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Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics) PDF

345 Pages·2006·20.807 MB·English
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by Jan A. Dziuban| 2006| 345 pages| 20.807| English

About Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics)

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Detailed Information

Author:Jan A. Dziuban
Publication Year:2006
ISBN:9781402045783
Pages:345
Language:English
File Size:20.807
Format:PDF
Price:FREE
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