clocked 5.5
4
Conversion Time tCONV µs
Externally clocked 3.6 0
External Clock Frequency fCLK Externally clocked conversion (Note 5) 0.1 3.6 MHz /
M
Duty Cycle 40 60 %
Aperture Delay 30 ns A
Aperture Jitter < 50 ps X
ANALOG INPUTS 1
Unipolar 0 VREF 0
Input Voltage Range (Note 6) V
Bipolar -VREF / 2 +VREF / 2 4
Input Leakage Current ±0.01 ±1 µA 2
Input Capacitance 24 pF /
M
INTERNAL TEMPERATURE SENSOR
A
TA = +25°C ±0.7
Measurement Error (Notes 5, 7) °C
TA = TMIN to TMAX ±1.0 ±3.0 X
Temperature Resolution 1/8 °C/LSB 1
INTERNAL REFERENCE 0
REF1 Output Voltage (Note 8) 4.066 4.096 4.126 V 4
6
REF1 Voltage Temperature
Coefficient TCREF ±30 ppm/°C /
M
REF1 Output Impedance 6.5 kΩ
A
REF1 Short-Circuit Current VREF = 4.096V 0.63 mA
X
EXTERNAL REFERENCE
1
AVDD +
REF1 Input Voltage Range VREF1 REF mode 11 (Note 4) 1 V 0
0.05
4
AVDD +
REF2 Input Voltage Range REF mode 01 1 8
VREF2 0.05 V
(Note 4)
REF mode 11 0 1
VREF = 4.096V, fSAMPLE = 225ksps 40 80
REF1 Input Current (Note 9) IREF1 µA
Acquisition between conversions ±0.01 ±1
VREF = 4.096V, fSAMPLE = 225ksps 40 80
REF2 Input Current IREF2 µA
Acquisition between conversions ±0.01 ±1
_______________________________________________________________________________________ 3
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
8 ELECTRICAL CHARACTERISTICS (continued)
4
(AVDD= DVDD= 4.75V to 5.25V, external reference VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless
0 otherwise noted. Typical values are at AVDD= DVDD= 5V, TA= +25°C. Outputs are unloaded, unless otherwise noted.)
1
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
X
DAC
A
DC ACCURACY (Note 10)
M
Resolution 10 Bits
/ Integral Nonlinearity INL ±0.5 ±1 LSB
6
Differential Nonlinearity DNL Guaranteed monotonic ±0.5 LSB
4
0 Offset Error VOS ±3 ±10 mV
ppm of
1 Offset-Error Drift ±10
FS/°C
X
Gain Error GE ±1.25 ±10 LSB
A
ppm of
M Gain Temperature Coefficient ±8
FS/°C
/ DAC OUTPUT
2
4 AVDD -
No load 0.02
0.02
0
Output Voltage Range V
1 10kΩ load to either rail 0.1 AVDD -
X 0.1
A DC Output Impedance 0.5 Ω
Capacitive Load (Note 11) 1 nF
M
0/ Resistive Load to AGND RL gA aViD n D e r=r o 4r. 7<5 2V%, V R EF = 4.096V, 500 Ω
4 From power-down mode, AVDD = 5V 25
Wake-Up Time (Note 12) µs
0 From power-down mode, AVDD = 2.7V 21
1 1kΩ Output Termination Programmed in power-down mode 1 kΩ
X At wake-up or programmed in
100kΩ Output Termination 100 kΩ
A power-down mode
M DYNAMIC PERFORMANCE (Notes 5, 13)
Output-Voltage Slew Rate SR Positive and negative 3 V/µs
Output-Voltage Settling Time tS To 1 LSB, 400 - C00 hex (Note 7) 2 5 µs
Digital Feedthrough Code 0, all digital inputs from 0 to DVDD 0.5 nV•s
Major Code Transition Glitch
Between codes 2047 and 2048 4 nV•s
Impulse
From VREF 660
Output Noise (0.1Hz to 50MHz) µVP-P
Using internal reference 720
From VREF 260
Output Noise (0.1Hz to 500kHz) µVP-P
Using internal reference 320
DAC-to-DAC Transition
0.5 nV•s
Crosstalk
4 _______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ELECTRICAL CHARACTERISTICS (continued) M
(AVDD= DVDD= 4.75V to 5.25V, external reference VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless A
otherwise noted. Typical values are at AVDD= DVDD= 5V, TA= +25°C. Outputs are unloaded, unless otherwise noted.)
X
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
1
INTERNAL REFERENCE 0
REF1 Output Voltage 4.066 4.096 4.126 V 4
REF1 Temperature Coefficient TCREF ±30 ppm/°C 0
REF1 Short-Circuit Current VREF = 4.096V 0.63 mA /
M
EXTERNAL REFERENCE INPUT
REF1 Input Voltage Range VREF1 REF modes 01, 10, and 11 (Note 4) 0.7 AVDD V A
REF1 Input Impedance RREF1 70 100 130 kΩ X
DIGITAL INTERFACE 1
DIGITAL INPUTS (SCLK, DIN, CS, CNVST, LDAC) 0
DVDD = 2.7V to 5.25V 2.4 4
Input-Voltage High VIH V
DVDD = 3.6V to 5.25V 2.0 2
DVDD = 2.7V to 3.6V 0.8 /M
Input-Voltage Low VIL DVDD = 3V to 3.6V 0.6 V
A
DVDD = 2.7V to 3V 0.5
X
Input Leakage Current IL 0.01 ±10 µA
Input Capacitance CIN 15 pF 1
DIGITAL OUTPUT (DOUT) (Note 14) 0
Output-Voltage Low VOL ISINK = 2mA 0.4 V 4
6
DVDD -
Output-Voltage High VOH ISOURCE = 2mA 0.5 V /M
Tri-State Leakage Current ±10 µA
A
Tri-State Output Capacitance COUT 15 pF
X
DIGITAL OUTPUT (EOC) (Note 14)
1
Output-Voltage Low VOL ISINK = 2mA 0.4 V
0
DVDD -
Output-Voltage High VOH ISOURCE = 2mA V 4
0.5
8
Tri-State Leakage Current ±10 µA
Tri-State Output Capacitance COUT 15 pF
DIGITAL OUTPUTS (GPIO_) (Note 14)
ISINK = 2mA 0.4
GPIOC_ Output-Voltage Low V
ISINK = 4mA 0.8
DVDD -
GPIOC_ Output-Voltage High ISOURCE = 2mA V
0.5
GPIOA_ Output-Voltage Low ISINK = 15mA 0.8 V
DVDD -
GPIOA_ Output-Voltage High ISOURCE = 15mA V
0.8
Tri-State Leakage Current ±10 µA
Tri-State Output Capacitance COUT 15 pF
_______________________________________________________________________________________ 5
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
8 ELECTRICAL CHARACTERISTICS (continued)
4
(AVDD= DVDD= 4.75V to 5.25V, external reference VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless
0 otherwise noted. Typical values are at AVDD= DVDD= 5V, TA= +25°C. Outputs are unloaded, unless otherwise noted.)
1
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
X
POWER REQUIREMENTS (Note 15)
A
Digital Positive-Supply Voltage DVDD 2.7 AVDD V
M
Idle, all blocks shut down 0.2 4 µA
Digital Positive-Supply Current DIDD
/ Only ADC on, external reference 1 mA
6
4 Analog Positive-Supply Voltage AVDD 4.75 5.25 V
0 Idle, all blocks shut down 0.2 2 µA
1 Only ADC on, fSAMPLE = 225ksps 2.8 4.2
Analog Positive-Supply Current AIDD
X external reference fSAMPLE = 100ksps 2.6 mA
A All DACs on, no load, internal reference 1.5 4.0
M REF1 Positive-Supply Rejection PSRR AVD D = 4.75V -80 dB
Outpu t code = FFFhex, AVD D = 4.75V to
/ DAC Positive-Supply Rejection PSRD ±0.1 ±0.5 mV
2 5.25V
4 ADC Positive-Supply Rejection PSRA Ful l- s cal e in pu t, AVD D = 4.75V to 5.25V ±0.06 ±0.5 mV
0 TIMING CHARACTERISTICS (Figures 6–13)
1 SCLK Clock Period tCP 40 ns
X SCLK Pulse-Width High tCH 40/60 duty cycle 16 ns
A SCLK Pulse-Width Low tCL 60/40 duty cycle 16 ns
M GPIO Output Rise/Fall After
tGOD CLOAD = 20pF 100 ns
CS Rise
/
0 GPIO Input Setup Before CS Fall tGSU 0 ns
4 LDAC Pulse Width tLDACPWL 20 ns
0 SCLK Fall to DOUT Transition CLOAD = 20pF, SLOW = 0 1.8 12.0
1 (Note 16) tDOT CLOAD = 20pF, SLOW = 1 10 40 ns
X
SCLK Rise to DOUT Transition CLOAD = 20pF, SLOW = 0 1.8 12.0
A (Notes 16, 17) tDOT CLOAD = 20pF, SLOW = 1 10 40 ns
M CS Fall to SCLK Fall Setup Time tCSS 10 ns
SCLK Fall to CS Rise Setup
tCSH 0 2000 ns
Time
DIN to SCLK Fall Setup Time tDS 10 ns
DIN to SCLK Fall Hold Time tDH 0 ns
CS Pulse-Width High tCSPWH 50 ns
CS Rise to DOUT Disable tDOD CLOAD = 20pF 25 ns
CS Fall to DOUT Enable tDOE CLOAD = 20pF 1.5 25.0 ns
EOC Fall to CS Fall tRDS 30 ns
6 _______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ELECTRICAL CHARACTERISTICS (continued) M
(AVDD= DVDD= 4.75V to 5.25V, external reference VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless A
otherwise noted. Typical values are at AVDD= DVDD= 5V, TA= +25°C. Outputs are unloaded, unless otherwise noted.)
X
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
1
CKSEL = 01 (temp sense) or CKSEL = 0
65
10 (temp sense), internal reference on
4
CKSEL = 01 (temp sense) or CKSEL = 0
10 (temp sense), internal reference 140
/
CS or CNVST Rise to EOC initially off M
Fall—Internally Clocked tDOV CKSEL = 01 (voltage conversion) 9 µs A
Conversion Time
CKSEL = 10 (voltage conversion), 9 X
internal reference on
1
CKSEL = 10 (voltage conversion),
80 0
internal reference initially off
4
CKSEL = 00, CKSEL = 01 (temp sense) 40 ns
CNVST Pulse Width tCSW 2
CKSEL = 01 (voltage conversion) 1.4 µs
/
M
Note 1: Tested at DVDD= AVDD= 5.25V.
Note 2: Offset nulled. A
Note 3: No bus activity during conversion. Conversion time is defined as the number of conversion clock cycles multiplied by the
X
clock period.
Note 4: See Table 5 for reference-mode details. 1
Note 5: Not production tested. Guaranteed by design.
0
Note 6: See the ADC/DAC Referencessection.
4
Note 7: Fast automated test, excludes self-heating effects.
Note 8: Specified over the -40°C to +85°C temperature range. 6
Note 9: REFSEL[1:0] = 00 or when DACs are not powered up. /
M
Note 10:DAC linearity, gain, and offset measurements are made between codes 115 and 3981.
Note 11:The DAC buffers are guaranteed by design to be stable with a 1nF load.
A
Note 12:Time required by the DAC output to power up and settle within 1 LSB in the external reference mode.
Note 13:All DAC dynamic specifications are valid for a load of 100pF and 10kΩ. X
Note 14:Only one digital output (either DOUT, EOC, or the GPIOs) can be indefinitely shorted to either supply at one time. 1
Note 15:All digital inputs at either DVDDor DGND. DVDDshould not exceed AVDD. 0
Note 16:See the Reset Registersection and Table 9 for details on programming the SLOW bit.
4
Note 17:Clock mode 11 only.
8
_______________________________________________________________________________________ 7
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
8 Typical Operating Characteristics
4
(AVDD= DVDD= 5V, external VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), fSAMPLE= 225ksps, CLOAD= 50pF, 0.1µF capacitor
0 at REF, TA= +25°C, unless otherwise noted.)
1
X ANALOG SHUTDOWN CURRENT ANALOG SHUTDOWN CURRENT ADC INTEGRAL NONLINEARITY
vs. ANALOG SUPPLY VOLTAGE vs. TEMPERATURE vs. OUTPUT CODE
A
46/M μCURRENT (A) 000...345 MAX1040 toc01 μCURRENT (A) 00..43 MAX1040 toc02 ARITY (LSB) 000...123 MAX1040 toc03
AX10 ANALOG SHUTDOWN 00..12 ANALOG SHUTDOWN 00..21 INTEGRAL NONLINE --00..210
M
0 0 -0.3
/ 4.750 4.875 5.000 5.125 5.250 -40 -15 10 35 60 85 0 256 512 768 1024
2 SUPPLY VOLTAGE (V) TEMPERATURE (°C) OUTPUT CODE
4
ADC DIFFERENTIAL NONLINEARITY ADC OFFSET ERROR ADC OFFSET ERROR
0
vs. OUTPUT CODE vs. ANALOG SUPPLY VOLTAGE vs. TEMPERATURE
AX1 LSB) 00..23 MAX1040 toc04 0.4 MAX1040 toc05 1.0 MAX1040 toc06
M RITY ( 0.1 SB) 0.3 SB) 0.5
A L L
NE R ( R (
040/ ERENTIAL NONLI -0.10 OFFSET ERRO 00..21 OFFSET ERRO -0.50
F
F
1 DI -0.2
X
-0.3 0 -1.0
A 0 256 512 768 1024 4.750 4.875 5.000 5.125 5.250 -40 -15 10 35 60 85
OUTPUT CODE SUPPLY VOLTAGE (V) TEMPERATURE (°C)
M
ADC GAIN ERROR ADC GAIN ERROR ADC EXTERNAL REFERENCE
vs. ANALOG SUPPLY VOLTAGE vs. TEMPERATURE INPUT CURRENT vs. SAMPLING RATE
0.50 MAX1040 toc07 1.0 MAX1040 toc08 μRRENT (A) 5600 MAX1040 toc09
0.25 0.5 CU
B) B) UT 40
AIN ERROR (LS 0 AIN ERROR (LS 0 EFERENCE INP 30
G G R 20
L
A
-0.25 -0.5 N
R
TE 10
X
E
C
D
-0.50 -1.0 A 0
4.750 4.875 5.000 5.125 5.250 -40 -15 10 35 60 85 0 50 100 150 200 250 300
SUPPLY VOLTAGE (V) TEMPERATURE (°C) SAMPLING RATE (ksps)
8 _______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Typical Operating Characteristics (continued) M
(AVDD= DVDD= 5V, external VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), fSAMPLE= 225ksps, CLOAD= 50pF, 0.1µF capacitor A
at REF, TA= +25°C, unless otherwise noted.)
X
ANALOG SUPPLY CURRENT ANALOG SUPPLY CURRENT ANALOG SUPPLY CURRENT 1
vs. SAMPLING RATE vs. ANALOG SUPPLY VOLTAGE vs. TEMPERATURE
0
mA) 23..50 MAX1040 toc10 22..0024 MAX1040 toc11 mA)22..0002 MAX1040 toc12 40
NALOG SUPPLY CURRENT ( 112...050 SUPPLY CURRENT (mA)1112....99904860 NALOG SUPPLY CURRENT (1111....99992648 /MAX1
A 0.5 1.92 A1.90 0
4
0 1.90 1.88 2
0 50 100 150 200 250 300 4.750 4.875 5.000 5.125 5.250 -40 -15 10 35 60 85
SAMPLING RATE (ksps) SUPPLY VOLTAGE (V) TEMPERATURE (°C) /M
DAC INTEGRAL NONLINEARITY DAC DIFFERENTIAL NONLINEARITY DAC FULL-SCALE ERROR A
vs. OUTPUT CODE vs. OUTPUT CODE vs. ANALOG SUPPLY VOLTAGE
X
INTEGRAL NONLINEARITY (LSB) --00000.....211230 MAX1040 toc13 DIFFERENTIAL NONLINEARITY (LSB)-000...0105050 MAX1040 toc14 DAC FULL-SCALE ERROR (LSB) 00000.....0112255005 MAX1040 toc15 1046/MAX
1
-0.3 -0.10 0
0 256 512 768 1024 1023 1026 1029 1032 1035 1038 4.750 4.875 5.000 5.125 5.250 0
OUTPUT CODE OUTPUT CODE SUPPLY VOLTAGE (V) 4
DAC FULL-SCALE ERROR DAC FULL-SCALE ERROR DAC FULL-SCALE ERROR 8
vs. TEMPERATURE vs. REFERENCE VOLTAGE vs. LOAD CURRENT
DAC FULL-SCALE ERROR (LSB) -11023 ERXETFEERRNENACLIRNEETFEERRNEANLCE MAX1040 toc16 DAC FULL-SCALE ERROR (LSB)--000001......2570525050050 MAX1040 toc17 DAC FULL-SCALE ERROR (LSB) ---23101 MAX1040 toc18
-2
-0.75
-3 -1.00 -4
-40 -15 10 35 60 85 0 1 2 3 4 5 0 5 10 15 20 25 30
TEMPERATURE (°C) REFERENCE VOLTAGE (V) LOAD CURRENT (mA)
_______________________________________________________________________________________ 9
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
8 Typical Operating Characteristics (continued)
4
(AVDD= DVDD= 5V, external VREF= 4.096V, fCLK = 3.6MHz (50% duty cycle), fSAMPLE= 225ksps, CLOAD= 50pF, 0.1µF capacitor
0 at REF, TA= +25°C, unless otherwise noted.)
1
X INTERNAL REFERENCE VOLTAGE ADC REFERENCE SUPPLY CURRENT ADC REFERENCE SUPPLY CURRENT
vs. TEMPERATURE vs. ANALOG SUPPLY VOLTAGE vs. TEMPERATURE
A
AX1046/M INTERNAL REFERENCE VOLTAGE (V) 4444....11102109 MAX1040 toc19 μDC REFERENCE SUPPLY CURRENT (A) 222222444444......889999862046 MAX1040 toc20 μDC REFERENCE SUPPLY CURRENT (A)4444400001.....68790 MAX1040 toc21
A A
M
4.08 24.84 40.5
/ -40 -15 10 35 60 85 4.750 4.875 5.000 5.125 5.250 -40 -15 10 35 60 85
2 TEMPERATURE (°C) SUPPLY VOLTAGE (V) TEMPERATURE (°C)
4
0
ADC FFT PLOT ADC IMD PLOT ADC CROSSTALK PLOT
1 0 0 0
AX -20 fffSACANLMKA LP=OL G5E. _2=)N4 32 2=8. 871M608.0Hk8zH0zkHz MAX1040 toc22 -20 fffCIINNL12K == = 19 51.0..20k4Hk2Hz8z8MHz MAX1040 toc23 -20 fffCIINNL12K == = 18 50.0..2084802018kk8HHMzzHz MAX1040 toc24
-40 SINAD = 61.21dBc -40 AIN = -6dBFS -40 SNR = 61.11dBc
M dB) -60 STHNDR == 6713..2312ddBBcc dB) -60 IMD = 78.0dBc dB) -60 TEHNDO B= =7 39..3826d BBIcTS
0/ TUDE ( -80 SFDR = 81.25dBc TUDE ( -80 TUDE ( -80 SFDR = 86.34dBc
LI LI LI
P P P
4 M-100 M-100 M-100
A A A
0 -120 -120 -120
1
-140 -140 -140
X
-160 -160 -160
A 0 50 100 150 200 0 50 100 150 200 0 50 100 150 200
ANALOG INPUT FREQUENCY (kHz) ANALOG INPUT FREQUENCY (kHz) ANALOG INPUT FREQUENCY (kHz)
M
DAC OUTPUT LOAD REGULATION GPIO OUTPUT VOLTAGE GPIO OUTPUT VOLTAGE
vs. OUTPUT CURRENT vs. SOURCE CURRENT vs. SINK CURRENT
C OUTPUT VOLTAGE (V) 222222......000000345678 SINKING MAX1040 toc25 O OUTPUT VOLTAGE (V) 2345 C0GG–PPCIOI3OA OB00U––TABP33U O,TUSTPUTS MAX1040 toc26 OUTPUT VOLTAGE (mV)11256900000000 GPIOOB0U–TBP3U,T CS0–C3 MAX1040 toc27
DA 2.02 SOURCING GPI PIO GPIOA0–A3 OUTPUTS
1 G 300
2.01
DAC OUTPUT = MIDSCALE
2.00 0 0
-30 0 30 60 90 0 20 40 60 80 100 0 20 40 60 80 100
OUTPUT CURRENT (mA) SOURCE CURRENT (mA) SINK CURRENT (mA)
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