Table Of ContentInterfacial Science in Ceramic Joining
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3. High Technology - Vol. 58
Interfacial Science
in Ceramic Joining
edited by
Alida Bellosi
Research Institute for Ceramics Technology,
National Research Council.
Faenza. Italy
and
Tomaz Kosmac
Jomf Stefan Institute,
Ljubljana, Slovenia
and
Antoni P. Tomsia
Lawrence Berkeley National Laboratory,
Berkeley. CA, U.S.A. .
Springer-Science+Business Media, B.V.
ProceOOings of the NATO Advanced Research Workshop on
Interfacial Science in Ceramic Joining
8100, Slovenia
November 12-15,1997
A C.I.P. Catalogue record for this book Is avallable from the Llbrary of Congress
ISBN 978-90-481-5086-1 ISBN 978-94-017-1917-9 (eBook)
DOI 10.1007/978-94-017-1917-9
Printed on acid-free papar
AII Rights Reserved
© 1998 Springer Science+Business Media Dordrecht
Originaily published by Kluwer Academic Publishers in 1998
Softcover reprint of the hardcover 1s t edition 1998
No part of the material protected by this copyright notice may be reproducOO or
utilizOO in any form ar by any means, electronic or mechanical, including photo
copying, recording or by any information storage and retrieval system, without written
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CONTENTS
Preface ix
List of Participants xi
I. Introductory Key Notes 1
Structure, Composition and Thennal Stability of the CulAh03 Interface 3
M RUhle, A. Liedtke, U Alber, R. Schweinfost, G. Elftner
Diffusion Bonding of Si)N4-Ceramic to Transition Metals: Interfacial 15
Microchemistry
A. A. Kodentsov, M J. H. van Dal, F. J. J. van Loo
Improvement of Wetting and Bonding of Dissimilar Materials 27
N. Sobczak
II. Wetting 43
Wetting and Interfaces in Metal-Oxide Systems: 45
Sensitivity to Experimental Conditions
D. Chatain, V. Ghetta, J. Fouletier
Kinetics of Spreading of Some Metal Melts over 57
Covalent Ceramic Surfaces
N. Grigorenko, V. Poluyanslcaya, N. Eustathopoulos, Y. Naidich
Chemicallnteraction at the Initial Stage of Spreading 69
L. 1 Kostrova, N. D. Lesnik
Wettability Under Non-Reactive and Reactive Conditions in the 79
Systems NilYSZ and NilTi-TiQVYSZ
A. Tsoga, A. Naoumidis, P. Nikolopoulos
Wettability ofTiB2 Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys 87
M L. MuoIo, A. Delsante, M Bassoli, A. Passerone, A. Bellosi
vi
m.
Brazing 95
The Brazing of Ceramics: Material Science Aspect of Reactive Braze Alloys 97
M. G. Nicholas
Transient Liquid Phase{ILP) Routes to the Joining of Structural 111
Ceramics
M. R. Locatelli, R. A. Marks, D. R. Chapman,
K Nakashima, A. M. Glaeser
Joining of Si:tN4 Using AI and Ni Jnterlayers 135
J-P., JlICquemill, D. Juve, D. Treheux;
P. .Miranio. M. 1 Osendi
Metallic Reaction for Joining of SiC Ceramics 143
A. Naoumidis
IV. Interfacial Phenomena and Microstructures
151
AlumiDa-AlumiDi:gm Interfaces 153
W. D. KDplan
Diffusion Processes at Liquid MetalICeramic Interfaces 161
E. Saiz. A. P. Tomsia, R. M. Cannon
Role of1nterfacial and Strain Energy for the formation of Native 169
Metal-Oxide Interfaces
M. Baclchaus-Ricoult. S. Laurent
Phase Fonnation at Metal-Ceramic Interfaces 183
J. C. Schuster
TEM Examinations ofB130:z/AI Reaction Zone 195
J. Morgiel, N. Sobczak, M. Ksiazek
Interfacial Reaction Kinetics of Silicon Nitridellron Alloys Diffusion 203
Coupl~ in the Range 10S0°C/1250°C
F. J. Oliveira, R. F. Silva, J. M. Vieira
The Role of Intergranular Phases in Silicon Nitride and Silicon Carbide 211
Direct Joining.
L. Esposito, A. Bellosi
vii
Interdiffusion at Metal/Oxide Interfaces Studied in Thin-Film 223
Structures with AES Depth Profiling
A. Zalar, S. Hofmann, B. Baretzky,
F. Dettenwanger, P. Panjan
FT-IR and FT-Raman Study of Surfaces and Thin Layers 233
J. Mink, G. Keresztury, J. Kristof, J. Mihaly
V. Adhesion and Mechanical Properties 247
Interfaces and Structural Integrity of CeramiclMetal Joints: 249
Reliability of Interface
K. Suganuma
Fracture Criteria for Interface Cracks. A Case Study 267
V. Stamos, V. Kostopoulos, S. D. Peteves
Interfaces in High-Strength, High.Temperature Ceramic Joints 281
R. E. Loehman, S. J. Glass, B. G. Quillen. F. M Mahoney,
F. M Hosking, J. J. Stephens, P. T. Vianco, J. Pollinger
Dissipation Analysis of Interface Failure ofBimaterials 295
P. G. Th. van der Varst, G. de With
Calculation and Experimental Determination of the Residual Stresses 311
in a Metal-Ceramic Bond
D. Treheux, S. Fayeulle, V. Guipont, J. P. Jacquemin
Application of the Blister Test to Adhesion Energy Measurements in 319
Metal/Ceramic Film-an-Substrate Systems
M Dupeux, A. Bosseboeuf
Microstructure, Mechanical Properties and Stability of Brazed 329
Metal/Ceramic Systems: Technological Aspects and Testing Methodologies
0. C. Paiva, L. Ferreira, M A. Barbosa
Joining of Silicon Nitride Ceramics to Titanium Alloy with an 341
Interlayer
P. Svec, V. Pule, E. Gondar
Layered Composites -Relationship Between Residual Stresses and 349
Fracture Behaviour
P. Sajgalik, Z. Lences
viii
Adhesion in SteeVSilicate Glass System 357
M. B. Lupescu, M. Zaharescu
VI. Novel Joining Techniques
365
Reactive Coatings on Ceramic Substrates 367
J. S. Muya, J. Requena, H. P. Steier
Fabrication ofMetaVOxide Ceramic FlUlctionally Graded Materials 383
by Slip Casting
K. Morinaga, H. Masuda, K. Hayashi
The Joining of Alumina Membranes 399
K Vercammen, H. Weyten, R. Persoons, J. Luyten
Joining Ceramics Using Preceramic Polymers 405
P. Colombo
VIT. Ceramic Interfaces in Electronic Applications 415
The Importance of the Ceramic Interface in Elec1ronic Applications 417
K. Niwa, K. Hashimoto, 1. Goto
Interaction ofMLC BaTi0 Based Ceramic with Silver Termination Ink 429
3
D. Suvorov
Influence of Boundaries on Ionic Conductance 443
J. Jamnik
Interface Effects in Ferroelectric Thin Films 457
A. Sternberg, V. Zauls, M. Tyunina. G. Liberts. M. Kundzinsh,
L. Calzada, M. Alpero, L. Pardo, M Kosec, R. Kullmer, D. Biiuerle
Characterisation of the Metal-Ceramic Direct Soldering by the 465
Metal-Metal Diffusion Method
C. Anton, V. Burghelea
Aubor Index. 473
Subject Index 477
PREFACE
This volume contains most of the contributed papers from the NATO Advanced
Research Workshop titled "Interfacial Science in Ceramic Joining" held 12-15
November 1997 in Bled, Slovenia. About 60 scientists :from 21 countries participated in
the invitation-only Workshop. Latest developments and new research results were
reported in 37 oral contributions and 13 poster presentations, as well as.in the many
vigorous discussions that occurred throughout the meeting.
The idea for this workshop grew from the recognition that materials joining and the
interfaces created in joining frequently determine properties and performance of
materials and devices critical to emerging technologies. Many applications of ceramics
require them to be joined to each other or to other materials such as metals. The
technologies that are used to join ceramics and glass are truly critical, because without
them many applications requiring the properties of ceramics would be impossible or
uneconomical. It is evident that progress in developing new ceramic materials has not
been matched by improvements in the science and technology of joining. This presents
an unusually complex set of intellectual and technological challenges. The solutions to
these problems in many cases must come :from an interdisciplinary approach that
requires exchange of experience and observations :from many areas of materials science
and related disciplines.
To foster such an exchange in this Workshop, we selected as participants scientists
and engineers working on a broad range of issues in joining of dissimilar materials and
interfaces.
Surfaces and heterophase boundaries, i.e., interfaces, between dissimilar materials
frequently determine the properties and performance of structures and devices.
Examples include aerospace composites, electronic packaging systCms, biomaterials,
thin film electronic devices, catalysts, sensors, corrosion protection· systems, etc.
Ceramic-metal interfaces are one important class of heterophase boundaries that is
common to many of the. above applications. In addition, many essential processes in
ceramic technology, such as sintering. rely on su.rfBce arid interface properties to
determine behavior. Nevertheless, understanding of these properties at an atomistic
level is poor. This is partly due to the complexity of real materials, which usually
contain impurities and defects. These intrinsic defects and impurities are responsible
for many of the observed properties of ceramics and they are likely to be especially
important in determining su.rfBce and interface behavior.
The development of complex, integrated materials systems with tailored properties
requires control and understanding of microstructures and interfaces on a scale ranging
from molecular dimensions to the macro-levels associated with bulk. composites. In
ix
x
order to achieve such control, new challenges in the processing and characterization of
materials must be addressed. The intention of the Workshop was to focus discussions
on these important issues of materials science.
The organization and order of papers in this volume follows that of the Workshop.
There were sessions on -wettability and related phenomena, -joining techniques:
brazing, diffusion bonding, innovative joining techniques, -interfacial phenomena:
diffusion processes, phase formation, microstructural characteristics of interfaces, -
relationships between interface properties, adhesion and mechanical properties ofj oints,
and, finally, -ceramic interfaces in electronic applications.
The papers were peer-reviewed in accordance with the normal procedure of the
NATO series.
The Organizers of the Workshop gratefully acknowledge the financial support
provided by the NATO Scientific Affairs Division in BlUIIsels, Belgium.
The Workshop was organized under the auspices and with the assistance of the
Ministry of Science and Technology of the Republic of Slovenia.
Special thanks also are due to the sponsors of the Workshop: IRTEC-Research
Institute for Ceramics Technology (Faenza, Italy), Jozef Stefan Institute (Ljubljana,
Slovenia), and Lawrence Berkeley National Laboratory (Berkeley, Ca, USA).
The Workshop could not have been a success without the outstanding contributions of
all the participants. Special thanks are extended to the invited lecturers and to the
session chaiJ:persons. Finally, the organizers thank L. Esposito and R. Bambi :from.
IRTEC and K. Kmel and A. Dakskobler :from. JSI, for their work in helping to organize
the Worlcshop.
Alida Bellosi
TomaZKo~
Antoni P. Tomsia
