Reliability of Microtechnology: Interconnects, Devices and Systems

219 Pages·2011·2.89 MB·English

by  Johan Liu

Reliability of Microtechnology

Johan Liu Olli Salmela Jussi Sa¨rkka¨
l l
James E. Morris Per-Erik Tegehall
l
Cristina Andersson
Reliability of
Microtechnology
Interconnects, Devices and Systems
JohanLiu JamesE.Morris
SMITCenterandBionanoSystems DepartmentofElectrical&Computer
Laboratory Engineering
DepartmentofMicrotechnology PortlandStateUniversity
andNanoscience P.O.Box751,Portland
ChalmersUniversityofTechnology OR97207-0751
Kemiva¨gen9,SE-41296Go¨teborg USA
Sweden [email protected]
and
KeyLaboratoryofNewDisplays Per-ErikTegehall
andSystemIntegration SwereaIVF
SMITCenterandSchool Box104,SE-43122Mo¨lndal
ofMechatronicsandMechanical Sweden
Engineering [email protected]
Box282,Room316,
MechatronicsBuilding,Shanghai CristinaAndersson
University DepartmentofMicrotechnology
No149,YanChangRoad andNanoscience
Shanghai200072,China ChalmersUniversityofTechnology
[email protected] Kemiva¨gen9,SE-41296Go¨teborg
Sweden
OlliSalmela [email protected]
NokiaSiemensNetworks
Linnoitustie6,FI-02600EspooFinland
[email protected]
JussiSa¨rkka¨
NokiaSiemensNetworks
Kaapelitie4,FI-90620Oulu
Finland
[email protected]
ISBN978-1-4419-5759-7 e-ISBN978-1-4419-5760-3
DOI10.1007/978-1-4419-5760-3
SpringerNewYorkDordrechtHeidelbergLondon
LibraryofCongressControlNumber:2011920685
#SpringerScience+BusinessMedia,LLC2011
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Foreword
Asasociety,ourdependencyonelectronicsproductspermeateseverycornerofthe
world,ataneveracceleratedpace.
Asanindustry,wehavebeenandwillcontinuetoplacethehighestpriorityon
product reliability, while facing increasingly demanding customers and mounting
competitive pressures. It is widely recognized that product reliability issues can
resultininconvenienceinsomecasesandcatastropheinothers.
It is, therefore, a matter of the utmost importance that we educate our college
studentsandpracticingengineersonthereliabilityofmicrotechnology–itstheory
andpracticalapplications.
Theissueofreliability,however,iscomplicatedbythewidevarietyofapplica-
tion environments and requirements, which give rise todifferent stress conditions
(thermomechanical, dynamical, electrochemical, electrical, etc.). The picture is
further complicated by the constant emergence of new applications (therefore the
associateduseandenvironmentalconditions),newproductdesigns,newmaterials,
andnewprocesses.
We are fortunate to have a few dedicated experts who can lead and guide us
through the critical but complex issues associated with electronics reliability. We
have learned a great deal from them at conferences and workshops; however, a
comprehensivetextbookhaslongbeenawaited.Thisbookisverytimelyindeed.
September,2010 DongkaiShangguan,Ph.D.,MBA
VicePresident–Flextronics
VisitingProfessor–HUST,China
Fellow–IEEE
v

Preface
Thisbookservesasateaching materialconcerning reliabilityofmicrotechnology
and covers topics from devices to systems in the final year of undergraduate and
firstyearofgraduateeducationincludingquestionsandanswersforself-study.The
bookisalsousefulforreliabilityengineersforreliabilityassessment,modeling,and
quality control purposes. The book includes reliability issues of interconnects,
componentuptosystemlevel.Themethodologyofreliabilityconceptisaddressed
inthefirstchaptersandfollowedbygeneralfailuremechanismsincludingspecific
failuremodesinsolderandconductiveadhesives.Acceleratedtesting,interconnect,
component, and system-level reliability are described also in detail as well as the
reliabilitydesignformanufacturability.Finally,qualityandreliabilitymanagement
issuesaswellascharacterizationtoolsforreliabilityaredescribed.
Gothenburg JohanLiu
September,2010 MemberoftheRoyalSwedishAcademy
ofEngineeringSciences(IVA)
FellowIEEE
ProfessorChalmersUniversityofTechnology,Sweden
SpecialRecruitedProfessorShanghaiUniversity,China
vii

Contents
1 IntroductiontoReliabilityandItsImportance....................... 1
1.1 Introduction........................................................... 1
References................................................................. 2
2 ReliabilityMetrology.................................................... 3
2.1 TheDefinitionofReliability......................................... 3
2.2 EmpiricalModels..................................................... 3
2.3 PhysicalModels...................................................... 4
2.4 ReliabilityInformation............................................... 5
2.5 InterconnectionReliability........................................... 9
2.6 TheLevelsofInterconnections...................................... 12
2.7 ReliabilityFunction.................................................. 13
2.7.1 ExponentialDistribution...................................... 15
2.7.2 WeibullDistribution........................................... 19
2.7.3 Log-NormalDistribution...................................... 22
2.7.4 PhysicalBasisoftheDistributions............................ 23
2.8 AGenericWeibullDistributionModeltoPredict
ReliabilityofMicrosystems.......................................... 24
2.8.1 Failure-CriteriaDependenceoftheLocationParameter ..... 26
2.8.2 LeastSquaresEstimation ..................................... 27
2.8.3 TheExperimentandData..................................... 28
2.8.4 AnalysisandtheResults...................................... 31
2.8.5 ApplicationoftheResults..................................... 32
Exercises.................................................................. 32
References................................................................. 33
ix