(Archived) 3-Axis Digital Angular Rate Gyroscope - Data sheet

50 Pages·2014·1.52 MB·English

by  Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. FXAS21000
Data Sheet: Advance Information Rev 1.3, 11/2014
3-Axis Digital Angular Rate
FXAS21000
Gyroscope
FXAS21000 is a small, low-power, 3-axis yaw, pitch, and roll
angular rate gyroscope. The full-scale range is adjustable from
±200°/s to ±1600°/s, with Output Data Rates (ODR) from 1.5625
to 200 Hz. It features both I2C and SPI interfaces. The device
may be configured to generate an interrupt when a user-
D
programmable angular rate threshold is crossed on any one of
the enabled axes.
24 QFN
4 mm x 4 mm x 1 mm
FXAS21000 is available in a plastic QFN package; the device is
E Case 2209-01
guaranteed to operate over the extended temperature range of
–40 °C to +85 °C.
Features V
Top View
• Supply voltage (VDD) from 1.95 V to 3.6 V ed ed ed ed ed
v v v v v
• Interface supply voltage (VDDIO) from 1.62 V to 3.6 V ser ser ser ser ser
• I2C interfaces I Re Re Re Re Re
• Normal mode (100 kHz) H GN D 1 2 4 2 3 2 2 2 1 2 0 19 GND
• Fast mode (400 kHz)
INT2 2 18 VDDIO
• SPI interface INT1 3 FXA S2100 0 17 SPI_CS_B
• Up to 2 MHz (3- and 4-wire modes)
C RST_B 4 24 pin QFN 16 VREGD
• FIFO buffer is 192 bytes (32 X/Y/Z samples) with stop and
circular operating modes GND 5 4 mm x 4 m m x 1 mm 15 VDD
Reserved 6 14 GND
• Output Data Rates (ODR) from 1.5625 to 200 Hz;
integrated antialiasing filter eRnsures that output signal Reserved 7 8 9 10 11 12 13 SA0 / MISO
•• bALaonnwgdu pwlaoirdw trehar t iess tslaiemnnditsbeitydiv mtiotyo OdoeDf 0R.2/2°/s in ±1600°/s FSR mode Reserved Reserved Reserved CL / SCLK DA / MOSISPI_DIO
• Rate threshold interArupt S S /
• Integrated self-test function Pin Connections
• No external charge-pump capacitor required
Typical Applications
• Game controller
• Gyro stabilized electronic compass
• Orientation determination
• Gesture-based user interfaces and Human Machine Interface (HMI)
• Indoor navigation
• Mobile phones
• Hobby and toy grade RC vehicles and UAVs
• Virtual and augmented reality devices (including glasses)
This document contains information on a new product. Specifications and information herein
are subject to change without notice. © 2014 Freescale Semiconductor, Inc. All rights reserved.
Ordering Information
Part Number Temperature Range Package Description Shipping
FXAS21000CQR1 –40 °C to +85 °C QFN Tape and reel (1 k)
Related Documentation
The FXAS21000CFXAS21000C device features and operations are described in a variety of reference
manuals, user guides, and application notes. To find the most-current versions of these documents:
1. Go to freescale.com/FXAS21000CFXAS21000C.
2. Click on the Documentation tab. D
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2 3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014.
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Table of Contents
1 General Description.........................................................................4 6.1 0x00: STATUS......................................................................25
1.1 Block Diagram.......................................................................4 6.2 0x01–0x06: OUT_X_MSB, OUT_X_LSB, OUT_Y_MSB,
1.2 Pinout.....................................................................................4 OUT_Y_LSB, OUT_Z_MSB, OUT_Z_LSB........................25
1.3 System Connections..............................................................6 6.3 0x07: DR_STATUS..............................................................27
1.3.1 Typical Application Circuit—I2C Mode.................6 6.4 0x08: F_STATUS..................................................................28
1.3.2 Typical Application Circuit—SPI Mode..................7 6.5 0x09: F_SETUP.....................................................................29
1.4 Sensitive Axes Orientations and Polarities............................7 6.6 0x0A: F_EVENT...................................................................30
2 Mechanical and Electrical Specifications........................................8 6.7 0x0B: INT_SOURCE_FLAG...............................................31
2.1 Absolute Maximum Ratings..................................................8 6.8 0x0C: WHO_AM_I...............................................................32
2.2 Operating Conditions.............................................................9 6.9 0x0D: CTRL_REG0..............................................................32
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2.3 Mechanical Characteristics....................................................9 6.10 0x0E: RT_CFG......................................................................34
2.4 Electrical Characteristics.......................................................10 6.11 0x0F: RT_SRC......................................................................35
2.5 Temperature Sensor Characteristics......................................10 6.12 0x10: RT_THS......................................................................36
3 Digital Interfaces..............................................................................11 6.13 0x11: RT_COUENT................................................................37
3.1 I²C Interface...........................................................................11 6.14 0x12: TEMP..........................................................................37
3.1.1 I²C Operation............................................................13 6.15 0x13: CTRL_REG1...............................................................38
3.1.2 I²C Read Operations.................................................14 6.16 0x14: CTRL_REG2...............................................................40
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3.1.3 I²C Write Operations................................................15 7 Printed Circuit Board Layout and Device Mounting.......................42
3.2 General SPI Operation (4-Wire Mode).................................17 7.1 Printed Circuit Board Layout................................................42
3.2.1 SPI Write (4-Wire Mode).........................................17 7.2 Overview of Soldering Considerations.................................43
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3.2.2 SPI Single Read (4-Wire Mode)..............................18 7.3 Halogen Content....................................................................44
3.2.3 SPI 3-Wire Mode.....................................................19 H8 Package Information........................................................................44
4 Modes of Operation.........................................................................20 8.1 Product Identification Markings............................................44
5 Functionality....................................................................................20 8.2 Tape and Reel Information....................................................44
5.1 FIFO Data Buffer..................................................................21 8.3 Package Description..............................................................45
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5.2 Rate Threshold Detection Function.......................................22 9 Revision History..............................................................................47
6 Register Descriptions.......................................................................24
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General Description
1 General Description
1.1 Block Diagram
Programmable Configuration
Charge
Drive Z Drive X/Y 32 Sample and Control
Pump
FIFO Buffer Registers
D
Ω
x,y,z
Temperature
X+ Y+ Z+ Fd Sensor
E
Digital
Self-Test X/Y Vibrating Z Vibrating MUX C2V Gain MUX ADC-14 Signal
Mass Mass LPF AAF Processing
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Angular Rate
Demod
X– Y– Z–
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Voaltnadg eR Regeufelaretonrcses OGseCcnilleolarcatkotorsr, TriNmV LMo,gic IOntuetrpruutpst I2C/SPI Interface
C
VDDIO GND VDD VREGD INT1 INT2 SCL/SCLK SDA/MOSI/ SA0/MISO SPI_CS_B RST_B
SPI_DIO
Figure 1. Block Diagram
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4 3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014.
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General Description
1.2 Pinout
d d d d d
e e e e e
v v v v v
er er er er er
s s s s s
e e e e e
R R R R R
2 4 2 3 2 2 2 1 2 0
GND 1 19 GND
INT2 2 18 VDDIO
FXAS21000
INT1 3 17 SPI_CS_B
RST_B 4 24 pin QFN 16 VREGD
GND 5 4 mm x 4 m m x 1 mm 15 VDD
Reserved 6 14 GND

Reserved 7 13 SA0 / MISO D
8 9 10 11 12
Reserved Reserved Reserved CL / SCLK DA / MOSISPI_DIO E
S S /
Figure 2. Device pinout (top view)
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Table 1. Pin functions
Pin Name Function
I
1 GND Ground
H
2 INT2 Interrupt Output 2
3 INT1 Interrupt Output 1
4 RST_B Reset input (acCtive low, connect to VDDIO if unused)
5 GND Ground
6 Reserved Reserved - Must be tied to ground
7 Reserved ResRerved - Must be tied to ground
8 Reserved Reserved - Must be tied to ground
9 Reserved Reserved - Must be tied to ground
A
10 Reserved Reserved - Must be tied to ground
11 SCL/SCLK I2C / SPI clock
12 SDA/MOSI/SPI_DIO I2C data / SPI 4-wire Master Out Slave In / SPI 3-wire data In/Out, 1
13 SA0/MISO I2C address bit0 / SPI 4-wire Master In Slave Out
14 GND Ground
15 V Supply voltage
DD
16 V Digital regulator output. Please connect a 0.1 μF capacitor between this pin and GND
REGD
SPI chip select input, active low. This pin must be held logic high when operating in I2C
17 SPI_CS_B
interface mode (I2C/SPI_CS_B set high) to ensure correct operation.
18 V Interface supply voltage
DDIO
19 GND Ground
20 Reserved Reserved - Must be tied to ground
21 Reserved Reserved - Must be tied to ground
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014. 5
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General Description
Table 1. Pin functions (continued)
Pin Name Function
22 Reserved Reserved - Must be tied to ground
23 Reserved Reserved - Must be tied to ground
24 Reserved Reserved - Must be tied to ground
1. MOSI becomes a bidirectional data pin when FXAS21000C is operated in 3-wire SPI mode with CTRL_REG0[SPIW] =
1.
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1.3 System Connections
The FXAS21000 offers the choice of connecting to a host processor through either I2C
E
or SPI interfaces. Figure 3 and Figure 4 show the recommended circuit connections for
implementing both options.
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1.3.1 Typical Application Circuit—I2C Mode
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24 2 3 2 2 21 20
C
d d d d d
e e e e e
1 GND serv serv serv serv serv GND 19 VDDIO (1.62 – 3.6 V)
e e e e e
R R R R R 0.1 μF
VDDIO INT2 2 INRT2 VDDIO 18
4.7 KΩ
(Optional) INT1 3 INT1 SPI_CS_B 17
0.1 μF
A
4 RST_B FX AS21000 VREGD 16
RST_B
Note: Connect RST_B pin to VDDIO 5 GND VDD 15 VDD (1.95 – 3.6 V)

if unused in the application. A pull-up 0.1 μF 1.0 μF
resistor may be used if desired. 6 Reserved GND 14

7 Reserved ved ved ved SAO 13 SAO
eser eser eser CL DA
R R R S S
8 9 10 11 12
VDDIO
VDDIO
4.7 KΩ

4.7 KΩ
SCL
SDA
Figure 3. I2C mode electrical connections
6 3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014.
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General Description
1.3.2 Typical Application Circuit—SPI Mode
24 2 3 2 2 21 20

d d d d d
e e e e e
1 GND serv serv serv serv serv GND 19 (1.6V2D –D 3IO.6 V)
e e e e e
R R R R R 0.1 μF
VDDIO INT2 2 INT2 VDDIO 18 Host SPI
Chip Select
(O4p7t ikoΩnal) INT1 3 INT1 SPI_CS_B 17
D0.1 μF
4 RST_B FX AS21000 VREGD 16
RST_B
Note: Connect RST_B pin to VDDIO 5 GND VDD 15 VDD (1.95 – 3.6 V)
if unused in the application. A pull-up E 0.1 μF 1.0 μF
resistor may be used if desired. 6 Reserved O GND 14
DI
_
7 Reserved Reserved Reserved Reserved SCLK MOSI/SPI VMISO 13
8 9 10 11 12
I MISO
H MOSI

SCLK

Note:
C MOSI becomes a bidirectional data pin when
FXAS21000 is operated in 3-wire SPI mode
with CTRL_REG0[SPIW] = 1.
Figure 4. SPI mode electrical connections
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1.4 Sensitive Axes Orientations and Polarities
A
+Ω
Z
+Ω
Y
F
X
A
S
2
1
0
0
0
+Ω
X
Figure 5. Reference frame for rotational measurement
3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014. 7
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Mechanical and Electrical Specifications
2 Mechanical and Electrical Specifications
2.1 Absolute Maximum Ratings
Absolute maximum ratings are the limits the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability. D
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. It is advised, however, that normal precautions be taken to avoid
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application of any voltages higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
V
logic voltage level (for instance, either GND or V ).
DD
Table 2. Absolute maximum ratings
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Rating SymHbol Min Max Unit
Supply voltage V –0.3 3.6 V
DD
Interface supply voltage V –0.3 V +0.3 V
DDIO DD
Input voltage on any control pin (SA0, SCL, SDA) C V –0.3 V +0.3 V
IN DDIO
Maximum Acceleration (all axes, 100 μs) g — 5000 g
max
Operating temperature T –40 +85 °C
OP
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Storage temperature T –40 +125 °C
STG
A
Table 3. ESD and latch-up protection characteristics
Rating Symbol Value Unit
Human body model (HBM) V ±2000 V
HBM
Machine model (MM) V ±200 V
MM
Charge device model (CDM) V ±500 V
CDM
Latch-up current at T = 85 °C I ±100 mA
LU
Caution
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
8 3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014.
Freescale Semiconductor, Inc.
Mechanical and Electrical Specifications
Caution
This is an ESD sensitive device, improper handling can cause permanent damage to the part.
2.2 Operating Conditions
Table 4. Nominal operating conditions
Rating Symbol Min Typ Max Unit
D
Supply voltage V 1.95 — 3.6 V
DD
Digital supply voltage V 1.62 — V + 0.3 V
DDIO DD
Digital high-level input voltage on SCL,
VIH 0.7 * V E— — V
SDA, SA0, I2C, RST_B DDIO
Digital low-level input voltage on SCL, SDA,
VIL — — 0.3 * V V
SA0, I2C, RST_B DDIO
V
Operating temperature T –40 +25 +85 °C
OP
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2.3 Mechanical Characteristics
C
Table 5. Mechanical characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
R
FS = 00 ±1600
FS = 01 ±800
Full-scale range FS — — dps
FS = 10 ±400
A
FS = 11 ±200
FS = 00 0.2
FS = 01 0.1
Sensitivity1 So — — dps/LSB
FS = 10 0.05
FS = 11 0.025
Sensitivity change vs.
TCS –40 °C ≤ T ≤ 85 °C — ±0.1 — %/°C
temperature
Factory calibrated, before
Initial zero-rate offset ZRO — ±100 — dps
board mount
Zero-rate offset change
TCO — — ±0.3 — dps/°C
vs. temperature
Cross axis sensitivity CAS — — ±1.5 — %
Nonlinearity NL — — ±1 — %FS
Self-test output change STOC — 50 — — LSB
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014. 9
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Mechanical and Electrical Specifications
Table 5. Mechanical characteristics (continued)
Parameter Symbol Test Conditions Min Typ Max Unit
Output data bandwidth BW — — ODR/2 — Hz
Noise density ND ODR = 100 Hz — 0.055 — dps/√Hz
Test conditions (unless otherwise noted):
• V = 2.5 V
DD
• T = 25 °C
1. Sensitivity based on XYZ output data registers that are 14-bit left justified data
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2.4 Electrical Characteristics
Table 6. Electrical characteristics E
Parameter Symbol Test conditions Min Typ Max Unit
Active Mode; Probe data V
Current consumption Idd on a trimmed oscillator — 5.8 — mA
Act
and iref
Supply current drain in I
Idd Standby mode — 2 — µA
Standby mode Stby
H
Supply current drain in
Idd Ready mode — 4.8 — mA
Ready mode Rdy
High-level output voltage
VOH IO = 50C0 µA 0.9 * V — — V
INT1, INT2 DDIO
Low-level output voltage
VOL IO = 500 µA — — 0.1 * V V
INT1, INT2 DDIO
R
Low-level output voltage
VOL IO = 500 µA — — 0.1 * V V
SDA SDA DDIO
Output data rate
ODR — — ±2.5 — % ODR
frequency tolerance ATOL
Signal bandwidth BW — — ODR/2 — Hz
Boot time from POR/Reset
T — — 16 — µs
to Standby mode boot
Turn-on time 1, Standby to
Ton1 — — 2/ODR + 250 — ms
Active mode transition
Turn-on time 2, Ready to
Ton2 — — 2/ODR + 10 — ms
Active mode transition
Test conditions (unless otherwise noted):
• V = 2.5 V
DD
• T = 25°C
10 3-Axis Digital Angular Rate Gyroscope, Rev1.3, 11/2014.
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