Fundamentals of Electronic Systems Design

251 Pages·2017·9.377 MB·English

by  Jens Lienig and Hans Bruemmer

Jens Lienig
Hans Bruemmer
Fundamentals
of Electronic
Systems Design
Fundamentals of Electronic Systems Design
Jens Lienig Hans Bruemmer
(cid:129)
Fundamentals of Electronic
Systems Design
123
Jens Lienig Hans Bruemmer
Electrical andComputer Engineering Springe, Niedersachsen
Dresden University of Technology Germany
Dresden,Sachsen
Germany
ISBN978-3-319-55839-4 ISBN978-3-319-55840-0 (eBook)
DOI 10.1007/978-3-319-55840-0
LibraryofCongressControlNumber:2017935558
©SpringerInternationalPublishingAG2017
Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeorpart
of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations,
recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission
orinformationstorageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilar
methodologynowknownorhereafterdeveloped.
The use of general descriptive names, registered names, trademarks, service marks, etc. in this
publicationdoesnotimply,evenintheabsenceofaspecificstatement,thatsuchnamesareexemptfrom
therelevantprotectivelawsandregulationsandthereforefreeforgeneraluse.
The publisher, the authors and the editors are safe to assume that the advice and information in this
book are believed to be true and accurate at the date of publication. Neither the publisher nor the
authorsortheeditorsgiveawarranty,expressorimplied,withrespecttothematerialcontainedhereinor
for any errors or omissions that may have been made. The publisher remains neutral with regard to
jurisdictionalclaimsinpublishedmapsandinstitutionalaffiliations.
Printedonacid-freepaper
ThisSpringerimprintispublishedbySpringerNature
TheregisteredcompanyisSpringerInternationalPublishingAG
Theregisteredcompanyaddressis:Gewerbestrasse11,6330Cham,Switzerland
Foreword
It is hard to underestimate the impact that electronic systems have on society.
My first portable radio was proudly marked “7 transistors.” Today, the electronic
systeminmypockethasover2trillion(2e12)transistors.Thereare20timesmore
transistors in my smartphone than there are stars in the Milky Way galaxy. This
unprecedentedscaleisenabledbytheexponentialself-fulfillingpromiseofMoore’s
law.Forover50years,thecomponentintegrationdensityhasbeendoublingevery
18–24months,while per-device cost wentdownatthesame rate. Inall ofhistory,
nootherindustriallawhasbeenasreliable,andnootherlawhasbeenasinfluential.
Moore’s law has fueled the PC revolution in the 1980s, the Internet in the 1990s,
the social media in the 2000s, the smartphone, and now the machine learning
revolution. New electronic systems extend our senses, helping us see, helping us
navigate, and helping us drive safely. The impact reaches beyond the gadgets:
Electronic systems affect the way everybody works and lives. It is even fueling
political revolutions, for better or for worse….
It is easily overlooked that Moore’s law implies that the human designers of
electronic systems need to improve theirproductivityat the same exponential rate.
EvenalargecompanylikeApplecouldnotaffordtodoublethesizeoftheirdesign
teameverytwoyearstokeepupwithdesignscale.TheA10chipintheiPhone7is
estimated to have 10(cid:1) the number of components as the A4 chip in the iPhone 4
just five years earlier. The size of the design team, however, remained roughly the
same.
It is no small achievement that electronic systems of this scale can be suc-
cessfully designed, engineered, and mass-produced. This book addresses the
engineering fundamentals behind the design process of effective and reliable
electronic systems. Both students and professionals alike will appreciate the con-
tents: The first because it sets up the fundamentals of the entire design process in
detail, and the latter because the book brings together state-of-the-art design skills
from the extensive experience of the authors.
Thefirstchaptersofthebookaddressthearchitectureandfundamentalstructure
ofthedesignprocessofelectronicsystems.Thatincludestheengineeringdecisions
onbreakingupthedesignintomoremanageablepartitions.Thismustbedoneina
v
vi Foreword
way that makes assembly straightforward and reliable. It must also be done while
taking into account the limitations of tools, physics, regulatory rules, and people.
The main thrust of this book is addressing ways to “tame” the physical effects
andcontroltheunwantedsideeffectsofthelarge-scaleintegration.Theobjectiveis
to make the system reliable in production and use, and to make it resilient against
external influences. The authors lay down thorough in-depth description of the
theory and practice of reliability engineering. After all, it is only as strong as the
weakest link.
A significant portion of this book addresses the heat that is dissipated in the
electronic system. This is a point where the steady progression of Moore’s law
poses atruechallenge,asthetransistor densitycontinuestoincreaseexponentially
while the per-transistor power does not decrease at the same rate. To keep the
device temperature under control, either the heat needs to be avoided or the heat
transfer rate needs to be maximized. The authors present the fundamentals on
assessing and optimizing heat flows of electronic systems.
There have been several occasions where products malfunction because of
electromagnetic interference. To avoid such design errors, this book provides an
excellent description on reducing such unwanted coupling of the system and the
environment. The clear set of guidelines and design recommendations is provided
to ruggedize the electronic system from the start.
Once an afterthought, minimizing the environmental impact of electronic sys-
tems is becoming a major design criterion. There are already billions of electronic
systemssurroundingus,mostofwhichhavearelativelyshortlifespan.Atthesame
time, the highly compact and integrated nature of electronic systems makes them
hardertoopenanddisassemble.Therefore,evensmalldesignimprovementsmatter.
An in-depths guide to addressing all environmental aspects during the full design
cycle is presented by the authors.
This unique book provides fundamental, complete, and indispensable informa-
tionregardingthedesignofelectronicsystems.Thistopichasnotbeenaddressedas
complete and thorough anywhere before. Since the authors are world-renown
experts,itisafoundationalreferencefortoday’sdesignprofessionals,aswellasfor
the next generation of engineering students.
Dr. Patrick Groeneveld
Scientist
Synopsys Inc., Mountain View, CA, USA
Preface
Ifyouhaveanextremepassionforproducinggreatproducts,
itpushesyoutobeintegrated…Ittakesalotofhardworkto
make something simple, to truly understand the underlying
challengesandcomeupwithelegantsolutions.
SteveJobs
We are rarely aware, in our daily use of smartphones, notebooks, etc., that the
developmentofmobileelectronicdevicesstartedonlyafewdecadesago.Afterthe
discovery of the transistor in 1948, the first integrated circuit was built in 1960,
followedbythemicroprocessorin1971.Thenin1973,Motoroladevelopedthefirst
prototypemobilephone,in1976,AppleComputerintroducedtheAppleI,andIBM
introducedtheIBMPCin1981.Thepopularityinthelate1990sofcellphonesand
increasingly powerful laptop computers foreshadowed the iPhones and iPads that
became ubiquitous at the turn of the century. We have truly become a society
immersed in mobile electronic devices.
The packaging density, i.e., the number of components per unit volume, has
increasedconsistentlythroughoutthisperiodandshowslittleindicationofslowing
down. The resulting amount of heat to be dissipated increased as well, putting the
spotlight on heat transfer issues. It further became obvious that the reliability, i.e.,
the function and durability of electronic components, depends greatly on temper-
ature. Another problem identified was the undesirable influence of switching
functions, caused by unwanted signals inside and outside packages. These issues
came under the heading of electronic systems design, which quickly became an
important interdisciplinary subdiscipline of electrical engineering.
Since the first appearance of mobile electronic devices, such as the transistor
radio in 1954, components have undergone massive development and miniatur-
ization; integrated circuits have reached unheard of complexity levels, and new
packaging methods coupled with computer-aided design (CAD) have revolution-
ized the design of electronic systems. More recently, recycling and environmental
requirements were also added to the mix. It is amazing to realize that every
smartphone today has more computing power than the on-board computer in
vii
viii Preface
Apollo 11, which transported the first humans to another astronomical object back
in 1969.
Thisbookaddressesthisenormousscientificprogressandoffersareviewofthe
current state of the art in the development of electronic systems. It is the result
of the extensive experience of its two authors in industry, academic research, and
teaching in electronic systems design. Its aim is to support the reader with the
development and fabrication of modern electronic devices, taking all relevant
aspectsintoconsiderationwithaclearpresentation oftheunderlyingtechnicaland
scientific principles. The book elucidates a broad range of techniques that have
helped keep German engineering at the cutting edge for several decades and will
continue to do so for decades to come.
A book of such considerable scope can never be accomplished by one indi-
vidual. The authors wish to express their warm appreciation and thanks to all who
helped produce this publication. We would like to mention in particular Martin
Forrestal for his key role in writing the English version of the book. Our warm
thanksgotoDr.MikeAlexanderwhohasgreatlyassistedinthepreparationofthe
English text. We also wish to sincerely thank the following for their support with
subsections of the manuscript: Dr. Alfred Kamusella (Sect. 2.6), Dr. Helmut Löbl
(Chap. 5), Prof. Stefan Dickmann and Dr. Ralf Jacobs (Chap. 6), Prof. Karl-Heinz
Gonschorek (Sect. 6.6), Prof. Günter Röhrs (Chap. 7), Steve Bigalke (Appendices
8.1 and 8.2), and Dr. Frank Reifegerste (Appendices 8.4 and 8.5). Thanks are also
duetoNicoleLowaryandCharlesB.Glaser ofSpringer for beingverysupportive
and going beyond their call of duty to help out with our requests.
Rapidprogresswillcontinuetobemadeinelectronicsystemsdesignintheyears
to come, perhaps by some of the readers of this humble book. The authors are
alwaysgratefulforanycommentsorideasforthefuturedevelopmentofthebook,
and wish you good luck in your careers.
Dresden, Germany Jens Lienig
Springe, Germany Hans Bruemmer
Contents
1 Introduction.... .... .... ..... .... .... .... .... .... ..... .... 1
2 Design Process and Its Fundamentals .... .... .... .... ..... .... 5
2.1 Life Cycle of Electronic Products. .... .... .... .... ..... .... 5
2.2 Design and Development Process. .... .... .... .... ..... .... 6
2.3 Guidance for Product Planning, Design and Development... .... 8
2.3.1 Planning Development Work.. .... .... .... ..... .... 10
2.3.2 Information Flow... .... .... .... .... .... ..... .... 10
2.3.3 Feasibility Study During Product Planning ... ..... .... 12
2.3.4 Task Definition and Conceptual Stage... .... ..... .... 12
2.3.5 Functional Specification . .... .... .... .... ..... .... 14
2.3.6 Scheduling... ..... .... .... .... .... .... ..... .... 15
2.4 Technical Drawings .. ..... .... .... .... .... .... ..... .... 17
2.5 Circuit Diagrams .... ..... .... .... .... .... .... ..... .... 22
2.6 Computer-Aided Design (CAD).. .... .... .... .... ..... .... 24
References.. .... .... .... ..... .... .... .... .... .... ..... .... 29
3 System Architecture and Protection Requirements.. .... ..... .... 31
3.1 Introduction—Terminology, Functions and Structures . ..... .... 31
3.1.1 System Characteristics of Devices.. .... .... ..... .... 32
3.1.2 System Environment.... .... .... .... .... ..... .... 32
3.1.3 System Functions .. .... .... .... .... .... ..... .... 33
3.1.4 System Structure... .... .... .... .... .... ..... .... 34
3.2 System Design Architecture . .... .... .... .... .... ..... .... 35
3.2.1 System Granularity . .... .... .... .... .... ..... .... 35
3.2.2 System Assembly .. .... .... .... .... .... ..... .... 36
3.2.3 System Integration in Environment. .... .... ..... .... 38
3.3 Electronic System Levels ... .... .... .... .... .... ..... .... 38
3.4 System Protection.... ..... .... .... .... .... .... ..... .... 39
3.4.1 CE Designation.... .... .... .... .... .... ..... .... 40
ix
x Contents
3.4.2 Protection Classes.. .... .... .... .... .... ..... .... 40
3.4.3 IP Codes of Enclosures.. .... .... .... .... ..... .... 42
References.. .... .... .... ..... .... .... .... .... .... ..... .... 43
4 Reliability Analysis .. .... ..... .... .... .... .... .... ..... .... 45
4.1 Introduction .... .... ..... .... .... .... .... .... ..... .... 45
4.2 Calculation Principles. ..... .... .... .... .... .... ..... .... 47
4.2.1 Probability Terminology . .... .... .... .... ..... .... 47
4.2.2 Reliability Terminology.. .... .... .... .... ..... .... 49
4.2.3 Reliability Parameters ... .... .... .... .... ..... .... 49
4.3 Exponential Distribution.... .... .... .... .... .... ..... .... 53
4.3.1 Reliability Distributions.. .... .... .... .... ..... .... 53
4.3.2 Reliability Parameters and the Exponential
Distribution.. ..... .... .... .... .... .... ..... .... 55
4.4 Failure of Electronic Components. .... .... .... .... ..... .... 56
4.4.1 Drift ... .... ..... .... .... .... .... .... ..... .... 57
4.4.2 Reference and Operating Conditions.... .... ..... .... 57
4.4.3 Failure Rates of Electronic Components . .... ..... .... 58
4.4.4 Derating .... ..... .... .... .... .... .... ..... .... 60
4.4.5 Accuracy of Failure Rates.... .... .... .... ..... .... 60
4.5 Failure of Electronic Systems.... .... .... .... .... ..... .... 62
4.5.1 Calculation Principles ... .... .... .... .... ..... .... 62
4.5.2 Network Modeling—Serial and Parallel Systems ... .... 63
4.6 Reliability Analysis of Electronic Systems.. .... .... ..... .... 64
4.6.1 Preliminaries. ..... .... .... .... .... .... ..... .... 64
4.6.2 Availability of Repairable Systems . .... .... ..... .... 65
4.6.3 Electronic Systems Without Redundancy—Serial
Systems. .... ..... .... .... .... .... .... ..... .... 66
4.6.4 Electronic Systems With Redundancy—Parallel
Systems. .... ..... .... .... .... .... .... ..... .... 68
4.6.5 Service and Maintenance of Electronic Systems .... .... 71
4.7 Recommendations for Improving Reliability of Electronic
Systems ... .... .... ..... .... .... .... .... .... ..... .... 72
References.. .... .... .... ..... .... .... .... .... .... ..... .... 73
5 Thermal Management and Cooling.. .... .... .... .... ..... .... 75
5.1 Introduction—Terminology, Temperatures, and Power
Dissipation . .... .... ..... .... .... .... .... .... ..... .... 76
5.1.1 Problem Definition . .... .... .... .... .... ..... .... 76
5.1.2 Important Parameters in Thermal Management..... .... 79
5.1.3 Temperatures of Components and Systems... ..... .... 82
5.1.4 Power Dissipation in Electronic Components . ..... .... 83
5.2 Calculation Principles. ..... .... .... .... .... .... ..... .... 84
5.2.1 Electrical and Thermal Networks... .... .... ..... .... 84