WCN3610 Device Revision Guide

8 Pages·2014·0.091 MB·English

by  Qualcomm Technologies Inc.

Qualcomm Atheros, Inc.
WCN3610
Device Revision Guide
80-WL008-4 Rev. A
December 4, 2014
Confidential and Proprietary – Qualcomm Atheros, Inc.
© 2014 Qualcomm Atheros, Inc. and/or its affiliated companies. All rights reserved.
NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to:
[email protected].
Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express
written permission of Qualcomm Atheros, Inc.
Submit technical questions at: https://support.cdmatech.com
Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Atheros, Inc. or its affiliated companies
without the express approval of Qualcomm Configuration Management.
Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated
trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners.
This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and
international law is strictly prohibited.
Qualcomm Atheros, Inc.
1700 Technology Drive
San Jose, CA 95110
U.S.A.
Revision history
Revision Date Description
A December 2014 Initial release
80-WL008-4 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 3
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WCN3610 Device Revision Guide
1 Introduction
This device revision guide addresses the WCN3610 WLAN/Bluetooth/FM RF modem solution.
Technical information for WCN3610 devices is primarily covered by the documents listed in
Table1. Released WCN3610 documents are posted on the CDMATech Support website
(https://support.cdmatech.com) and are available for download.
Table1 Important WCN3610 documents
Document
Document title
number
80-WL008-1 WCN3610 Wireless Connectivity IC Device Specification
80-WL008-4 WCN3610 Device Revision Guide
(this document)
80-WL008-5 WCN3610 Design Guidelines
80-WL008-21 WCN3610 Layout Guidelines
80-WL008-44 WCN3610 Wireless Connectivity IC Design Example Schematic
1.1 Scope and intended audience
This device revision guide identifies issues with all WCN3610 samples released to date. The
following information is included:
 Introduction to this document and its topics (Chapter1)
 Device identification (Chapter2)
Device marking

Hardware revision number

Identification details for each sample type

Sample testing – engineering sample (ES) and customer sample (CS) explanations

Identification of compatible software releases

 Known issues (Chapter3)
Issue description

Impact to system performance

Possible workarounds (what designers should do to minimize the issue’s impact)

This device revision guide is intended for new product developers who are designing, testing,
and/or evaluating phones or terminals that include the WCN3610 device.
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Confidential and Proprietary – Qualcomm Atheros, Inc.
WCN3610 Device Revision Guide
2 Device Identification
The WCN3610 device can be identified by markings on its top surface and by the contents of an
identification register; these identification techniques are described in Section2.1 and Section2.2,
respectively.
2.1 Device marking
2.1.1 WCN3610 device marking
Line 1 W C N 3 6 1 0
Line 2 P B B
Additional line
Line 3 XXXXXXXX
Line 4 FAYWWRR
Line 5 # #
Ball 1 identifier
Figure1 WCN3610 part marking (top view – not to scale)
Table2 Part marking line descriptions
Line Marking Description
1 WCN3610 Qualcomm Atheros, Inc. (QCA) product name
2 PBB P = Product configuration code
 See Table3 for assigned values
BB = Feature code
 See Table3 for assigned values
An additional line may appear on the part marking for some samples; this is manufacturing information that
is only relevant to QCA and QCA suppliers.
3 XXXXXXXXX XXXXXXXXX = traceability information
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WCN3610 Device Revision Guide
Table2 Part marking line descriptions (cont.)
Line Marking Description
4 FAYWWRR F = wafer fabrication site code
 F = H for GlobalFoundaries
A = assembly (drop ball) site code
 A = L for StatsChipPac
 A = E for ASEKH
Y = single-digit year
WW = work week (based on calendar year)
RR = product revision
See Table3 for assigned values
5 • XX • = dot identifying pin 1
XX = 2-digit wafer number
2.2 Device identification for each sample type
This section provides details for identifying each sample type.
Table3 WCN3610 device identification details
Product Product
WCN3610 Feature code
configuration revision Comments
sample type (BB)
code (P) (RR)
ES 0 VV 01 Engineering sample
Information for other sample types will be added as they are released.
2.2.1 Engineering samples (ES)
These devices have undergone limited testing and sometimes have significant feature limitations.
They are suitable to assist with PCB development, to conduct board-level electrical evaluation
tests, and to explore manufacturing considerations. Engineering samples are not to be used for
phone-level qualification.
2.2.2 Commercial samples (CS)
These devices have undergone full production-level testing and meet the specifications and
features described in the device specification, except as otherwise noted in this document. They
have passed device-level qualification. Commercial samples are suitable to be used for
performance testing as well as phone-level production and qualification.
2.3 Compatible software releases
For information regarding compatible software releases with the WCN3610 devices, contact QCA
customer-support engineering at https://support.cdmatech.com.
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WCN3610 Device Revision Guide
3 Known Issues
3.1 Summary of known issues
All known issues for each revision of the WCN3610 device are summarized in Table4. The text
within the Issue column provides links to the sections of this document that explain the issues,
regardless of the sample type (or types) on which they occur.
NOTE An X in any of the other columns indicates that the issue occurs on the corresponding
sample type. A dash (–) in any of the other columns indicates that the issue was fixed
on the corresponding sample type.
Table4 also lists the functional area affected by each issue.
Table4 Known issues – all sample types and revisions1
WCN3610
ES
Functional
# Issue
area P = 0
RR = 01
1 IDD power down bimodal behavior Top-level X
2 HTOL failure after 168 hours Top-level X
3 HBM can only pass +1 KV Top-level X
4 Low Bluetooth Tx output power Bluetooth X
5 WLAN LO leakage WLAN X
1. P and RR values are detailed in Table3.
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WCN3610 Device Revision Guide
3.2 Issues – description, impact, and workaround
Issue1 IDD power down bimodal behavior
Description IDD power down bimodal behavior (CR# 0000169526). Root cause identified through FIB parts
and simulations.
Impact Negligible battery current (~30 µA).
Workaround This issue will be fixed in the next silicon (CS).
Return to Table4
Issue2 HTOL failure after 168 hours
Description HTOL failure after 168 hours (CR# 0000169532). Root cause has been identified as weak
layout of RC clamp.
Impact IDDq leakage observed from 3.3 V rail after 168 hours.
Workaround This issue will be fixed in the next silicon (CS).
Return to Table4
Issue3 HBM can only pass +1 KV
Description HBM passes ±2 kV on all pins except one pin, XO_G, which passes ±1 kV (CR#0000169524).
Root cause identified as weak VDD/GND connection from HBM diode to RC clamp.
Impact None.
Workaround This issue will be fixed in the next silicon (CS).
Return to Table4
Issue4 Low Bluetooth Tx output power
Description Bluetooth Tx output power not meeting typical target power by 3 dB (CR# 0000169523). Root
cause identified as weak IC GND connection which degenerates the Bluetooth amplifier.
Impact Typical Bluetooth GFSK Pout achieves 10 dBm (target is 13 dBm).
Workaround This issue will be fixed in the next silicon (CS).
Return to Table4
Issue5 WLAN LO leakage
Description WLAN OFDM LO leakage degraded at Pout below 14 dBm (CR# 0000170130). Root cause
identified as sub-optimal Tx LO calibration routine in firmware.
Impact LO leakage will be greater than -30 dB when Pout lower than 14 dBm across channel at11g/n.
Workaround This issue will be resolved with a firmware update.
Return to Table4
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Confidential and Proprietary – Qualcomm Atheros, Inc.